公开(公告)号：US20100253155A1

公开(公告)日：2010-10-07

申请号：US12418764

申请日：2009-04-06

Applicant: Shao-Feng LU

Inventor： Shao-Feng LU

IPC: H02J4/00

CPC classification number: H05K7/1432 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/142 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10333 ,  H05K2201/10409

Abstract: A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided.

Abstract translation: 一种用于在电源中传输的结构，特别是用于承载大直流电流的用于传输的电力结构，其中电源包括用于连接到DC输入电力的电力输入端口和用于转换DC输入电力的DC / DC转换电路 进入直流输出电源。 所述架构包括至少一个用于布置所述电力输入端口的电力传输板，其中所述电力传输板通过至少一个电力传导元件安装在其上的DC / DC转换电路电连接到所述电力处理板。 因此，通过代替大直径的常规连接线的电力传导元件来连接电力输入端口和电源处理板，而不违背安全规定，不仅可以减少弯曲的连接线所占据的空间，而且可以减少碰撞和 也可以避免对其引起的其他成分的损害。

公开(公告)号：US20080211091A1

公开(公告)日：2008-09-04

申请号：US12052863

申请日：2008-03-21

Applicant: Alfred Kemper ,  Guido Strotmann

Inventor： Alfred Kemper ,  Guido Strotmann

IPC: H01L23/48 ,  B23K20/10

CPC classification number: H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/4853 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48458 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0285 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.

Abstract translation: 一种用于生产功率半导体模块的方法，包括通过超声波焊接形成作为超声波焊接接点的接触区域和接触元件之间的接触。 超声波焊接操作也用于将接触区域与接触端部接合，并且因此用于接合触头和脚部区域。

公开(公告)号：US20080128158A1

公开(公告)日：2008-06-05

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card comprising conductors that run on and/or in the circuit board or card between connection points. In order to improve circuit boards of this type, the invention provides for at least one of the conductors to have a rectangular or square cross-section.

Abstract translation: 本发明涉及一种线印刷电路板或卡，其包括在连接点之间在电路板或卡上延伸和/或运行的导体。 为了改进这种类型的电路板，本发明提供至少一个导体具有矩形或正方形的横截面。

公开(公告)号：US20080084674A1

公开(公告)日：2008-04-10

申请号：US11951095

申请日：2007-12-05

Applicant: Kia Silverbrook ,  Norman Berry ,  Garry Jackson ,  Akira Nakazawa

Inventor： Kia Silverbrook ,  Norman Berry ,  Garry Jackson ,  Akira Nakazawa

IPC: H05K1/14

CPC classification number: B41J2/14427 ,  B41J2/155 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H01R12/721 ,  H01R12/79 ,  H01R13/2414 ,  H01R13/6315 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/1028 ,  H05K2201/10424

Abstract: A printed circuit board (PCB) assembly has a number of modular printhead controller printed circuit board (PCB), Electrical connector assemblies operatively connect respective PCBs to each other. Each connector assembly has a connecting member with a series of parallel spaced conducting strips. Each member is shaped and configured for fitment into a cavity defined by the raised and recessed portions of two abutting supports to connect the connecting strips of two PCBs via said conducting strips. Each PCB is mounted to a respective modular support that defines a raised portion and a recessed portion at an end thereof. The PCBs each have electrical connecting strips which overlie the respective recessed portions.

Abstract translation: 印刷电路板（PCB）组件具有多个模块化的打印头控制器印刷电路板（PCB），电连接器组件可操作地将相应的PCB彼此连接。 每个连接器组件具有连接构件，其具有一系列平行隔开的导电条。 每个构件被成形和构造成用于装配到由两个邻接支撑件的凸起和凹陷部分限定的空腔中，以经由所述导电条连接两个PCB的连接条。 每个PCB被安装到相应的模块化支撑件，该支撑件在其一端限定凸起部分和凹陷部分。 PCB各自具有覆盖相应凹部的电连接条。

公开(公告)号：US07352601B1

公开(公告)日：2008-04-01

申请号：US10997515

申请日：2004-11-24

Applicant: Michael Paul Minneman ,  Michael Crawford

Inventor： Michael Paul Minneman ,  Michael Crawford

IPC: H01R13/66 ,  H01R24/00 ,  H01R33/00

CPC classification number: H05K1/181 ,  H05K1/0284 ,  H05K1/117 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0278 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10159 ,  H05K2201/1028 ,  Y02P70/611

Abstract: A memory device for interconnection with a Universal Serial Bus (USB) Series A type receptacle of an electronic device includes a housing wherein the housing is largely rectangular, with the width and height of a USB Series A plug standard housing; a connector within the housing, electrical terminals in the housing; the housing and terminals of a form to connect with a USB Series A receptacle of an electronic device; and a data memory and a controller within the housing. The memory device may be used in combination with a portable computing device or peripheral or with a cell phone, gps or other electrical or electronic device that includes a receptacle to house the memory device of the type disclosed herein, wherein the memory device is largely within the electrical or electronic device. A method of transporting data between a peripheral and a computer (or processor) includes storing data in a portable memory device directly using a computer or a peripheral; transporting the portable memory device to the other of such a computer or a peripheral; and delivering data from the portable memory device directly to such other computer or peripheral, said delivering being while the portable memory device is largely within the peripheral during use of the peripheral.

Abstract translation: 用于与通用串行总线（USB）系列互连的存储器装置电子设备的A型插座包括壳体，其中壳体大体上是矩形的，具有USB A系列插头标准外壳的宽度和高度; 壳体内的连接器，壳体中的电气端子; 用于与电子设备的USB系列A插座连接的形式的外壳和终端; 以及数据存储器和壳体内的控制器。 存储设备可以与便携式计算设备或外围设备或者与蜂窝电话，GPS或其他电气或电子设备组合使用，其包括用于容纳本文公开的类型的存储设备的插座，其中存储器设备在很大程度上在 电气或电子设备。 在外围设备和计算机（或处理器）之间传送数据的方法包括使用计算机或外围设备直接将数据存储在便携式存储设备中; 将便携式存储设备传送到这种计算机或外围设备的另一个; 并且将数据从便携式存储设备直接传送到这样的其他计算机或外围设备，所述传送是在便携式存储设备在外围设备的使用期间大部分在外围设备内。

公开(公告)号：US20070228529A1

公开(公告)日：2007-10-04

申请号：US11702166

申请日：2007-02-05

Applicant: Satoshi Oe

Inventor： Satoshi Oe

IPC: H01L23/495

CPC classification number: H05K3/3405 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2224/16225 ,  H05K3/222 ,  H05K3/3468 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2203/173

Abstract: A mounting substrate including an interconnection provided on a front surface of a substrate, a lead pad provided separately from the interconnection, on the front surface of the substrate and, a lead connected to the lead pad by solder, and a connecting portion that connects the interconnection and the lead pad after the lead is connected.

Abstract translation: 一种安装基板，包括设置在基板的前表面上的互连，在所述基板的前表面上与所述互连单独设置的引线焊盘，以及通过焊料连接到所述引线焊盘的引线，以及连接部 引线连接后，互连和引线板。

公开(公告)号：US20070215443A1

公开(公告)日：2007-09-20

申请号：US11376225

申请日：2006-03-16

Applicant: Tzu Lin ,  Wen Chang

Inventor： Tzu Lin ,  Wen Chang

IPC: H01R13/70

CPC classification number: H05K1/141 ,  H01H1/5805 ,  H05K1/0284 ,  H05K1/142 ,  H05K3/103 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/1028 ,  H05K2201/10446

Abstract: A control switch connection structure is proposed, in which a control switch of an electronic device is set up on a frame, and two conducting strips are adhered onto the frame. The control switch is electrically connected to a circuit board via these two conducting strips. The setup steps of flexible printed circuit board and flat flexible cable of the control switch in the prior art can thus be saved to lower the manufacturing cost and shorten the manufacturing process of electronic device.

Abstract translation: 提出了一种控制开关连接结构，其中电子设备的控制开关设置在框架上，并且两个导电条粘附到框架上。 控制开关通过这两个导电条电路连接到电路板。 因此可以节省现有技术中的柔性印刷电路板和控制开关的扁平柔性电缆的设置步骤，以降低制造成本并缩短电子设备的制造过程。

公开(公告)号：US20070021787A1

公开(公告)日：2007-01-25

申请号：US11455028

申请日：2006-07-24

Applicant: Robert Greenberg ,  Alfred Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard Nolan ,  Dau Zhou

Inventor： Robert Greenberg ,  Alfred Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard Nolan ,  Dau Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US07152959B2

公开(公告)日：2006-12-26

申请号：US10760200

申请日：2004-01-21

Applicant: Kia Silverbrook ,  Norman Micheal Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

Inventor： Kia Silverbrook ,  Norman Micheal Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

IPC: B41J2/04

CPC classification number: B41J2/14427 ,  B41J2/155 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H01R12/721 ,  H01R12/79 ,  H01R13/2414 ,  H01R13/6315 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/1028 ,  H05K2201/10424

Abstract: A printhead assembly is provided comprising at least one printhead module comprising at least two printhead integrated circuits, each of which has nozzles formed therein for delivering printing fluid onto the surface of print media, a support member supporting the printhead integrated circuits and carrying the printing fluid, and an electrical connector for connecting electrical signals to the printhead integrated circuits. The assembly further comprises drive electronics arranged to control the printing operation of at least one printhead integrated circuit via the electrical connector, a plurality of longitudinally extending electrical conductors for providing power from a power supply to the drive electronics and the printhead integrated circuits, a casing comprising a support frame supporting the printhead module and at least one mounting element. The mounting element mounts the drive electronics and electrical conductors and incorporates a clamping arrangement for clamping the printhead module to the support frame.

Abstract translation: 提供了一种打印头组件，其包括至少一个打印头模块，该打印头模块包括至少两个打印头集成电路，每个打印头集成电路具有形成在其中的喷嘴，用于将打印流体输送到打印介质的表面;支撑打印头集成电路并承载打印流体 以及用于将电信号连接到打印头集成电路的电连接器。 组件还包括驱动电子器件，其布置成经由电连接器控制至少一个打印头集成电路的打印操作;多个纵向延伸的电导体，用于从电源向驱动电子器件和打印头集成电路提供电力;壳体 包括支撑打印头模块和至少一个安装元件的支撑框架。 安装元件安装驱动电子元件和电导体并且包括用于将打印头模块夹紧到支撑框架的夹紧装置。

公开(公告)号：US07060912B2

公开(公告)日：2006-06-13

申请号：US10310803

申请日：2002-12-06

Applicant: Mitsunori Nagashima ,  Tomoyoshi Hiei

Inventor： Mitsunori Nagashima ,  Tomoyoshi Hiei

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/3405 ,  H05K1/113 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/1028 ,  H05K2201/1034 ,  Y10T29/49165

Abstract: A circuit board comprises a board substrate including a substrate layer formed with a pad on an upper surface thereof, and a metal piece soldered on the pad. At least one through-hole including an internal wall formed with a conductive film is provided at a portion corresponding to the pad on the substrate layer. The through-hole is filled with a predetermined filler for closing at least an open mouth of the through-hole at the upper surface of the substrate layer. The pad is connected integrally with the conductive film on the internal wall of the through-hole.

Abstract translation: 一种电路板包括一个板基板，该基板包括一个在其上表面上形成有一个焊盘的基板层，以及一个焊接在焊盘上的金属片。 至少一个包括形成有导电膜的内壁的通孔设置在与衬底层上的衬垫相对应的部分。 填充有用于在基材层的上表面封闭通孔的至少一个开放口的预定填料。 衬垫与通孔内壁上的导电膜一体连接。