公开(公告)号：US06459048B1

公开(公告)日：2002-10-01

申请号：US09598692

申请日：2000-06-21

Applicant: Kenichi Sakai ,  Kenichi Kotani

Inventor： Kenichi Sakai ,  Kenichi Kotani

IPC: H01R909

CPC classification number: H05K3/3442 ,  H05K2201/10068 ,  H05K2201/2081 ,  Y02P70/613 ,  Y10T29/42

Abstract: A surface-mount electronic component includes a terminal electrode film that is formed by various film-forming processes on the surface of a main unit of the surface-mount electronic component. A lead-in terminal extends from an internal electrode and is arranged in the surface-mount electronic component so as to extend up to the surface of the main unit for establishing electrical connection between the internal electrode and the terminal electrode film. In the surface-mount electronic component, the lead-in terminal of the internal electrode extends to at least one of the surfaces of the main unit, except a surface-mount surface of the main unit and the surface that is opposite to the surface-mount surface. An exposed portion of the lead-in terminal is coated by at least one of the terminal electrode film and a protective film.

Abstract translation: 表面安装电子部件包括在表面安装电子部件的主体的表面上由各种成膜工艺形成的端子电极膜。 导入端子从内部电极延伸并且布置在表面安装电子部件中，以便延伸到主单元的表面，以建立内部电极和端子电极膜之间的电连接。 在表面安装电子部件中，内部电极的引入端子延伸到主单元的至少一个表面，除了主单元的表面安装表面和与表面安装电子部件相对的表面之外， 安装面。 引入端子的暴露部分由端电极膜和保护膜中的至少一个涂覆。

公开(公告)号：US6046409A

公开(公告)日：2000-04-04

申请号：US31074

申请日：1998-02-26

Applicant: Tetsuya Ishii ,  Hiroshi Katagiri ,  Tadashi Shingaki ,  Tatsuya Takemura

Inventor： Tetsuya Ishii ,  Hiroshi Katagiri ,  Tadashi Shingaki ,  Tatsuya Takemura

IPC: H01G4/40 ,  H01L27/01 ,  H01P7/00 ,  H01P7/08 ,  H03H5/02 ,  H03H7/01 ,  H03H7/09 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/11 ,  H03H3/02

CPC classification number: H01P7/084 ,  H05K1/0243 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K3/3442

Abstract: A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.

Abstract translation: 一种多层微电子电路，其直接安装在基板上并用作例如谐振器。 多层微电子电路包括多个介质层和图案化电极，它们彼此层叠以形成层压结构，电介质层和图案化电极形成电路。 层叠结构具有沿着电介质层和图案化电极层叠的方向延伸的侧面。 输入线形成在一个侧面并与电路的输入部分连接。 输出线形成在一个侧表面并与电路的输出部分相连接。 在一个侧面形成接地线，并与电路的接地部连接。 另外，形成在一个侧表面上用于连接电路的部分的信号线。 信号线具有位于多个微电子电路直接安装在基板上的安装表面附近的端部，其中信号线的端部与安装表面分离，从而与基板电绝缘。

公开(公告)号：US5650755A

公开(公告)日：1997-07-22

申请号：US617249

申请日：1996-03-18

Applicant: Branko Avanic ,  Anthony J. Suppelsa ,  David C. Everest, III

Inventor： Branko Avanic ,  Anthony J. Suppelsa ,  David C. Everest, III

IPC: H03B1/04 ,  H05K1/02 ,  H05K1/14 ,  H05K5/00 ,  H03B1/00

CPC classification number: H05K5/0095 ,  H03B1/04 ,  H05K1/0243 ,  H05K1/141 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10492

Abstract: A voltage controlled oscillator module assembly (300) minimizes microphonics in a low profile package. Included within the module (300) are a substrate (302), VCO circuitry (308), and a ground shield (314) encapsulating the VCO circuitry. Included within the VCO circuitry (308) is at least one resonator (310) which is solderable on at least two of its surfaces. One surface of the resonator (310) is soldered to the substrate (302) while another surface of the resonator is soldered to the shield (314). An improved ground is thus provided to the resonator (310) which reduces the occurrences of microphonics while providing a low profile package for the module (300).

Abstract translation: 电压控制振荡器模块组件（300）使薄型封装中的微谐音最小化。 包括在模块（300）内的是衬底（302），VCO电路（308）和封装VCO电路的接地屏蔽（314）。 包括在VCO电路（308）内的至少一个谐振器（310）可在其至少两个表面上焊接。 谐振器（310）的一个表面被焊接到基板（302），而谐振器的另一表面被焊接到屏蔽（314）。 因此，向谐振器（310）提供改进的接地，从而减少了麦克风的发生，同时为模块（300）提供了低调的封装。

公开(公告)号：US5642265A

公开(公告)日：1997-06-24

申请号：US346499

申请日：1994-11-29

Applicant: Robert H. Bond ,  Harry M. Siegel

Inventor： Robert H. Bond ,  Harry M. Siegel

IPC: H01L23/58 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/10 ,  H05K7/02

CPC classification number: H05K3/301 ,  H01L23/58 ,  H05K1/181 ,  H05K7/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K2201/10037 ,  H05K2201/10068 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/325 ,  Y02P70/611 ,  Y10T29/49144

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract translation: 一种用于封装集成电路部件的系统，包括具有耦合到所述衬底的多个焊球的球栅阵列衬底。 半导体器件安装在衬底上并电耦合到焊球。 一个或多个端子耦合到衬底并电耦合到所述半导体器件。 可拆卸模块包含辅助部件。 模块包括用于容纳部件的主体部分和用于与各个端子配合的一个或多个电连接器，以将模块保持在基板上，并将部件与半导体器件电耦合。 端子也可以连接到焊球，使得部件可以可选地设置在电路板上或可拆卸模块中。

公开(公告)号：US5572175A

公开(公告)日：1996-11-05

申请号：US509332

申请日：1995-07-31

Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

Abstract: A dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting a signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Abstract translation: 电介质谐振元件包括至少一个电介质多级谐振器，其包括一个介质块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体， 导电体覆盖一个介质块的基本上整个的外表面，电介质多级谐振器在该介电块中构成多个介质谐振器; 以及固定地安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

公开(公告)号：US5487211A

公开(公告)日：1996-01-30

申请号：US109222

申请日：1993-08-19

Applicant: Kevin L. Haas ,  Ken A. Haas ,  Kimber J. Vought

Inventor： Kevin L. Haas ,  Ken A. Haas ,  Kimber J. Vought

IPC: H03H9/05 ,  H03H9/13 ,  H04R17/10 ,  H05K1/02 ,  H05K3/34 ,  H01L41/04 ,  H03H3/02

CPC classification number: H05K3/3442 ,  H03H9/0509 ,  H03H9/0514 ,  H04R17/10 ,  H05K1/0243 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/42

Abstract: A surface-mountable crystal resonator (100) is provided in the following manner. A first predetermined electrode pattern (105) and a second predetermined electrode pattern (201) are formed on a first major surface (104) and a second major surface (200), respectively, of a piezoelectric crystal substrate (101). Additionally, a first predetermined attachment electrode pattern (106), electrically coupled to the second predetermined attachment electrode pattern, and a second predetermined attachment electrode pattern (202), electrically coupled to the first predetermined attachment electrode pattern, are formed on a first attachment area (102) and a second attachment area (103), respectively. The first and second attachment areas include extensions (107) that, when mounted, allow a conductive adhesive (301), placed on a mounting substrate (300), to flow and establish electrical connections with the first and second predetermined attachment electrode patterns.

Abstract translation: 以下列方式提供表面安装晶体谐振器（100）。 分别在压电晶体基板（101）的第一主表面（104）和第二主表面（200）上形成第一预定电极图案（105）和第二预定电极图案（201）。 另外，电耦合到第二预定附接电极图案的第一预定附接电极图案（106）和电耦合到第一预定附接电极图案的第二预定附接电极图案（202）形成在第一附接区域 （102）和第二附接区域（103）。 第一和第二附接区域包括延伸部（107），其在安装时允许放置在安装基板（300）上的导电粘合剂（301）流动并建立与第一和第二预定附接电极图案的电连接。

公开(公告)号：US5101177A

公开(公告)日：1992-03-31

申请号：US635015

申请日：1990-12-28

Applicant: Hidehiko Norimatsu

Inventor： Hidehiko Norimatsu

IPC: H03B1/00 ,  H03B5/18 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/025 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: A voltage-controlled oscillator (VCO) mounted on a laminated printed circuit board which has a surface layer, a plurality of intermediate layers, and a back layer. Various component parts of the VCO are arranged on the surface layer. One of the intermediate layers which underlies the surface layer constitutes a ground potential layer and is removed at locations thereof corresponding to the area where the parts of the VCO are positioned.

公开(公告)号：US4821007A

公开(公告)日：1989-04-11

申请号：US11972

申请日：1987-02-06

Applicant: Walter D. Fields ,  Gary K. Larkins

Inventor： Walter D. Fields ,  Gary K. Larkins

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01P3/085 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/0237 ,  H05K2201/0715 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/429 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An improved strip line component and method of manufacture are disclosed that permit strip line circuits to be packaged in component form and to be soldered directly to conventional circuit boards. Electrical contact pads are formed on the side of the strip line component during fabrication by drilling holes through the multilayer laminar assembly and plating the holes with a conductive material. The laminar assembly is then cut along lines that intersect the holes, thereby exposing plated indentations along the sides of the cut component. The component so cut can then be soldered to a circuit board using the plated indentations. The method is well adapted to the economical manufacture of large numbers of identical components.

Abstract translation: 公开了一种改进的带状线部件和制造方法，其允许带状线路电路以部件形式封装并直接焊接到常规电路板。 电气接触垫通过在多层层状组件中钻孔并用导电材料电镀孔而在制造期间在带状部件的侧面上形成。 然后沿着与孔相交的线切割层状组件，从而沿着切割部件的侧面暴露镀敷的凹陷。 然后可以使用镀层压痕将如此切割的部件焊接到电路板上。 该方法很好地适应于大量相同组件的经济生产。