公开(公告)号：US20170118842A1

公开(公告)日：2017-04-27

申请号：US14918678

申请日：2015-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bruce J. CHAMBERLIN ,  Andreas HUBER ,  Harald HUELS ,  Thomas STRACH ,  Thomas-Michael WINKEL

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/09 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/184 ,  B23K1/0016 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/111 ,  H05K1/113 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09345 ,  H05K2201/09381 ,  H05K2201/09518 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10174

Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

公开(公告)号：US09627784B1

公开(公告)日：2017-04-18

申请号：US14955466

申请日：2015-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H01R12/51 ,  H01R43/24 ,  H05K1/18 ,  H01R43/20 ,  H05K3/30 ,  H01R13/405

CPC classification number: H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US20170077801A1

公开(公告)日：2017-03-16

申请号：US15245178

申请日：2016-08-24

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Tetsuo YANAGIMOTO ,  Kenta SASAHARA

IPC: H02M1/44 ,  H05K1/02 ,  H02P27/06 ,  H03H1/00

CPC classification number: H02P27/06 ,  H02M1/126 ,  H02M1/14 ,  H02M7/003 ,  H05K1/0233 ,  H05K2201/1003

Abstract: A noise filter includes a magnetic core and a fixing member. The magnetic core includes a cylindrical integral body, and a wire is passed through the magnetic core. The fixing member is disposed inside the magnetic core and fixes the magnetic core to the wire.

Abstract translation: 噪声滤波器包括磁芯和固定构件。 磁芯包括圆柱形整体，并且导线穿过磁芯。 固定构件设置在磁芯内部并将磁芯固定到线上。

公开(公告)号：US20170063236A1

公开(公告)日：2017-03-02

申请号：US15352914

申请日：2016-11-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Alan ROTH ,  Eric SOENEN ,  Chaohao WANG

IPC: H02M3/158 ,  H01L23/00 ,  H01L49/02 ,  H01L23/522 ,  H05K1/18 ,  H05K1/11

CPC classification number: H02M3/158 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L28/10 ,  H01L28/40 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/29025 ,  H01L2224/2919 ,  H01L2224/32265 ,  H01L2224/4502 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0479 ,  H01L2924/048 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/10337 ,  H01L2924/10339 ,  H01L2924/10342 ,  H01L2924/10351 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14252 ,  H01L2924/1427 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H05K1/111 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A converter includes a plurality of active circuitry elements over a substrate. The converter further includes a passivation structure over the plurality of active circuitry elements, the passivation structure having at least one opening that is configured to expose at least one electrical pad of each active circuitry element. The converter further includes a plurality of passive electrical components over the passivation structure, wherein each passive electrical component is selectively connectable with at least one other passive electrical component, and a first side of each passive electrical component is electrically coupled to an electrical pad of each of at least two active circuitry elements. The converter further includes a plurality of electrical connection structures, wherein a first electrical connection structure electrically couples an electrical pad of a first active circuitry element to a corresponding passive electrical component, and the first electrical connection structure is completely within the passivation structure.

Abstract translation: A转换器包括在衬底上的多个有源电路元件。 该转换器还包括多个有源电路元件上的钝化结构，该钝化结构具有至少一个开口，其被配置为暴露每个有源电路元件的至少一个电焊盘。 转换器还包括钝化结构上的多个无源电部件，其中每个无源电部件可选择地与至少一个其它无源电部件连接，并且每个无源电部件的第一侧电耦合到每个无源电部件的电焊盘 至少两个有源电路元件。 转换器还包括多个电连接结构，其中第一电连接结构将第一有源电路元件的电焊盘电耦合到相应的无源电组件，并且第一电连接结构完全在钝化结构内。

公开(公告)号：US20170042034A1

公开(公告)日：2017-02-09

申请号：US15305962

申请日：2015-04-21

Applicant: Cornell University

Inventor： Robert MACCURDY ,  Hod LIPSON

IPC: H05K1/18 ,  B29C65/16 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H05K3/12 ,  H05K3/30 ,  H01L23/538 ,  H01L25/11 ,  H01L25/18 ,  H01L21/56 ,  H01L21/67 ,  H05K1/11 ,  H05K3/28 ,  H01L25/00 ,  B29C67/00

CPC classification number: H05K1/185 ,  A61B17/50 ,  B29C64/00 ,  B29C65/16 ,  B29L2031/34 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L21/67115 ,  H01L21/67132 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/112 ,  H01L25/18 ,  H01L25/50 ,  H01L27/01 ,  H01L27/13 ,  H05K1/0287 ,  H05K1/113 ,  H05K1/115 ,  H05K1/117 ,  H05K1/14 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/125 ,  H05K3/284 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4673 ,  H05K3/4697 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1327

Abstract: A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.

Abstract translation: 一种混合添加剂制造方法，其包括从模块库中选择的模块的三维（3D）打印和放置以制造机电组件。 通过机电组件的制造，产生了组件的机械特性和电气特性。 本发明克服了当前可印刷电子方法的材料和工艺限制，从而能够制造完整的复杂机电组件。

公开(公告)号：US09559047B2

公开(公告)日：2017-01-31

申请号：US13654447

申请日：2012-10-18

Applicant: Infineon Technologies Austria AG

Inventor： Martin Standing ,  Milko Paolucci

IPC: H01L21/50 ,  H01L23/498 ,  H01L23/367 ,  H01L25/16 ,  H05K1/02 ,  H01L23/36 ,  H05K1/18

CPC classification number: H01L23/49822 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

Abstract translation: 器件和技术的代表性实现提供了设置在分层印刷电路板（PCB）内的芯片芯片的改进的热性能。 无源元件可以策略地位于PCB的一个或多个表面上。 无源部件可以被布置成将由芯片管芯产生的热量从芯片管芯移出。

公开(公告)号：US20170018351A1

公开(公告)日：2017-01-19

申请号：US15208882

申请日：2016-07-13

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masuo YATABE ,  Kozue IMAIZUMI ,  Noriyuki MABUCHI ,  Kazuhiko OYAMA

IPC: H01F27/29 ,  H05K1/18 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F27/2804 ,  H01F2027/2809 ,  H05K3/3431 ,  H05K2201/0792 ,  H05K2201/1003 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: One object is to compensate the reduction of the Q value due to reduction of core sectional area of a coil of an inductor, and the reduction of positional accuracy and adhesive strength of components mounted on a printed circuit board due to reduction of area of external electrodes, both caused by downsizing of component sizes. An inductor is provided which includes: a coil formed in an insulator and having one end and the other end thereof formed in a direction away from a mounting surface; and lead-out portions connected to the coil at positions more distant from the mounting surface than a portion of the coil closest to the mounting surface.

Abstract translation: 一个目的是为了补偿由于电感器线圈的芯截面积的减小引起的Q值的降低，以及由于外部电极的面积的减小而安装在印刷电路板上的部件的位置精度和粘合强度的降低 都是由于组件尺寸的缩小造成的。 提供一种电感器，其包括：形成在绝缘体中的线圈，并且其一端和另一端沿远离安装表面的方向形成; 以及与最靠近安装表面的线圈的一部分相比，在与安装表面更远的位置连接到线圈的引出部分。

公开(公告)号：US20170006704A1

公开(公告)日：2017-01-05

申请号：US15195134

申请日：2016-06-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshimasa YOSHIOKA ,  Kenji NISHIYAMA ,  Daisuke TAKAGI

IPC: H05K1/18 ,  H01F27/28 ,  H01F27/24

CPC classification number: H05K1/18 ,  G07D7/164 ,  H01F3/08 ,  H01F5/003 ,  H01F27/292 ,  H05K2201/1003

Abstract: A coil component includes a mounting surface that is a side mounted on a mounting board and a detecting surface that is a side generating a magnetic field to detect a distance from a detected conductor. The coil component has a coil conductor formed into a spiral shape, and a magnetic resin disposed on the mounting surface side of the coil conductor without being disposed on the detecting surface side of the coil conductor.

Abstract translation: 线圈部件包括作为安装在安装板上的一侧的安装表面和作为检测与检测到的导体的距离的产生磁场的一侧的检测表面。 线圈部件具有形成为螺旋状的线圈导体，以及设置在线圈导体的安装面侧的磁性树脂，不设置在线圈导体的检测面侧。

公开(公告)号：US20160379784A1

公开(公告)日：2016-12-29

申请号：US15125123

申请日：2014-03-11

Applicant: SHENZHEN ZHIYOU BATTERY INTEGRATION TECHNOLOGY CO., LTD

Inventor： Shugang GONG

IPC: H01H50/04 ,  H05K5/02 ,  H05K5/00 ,  H01H50/10 ,  H05K1/18

CPC classification number: H01H50/047 ,  H01H1/5805 ,  H01H50/041 ,  H01H50/10 ,  H01H51/281 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0217 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10196 ,  H05K2201/10219 ,  Y02P70/611

Abstract: A reed switch relay comprises a PCB base (1) and a control assembly (2) electrically connected to the PCB base. The control assembly is mounted on the PCB base by a surface mount technology. The control assembly comprises a hollow coil (21) mounted on the PCB base, a reed switch (22) mounted in the hollow coil, and a shield layer (23) sleeving the outer surface of the hollow coil, the reed switch comprises pins, the shield layer is connected with the pins of the reed switch. In the reed relay, the control assembly is mounted on the PCB base though a surface mount technology, which ensures position tolerance and precision of the reed switch, implements full mechanization of product production, increases productivity, and satisfies requirements of mass production, thereby increasing economic benefits.

Abstract translation: 簧片开关继电器包括PCB基座（1）和电连接到PCB基座的控制组件（2）。 控制组件通过表面贴装技术安装在PCB基座上。 控制组件包括安装在PCB基座上的中空线圈（21），安装在中空线圈中的舌簧开关（22）和套在中空线圈外表面上的屏蔽层（23），舌簧开关包括销， 屏蔽层与舌簧开关的引脚连接。 在簧片继电器中，控制组件通过表面贴装技术安装在PCB基座上，确保了簧片开关的位置公差和精度，实现产品生产的全面机械化，提高生产率，满足批量生产要求，从而增加 经济效益

公开(公告)号：US20160286658A1

公开(公告)日：2016-09-29

申请号：US15178686

申请日：2016-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masashi MATSUBARA

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/0052 ,  B28B11/14 ,  B28B11/243 ,  B28B17/0018 ,  B32B18/00 ,  C04B2237/64 ,  C04B2237/68 ,  H01L2224/97 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K3/007 ,  H05K3/303 ,  H05K3/4629 ,  H05K3/4644 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2203/0228

Abstract: In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.

Abstract translation: 在陶瓷基板和模块部件的制造方法中，在预定位置切割未烧成的母体陶瓷基板，分割成分离的未烧结陶瓷基板。 将未切割的未烧母母基板按压使其平行或基本平行于其主表面施加压力，使得在切割步骤中产生的横截面端面相连接。 烧结由包含由横截面端面的接合而形成的端面接合部的未烧制的母材陶瓷基板。 烧成的母体陶瓷衬底沿着端面接合部分断开，将其分成单独的陶瓷衬底。