中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

372 records (took 0.02 seconds)

    Assembly structure
    92.
    发明授权
    Assembly structure 有权
    装配结构

    公开(公告)号：US07745726B2

    公开(公告)日：2010-06-29

    申请号：US12125250

    申请日：2008-05-22

    Applicant: Ming-Te Lin ,  Chin-Yung Chen

    Inventor： Ming-Te Lin ,  Chin-Yung Chen

    IPC: H02G15/00 ,  H01R9/00

    CPC classification number: H05K3/361 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09418 ,  Y10T428/24752 ,  Y10T428/31504

    Abstract: An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.

    Abstract translation: 提供组装结构。 组装结构包括第一衬底，第二衬底和布置在第一和第二衬底之间的介质层。 所述介质层包括侧边缘，并且所述第二基板包括至少一根引线。 当第二基板设置在介质层上时，第二基板的引线相对于介质层的侧边缘倾斜。

    METHOD AND APPARATUS FOR REDUCING CAPACITOR GENERATED NOISE ON A PRINTED CIRCUIT BOARD
    93.
    发明申请
    METHOD AND APPARATUS FOR REDUCING CAPACITOR GENERATED NOISE ON A PRINTED CIRCUIT BOARD 有权
    在印刷电路板上减少电容器生成噪声的方法和装置

    公开(公告)号：US20100033938A1

    公开(公告)日：2010-02-11

    申请号：US12538399

    申请日：2009-08-10

    Applicant: Wataru Kitagawa ,  Shigeru Yuzawa

    Inventor： Wataru Kitagawa ,  Shigeru Yuzawa

    IPC: H05K1/18

    CPC classification number: H05K1/0231 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: Embodiments of the present invention provide an arrangement structure capable of reducing noise caused by a laminated ceramic capacitor mounted on a printed circuit board. A unit arrangement structure includes ceramic capacitors. Among the laminated ceramic capacitors, capacitors are arranged so that capacitor axes thereof extend along a first axis, while the other ceramic capacitors are arranged so that capacitor axes thereof extend along a second axis crossing the first axis. In accordance with such an arrangement structure, it is possible to effectively suppress noise even in the case of single-side mounting.

    Abstract translation: 本发明的实施例提供一种能够降低由安装在印刷电路板上的层叠陶瓷电容器引起的噪声的布置结构。 单元布置结构包括陶瓷电容器。 在层叠陶瓷电容器中，电容器被布置成使得其电容器轴线沿着第一轴线延伸，而其它陶瓷电容器被布置成使得其电容器轴线沿着与第一轴线交叉的第二轴线延伸。 根据这样的结构，即使在单面安装的情况下也能够有效地抑制噪音。

    OC2 ORIENTED CONNECTIONS 2
    95.
    发明申请
    OC2 ORIENTED CONNECTIONS 2 失效
    OC2定向连接2

    公开(公告)号：US20090207575A1

    公开(公告)日：2009-08-20

    申请号：US12197309

    申请日：2008-08-24

    Applicant: GABE CHERIAN

    Inventor： GABE CHERIAN

    IPC: H05K7/00 ,  H05K5/02 ,  H01R43/00

    CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L23/49555 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H05K1/111 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/29099 ,  H01L2224/05647 ,  H01L2924/00014

    Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

    Abstract translation: 本发明公开了可用于增强电子设备的可靠性和延长使用寿命的设计概念和方法和方法，以及包含这种设备的组件以及衬底和/或PCB，特别是如果这样的组件暴露于恶劣的环境条件 作为热循环或动力循环。 本发明的主要目的是在附接的部件之间提供诸如柱之类的柔性接头，并且优选地定向这些接头，使得它们向组件的热中心或固定点呈现其最柔软的弯曲方向。 具有矩形或细长横截面的接头是优选的，并且它们应该被定向成使得每个接头的宽面将面向热中心，垂直于从热中心朝向每个相应接头的中心发出的热变形射线。 这些概念同样适用于无引线封装以及引线封装。

    Electronic element module and electronic device using the same
    96.
    发明授权
    Electronic element module and electronic device using the same 有权
    电子元件模块和使用其的电子设备

    公开(公告)号：US07561437B2

    公开(公告)日：2009-07-14

    申请号：US11160393

    申请日：2005-06-22

    Applicant: Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

    Inventor： Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

    IPC: H05K7/00

    CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and a plurality of electronic elements. In one embodiment, the circuit board has a plurality of leg-holes. Each of the electronic elements includes a body and a plurality of legs that connected to the body. Wherein, the bodies of the electronic elements are glued each other, and the legs of the electronic elements are partially plugged in the leg-holes. In another one embodiment, the circuit board has a plurality of contacts. The electronic element is disposed on the circuit board with a gap therebetween. The electronic element has a plurality of terminals that electrically connect to the contacts of the circuit board correspondingly. Otherwise, the gap is filled with glue.

    Abstract translation: 提供一种电子元件模块和使用其的电子装置。 电子元件模块包括电路板和多个电子元件。 在一个实施例中，电路板具有多个腿孔。 每个电子元件包括主体和连接到主体的多个腿。 其中，电子元件的主体彼此粘合，并且电子元件的腿部分地插入到腿孔中。 在另一个实施例中，电路板具有多个触点。 电子元件设置在电路板上，其间具有间隙。 电子元件具有多个端子，其相应地电连接到电路板的触头。 否则，缝隙填充胶水。

    ELECTRICAL CONNECTOR SYSTEM WITH ORTHOGONAL CONTACT TAILS
    97.
    发明申请
    ELECTRICAL CONNECTOR SYSTEM WITH ORTHOGONAL CONTACT TAILS 有权
    具有正交接触尾部的电气连接器系统

    公开(公告)号：US20090117781A1

    公开(公告)日：2009-05-07

    申请号：US12186064

    申请日：2008-08-05

    Applicant: Douglas M. Johnescu ,  Steven E. Minich ,  Stephen B. Smith

    Inventor： Douglas M. Johnescu ,  Steven E. Minich ,  Stephen B. Smith

    IPC: H01R24/00 ,  H01R43/00

    CPC classification number: H01R13/6471 ,  H01R12/51 ,  H01R12/7082 ,  H01R12/71 ,  H01R13/514 ,  H01R13/6477 ,  H05K1/0245 ,  H05K1/116 ,  H05K3/325 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49222

    Abstract: Disclosed are electrical connectors and methods of assembling an electrical connector having “standard” (i.e., with electrical contacts having in-line tails), jogged (i.e., with electrical contacts having jogged tails but not connected orthogonally to another connector through a substrate), and/or “orthogonal” (i.e., with electrical contacts having jogged tails that are used in an orthogonal application) leadframe assemblies in the same connector. This provides the flexibility of using some of the available contacts in an orthogonal application and, at the same time, having remaining contacts available for routing on the midplane PCB. Though this could be done using only orthogonal leadframe assemblies, the combination of standard leadframe assemblies with orthogonal leadframe assemblies creates additional spacing between the PCB vias, so that signal traces can be more easily routed on the midplane PCB.

    Abstract translation: 公开了电连接器和组装电连接器的方法，即具有“标准”（即，具有线内尾部的电触头）的电连接器，具有点动（即，具有慢跑尾部的电触头但未通过基板与另一连接器正交连接） 和/或“正交”（即，具有在正交应用中使用的具有慢跑尾部的电触头）引线框组件在同一连接器中。 这提供了在正交应用中使用一些可用触点的灵活性，并且同时具有可用于在中板PCB上布线的剩余触点。 尽管这可以仅使用正交引线框架组件完成，标准引线框架组件与正交引线框架组合的组合在PCB通孔之间产生了额外的间隔，从而可以更容易地在中板PCB上布线信号迹线。

Patent Agency Ranking