公开(公告)号：US20140029206A1

公开(公告)日：2014-01-30

申请号：US13610701

申请日：2012-09-11

Applicant: Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K7/02

CPC classification number: H05K1/18 ,  G06F1/1658 ,  G06K13/0825 ,  H04M2250/14 ,  H05K1/117 ,  H05K1/183 ,  H05K3/00 ,  H05K3/30 ,  H05K7/02 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09163 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

Abstract translation: 电子设备设置有可喷射部件组件。 每个可弹出的部件组件可以包括托盘，该托盘可以装载有一个或多个类型的可拆卸模块，例如mini-SIM卡和微型SIM卡，并插入到该装置中。 每个组件还可以包括联接到电路板的盖。 托盘可以插入电子设备中的开口并进入盖和电路板之间的空间。 空间的一部分被包含在口袋内。 当托盘插入设备中时，托盘的一部分可以容纳在口袋内，用于将模块保持在设备内的功能插入位置。

公开(公告)号：US07944707B2

公开(公告)日：2011-05-17

申请号：US12030565

申请日：2008-02-13

Applicant: Chih-pin Hung ,  Ying-te Ou

Inventor： Chih-pin Hung ,  Ying-te Ou

IPC: H05K1/18

CPC classification number: H05K1/117 ,  H01L23/13 ,  H01L23/5383 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2203/0307

Abstract: A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method.

Abstract translation: 公开了一种用于与输出/输入模块连接的封装结构。 封装结构可以应用于传统的多芯片封装和封装中的系统。 包装结构限定了垂直或水平设置的至少一个插入腔。 通过简单地将输出/输入模块插入到插入腔中，可以在输出/输入模块和封装结构之间建立电连接。 因此，如此构造的封装结构可以解决采用常规焊接连接方法的封装结构所遇到的电子部件的修理，更换和升级问题。

公开(公告)号：US20100294546A1

公开(公告)日：2010-11-25

申请号：US12470676

申请日：2009-05-22

Applicant: Sean Nickel ,  James Wahl

Inventor： Sean Nickel ,  James Wahl

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/403 ,  H01R12/53 ,  H01R12/58 ,  H05K3/3405 ,  H05K3/4614 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09454 ,  H05K2201/10287 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A printed circuit board includes a first layer including a groove formed therein. The groove extends between opposing face surfaces. A second layer is coupled with one face surface of the first layer. The second layer includes a through hole in communication with the groove of the first layer. A third layer is coupled to other face surface of the first layer opposite the second layer. Portions of the second and third layers cooperate with the groove and forming a cavity with an opening at the edge of the board. The cavity is accessible through the through hole of the second layer. A printed circuit board includes multiple layers which are coupled together. A wire is electronically coupled to the printed circuit board by being inserted into the cavity with solder applied via the through hole. An alternative embodiment utilizes two layers to define the board and cavity.

Abstract translation: 印刷电路板包括其中形成有凹槽的第一层。 凹槽在相对的表面之间延伸。 第二层与第一层的一个面表面结合。 第二层包括与第一层的凹槽连通的通孔。 第三层耦合到与第二层相对的第一层的另一面表面。 第二和第三层的一部分与凹槽配合并在板的边缘处形成具有开口的空腔。 空腔可通过第二层的通孔进入。 印刷电路板包括多个耦合在一起的层。 通过经由通孔施加的焊料将引线插入到空腔中，将电线电连接到印刷电路板。 替代实施例利用两层来限定板和空腔。

公开(公告)号：US07708565B2

公开(公告)日：2010-05-04

申请号：US11715196

申请日：2007-03-07

Applicant: Victor Bogdan Guja ,  Mauro Cerisola ,  Domenico Campi

Inventor： Victor Bogdan Guja ,  Mauro Cerisola ,  Domenico Campi

IPC: H01R12/00

CPC classification number: H01R12/62 ,  G02B6/4201 ,  G02B6/4274 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4284 ,  H04B10/40 ,  H04B10/801 ,  H05K1/0306 ,  H05K3/365 ,  H05K2201/09163 ,  H05K2201/0919

Abstract: An arrangement for connecting an electronic subassembly and an optical subassembly in an electro-optical communication device such as an electro-optical transceiver. The arrangement includes a body of a rigid dielectric material for mounting e.g. on the optical subassembly. The body has electrically conductive pathways provided thereon and includes a shaped portion providing a socket-like formation. At least one electrical contact element is coupled with e.g. the electronic subassembly. The electrical contact element is pluggable into the socket-like formation of the body of rigid dielectric material and includes an elastic device adapted to elastically co-operate with the socket-like formation of the body of rigid dielectric material to retain the electrical contact element plugged in the socket-like formation to provide electrical contact with the electrically conductive pathways provide thereon, while permitting vibrational displacement of the electrical contact element within the socket-like formation.

Abstract translation: 一种用于将电子组件和光学子组件连接在诸如电光收发器的电光通信设备中的装置。 该装置包括用于安装的刚性介电材料的主体。 在光学组件上。 主体具有设置在其上的导电通路，并且包括提供插座状结构的成形部分。 至少一个电接触元件与例如电连接。 电子组件。 电接触元件可插入到刚性介电材料本体的插座状结构中，并且包括弹性装置，其适于与刚性电介质材料体的套筒状结构弹性地协作以将电接触元件堵塞 在插座状结构中提供与其上提供的导电通路的电接触，同时允许电接触元件在插座状结构内的振动位移。

公开(公告)号：US20090215287A1

公开(公告)日：2009-08-27

申请号：US11918121

申请日：2006-07-06

Applicant: Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

Inventor： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC: H01R12/14

CPC classification number: H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract translation: 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20080218981A1

公开(公告)日：2008-09-11

申请号：US12030565

申请日：2008-02-13

Applicant: Chih-pin Hung ,  Ying-te Ou

Inventor： Chih-pin Hung ,  Ying-te Ou

IPC: H05K7/00

CPC classification number: H05K1/117 ,  H01L23/13 ,  H01L23/5383 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2203/0307

Abstract: A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method.

Abstract translation: 公开了一种用于与输出/输入模块连接的封装结构。 封装结构可以应用于传统的多芯片封装和封装中的系统。 包装结构限定了垂直或水平设置的至少一个插入腔。 通过简单地将输出/输入模块插入到插入腔中，可以在输出/输入模块和封装结构之间建立电连接。 因此，如此构造的封装结构可以解决采用常规焊接连接方法的封装结构所遇到的电子部件的修理，更换和升级问题。

公开(公告)号：US20080153319A1

公开(公告)日：2008-06-26

申请号：US12071330

申请日：2008-02-20

Applicant: Shinji Uchida ,  Hiroshi Yamane ,  Akihito Funakoshi ,  Kazuto Miura

Inventor： Shinji Uchida ,  Hiroshi Yamane ,  Akihito Funakoshi ,  Kazuto Miura

IPC: H01R12/00

CPC classification number: H01R12/79 ,  H05K3/365 ,  H05K2201/09163

Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal. The FPC can be connected to the printed wiring board on an edge surface thereof, allowing circuit elements to be mounted in high density, and improving freedom in designing wiring patterns.

公开(公告)号：US20070176613A1

公开(公告)日：2007-08-02

申请号：US11627844

申请日：2007-01-26

Applicant: Minoru Ogawa ,  Kazuto Nishimoto

Inventor： Minoru Ogawa ,  Kazuto Nishimoto

IPC: G01R31/02

CPC classification number: G02B6/138 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1533 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/186 ,  H05K3/365 ,  H05K3/386 ,  H05K3/4015 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/064 ,  H05K2201/09163 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract translation: 印刷电路板组件具有多个印刷电路板，它们被堆叠而彼此机械地和电连接，并且提供了将相邻的两个印刷电路板彼此连接的连接层。 连接层包括绝缘部分和导电部分。 绝缘部分包含绝缘部件并且粘附到相邻的两个印刷电路板中的每一个。 导电部分穿过绝缘部分并连接相邻的两个印刷电路板的电极端子。

公开(公告)号：US07227758B2

公开(公告)日：2007-06-05

申请号：US10624063

申请日：2003-07-21

Applicant: Scott D. Brandenburg ,  Thomas A. Degenkolb

Inventor： Scott D. Brandenburg ,  Thomas A. Degenkolb

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/4092 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

Abstract translation: 印刷电路板（PCB）组件包括PCB和从PCB的第一边缘延伸的第一集成导电总线结构。 PCB连接多个电子部件，并且包括多个导电层，每个导体层由非导电层隔开。 第一集成导电总线结构包括从PCB的第一边缘延伸并且形成连接器的多个电分离触点的第一部分。 总线结构的第二部分集成在PCB内，并且通过电镀孔将每个触点耦合到PCB的至少一个导电迹线。

公开(公告)号：US20060286858A1

公开(公告)日：2006-12-21

申请号：US10554744

申请日：2004-04-23

Applicant: Shinji Uchida ,  Junya Kajimoto ,  Akihito Funakoshi

Inventor： Shinji Uchida ,  Junya Kajimoto ,  Akihito Funakoshi

IPC: H01R12/24

CPC classification number: H01R12/721 ,  H01R12/774 ,  H01R12/79 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/09163 ,  H05K2201/09481

Abstract: A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrate 22 via an elastic member 23. In the exposed conductor part 2A, conductors 21 each having a protrusion 20 formed on a surface is placed on the insulating substrate. The exposed conductor part 2A can be elastically deformed in the thickness direction in which the substrate 22, the reinforcing plate 24 and the like are stacked. A printed wiring board 1 is constructed by stacking an inner layer board 10 and a first outer layer board 11 and a second outer layer board 12 which sandwich this inner layer board 10. A notched groove 10A is formed on the inner layer board 10, and an insertion opening 10B is formed. Through-hole ports 11 which appear on the notched groove 10A side is placed on the first outer layer board. When the FPC 2 is inserted into the insertion opening 10B, the protrusion 20 of the FPC 2 fits with the through-hole port 11A from within insertion opening 10B and presses thereto.

Abstract translation: 提供了能够进行高密度集成的印刷电路板的连接结构。 FCP2包括通过弹性构件23包括绝缘基板22和与该基板22堆叠的加强板24的露出的导体部分2A。 在暴露的导体部分2A中，在绝缘基板上放置各自具有形成在表面上的突起20的导体21。 暴露的导体部分2A可以在层叠基板22，加强板24等的厚度方向上弹性变形。 印刷电路板1通过层叠内层板10和夹着该内层板10的第一外层板11和第二外层板12而构成。 在内层板10上形成切口槽10A，形成插入口10B。 出现在切口槽10A侧的通孔11被放置在第一外层板上。 当FPC2插入到插入口10B中时，FPC2的突起20从插入开口10B内与通孔端口11A配合并将其按压。