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Patent Agency Ranking
公开(公告)号：US20160270240A1
公开(公告)日：2016-09-15
申请号：US15158831
申请日：2016-05-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas-Michael WINKEL
CPC classification number: H05K3/3494 , B23K1/0016 , B23K11/002 , H05K1/111 , H05K1/115 , H05K3/3421 , H05K2203/1115 , H05K2203/163 , Y10T29/49124 , Y10T29/49126 , Y10T29/53174
Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path, wherein the solder paste bead undergoes a soldering process facilitated by the electrical resistive heating, wherein a temperature of the solder paste bead is being evaluated, wherein the electrical resistive heating is adjusted according to the temperature of the solder paste bead.
Abstract translation: 制造产品，其中所述产品包括第一部分和第二部分，其中所述第一部分包括焊接引脚，并且所述第二部分包括焊料焊盘，其中每个所述焊接引脚具有匹配的焊盘，其中每个所述焊盘为 被匹配的焊膏珠覆盖。 将焊料对准焊盘，使焊锡销和匹配的焊锡焊盘通过匹配的焊膏珠热电连接。 将配合连接器连接到第一部件，其中配合连接器可操作以提供导电路径的一部分。 通过电阻加热来加热至少一个焊膏珠，其中电阻加热由流过导电路径的电流产生，其中焊膏珠经历由电阻加热促进的焊接工艺，其中 正在评估焊膏珠的温度，其中根据焊膏珠的温度调节电阻加热。
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公开(公告)号：US20180139851A1
公开(公告)日：2018-05-17
申请号：US15871595
申请日：2018-01-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas-Michael WINKEL
CPC classification number: H05K3/3494 , B23K1/0016 , B23K11/002 , H05K1/111 , H05K1/115 , H05K3/3421 , H05K2203/1115 , H05K2203/163 , Y10T29/49124 , Y10T29/49126 , Y10T29/53174
Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.
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公开(公告)号：US20170118844A1
公开(公告)日：2017-04-27
申请号：US15175378
申请日：2016-06-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas STRACH , Thomas-Michael WINKEL
CPC classification number: H05K1/184 , B23K1/0016 , H05K1/0298 , H05K1/092 , H05K1/111 , H05K1/113 , H05K1/116 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K1/186 , H05K3/0047 , H05K3/3447 , H05K3/429 , H05K3/46 , H05K3/4644 , H05K3/4697 , H05K2201/093 , H05K2201/09309 , H05K2201/09327 , H05K2201/09345 , H05K2201/09381 , H05K2201/09518 , H05K2201/09545 , H05K2201/096 , H05K2201/09845 , H05K2201/10 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10174
Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.
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公开(公告)号：US20180139852A1
公开(公告)日：2018-05-17
申请号：US15351066
申请日：2016-11-14
Applicant: International Business Machines Corporation
Inventor： Bruce J. CHAMBERLIN , Scott B. KING , Joseph KUCZYNSKI , David J. RUSSELL
CPC classification number: H05K3/4076 , H05K1/09 , H05K1/116 , H05K3/002 , H05K3/0038 , H05K3/0047 , H05K3/22 , H05K3/422 , H05K3/429 , H05K3/4644 , H05K2201/0166 , H05K2201/0209 , H05K2201/0347 , H05K2201/09372 , H05K2201/095 , H05K2201/09581 , H05K2203/0723 , H05K2203/0793 , H05K2203/10 , H05K2203/11 , H05K2203/1184
Abstract: In some embodiments, methods include drilling one or a plurality of PTHs with any industrial grade drill to fabricate holes with positive etch back, flooding the PTHs with a dilute solution of an acrylate monomer/oligomer containing an appropriate level of peroxide initiator, polymerizing the acrylate, and then rising the PTHs with the solvent used in the formulation of the acrylate material. In one embodiment, the printed circuit board may include a substrate comprising a plurality of metal layers separated by a plurality of insulating layers; a plurality of plated through holes formed in the substrate, each plated through hole comprising: recesses formed at each insulating layer, copper lands between the recesses, a polymer coating in each recess, and a metal layer lining the plated through hole.
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公开(公告)号：US20170118842A1
公开(公告)日：2017-04-27
申请号：US14918678
申请日：2015-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas STRACH , Thomas-Michael WINKEL
CPC classification number: H05K1/184 , B23K1/0016 , H05K1/0298 , H05K1/092 , H05K1/111 , H05K1/113 , H05K1/116 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K1/186 , H05K3/0047 , H05K3/3447 , H05K3/429 , H05K3/46 , H05K3/4644 , H05K3/4697 , H05K2201/093 , H05K2201/09309 , H05K2201/09327 , H05K2201/09345 , H05K2201/09381 , H05K2201/09518 , H05K2201/09545 , H05K2201/096 , H05K2201/09845 , H05K2201/10 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10174
Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.
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