公开(公告)号：US20120206892A1

公开(公告)日：2012-08-16

申请号：US13370276

申请日：2012-02-09

Applicant: Erik James Shahoian ,  Chris Ligtenberg

Inventor： Erik James Shahoian ,  Chris Ligtenberg

IPC: H05K1/14 ,  H05K3/36 ,  H01R12/71

CPC classification number: H05K1/144 ,  H05K1/141 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T29/49126

Abstract: Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract translation: 非矩形内插器，用于空间高效，可靠的制造，两个印刷电路板（如主板和配对板）之间的高速互连。 一个示例使用非矩形插入器提供空间效率，其中插入件可以至少近似为圆形。 可以通过包括一个或多个开口来接受一个或多个对准特征来提供可靠的制造。 在一个示例中，提供第一开口以接纳螺纹凸台，其可用于将两个印刷电路板和插入件紧固在一起。 在另一示例中，可以提供第二开口以接受对准销，其中该引脚将插入件对准到两个印刷电路板。 可以在每一侧设置触点以与两个印刷电路板中的每一个上的触点配合。

公开(公告)号：US20120119757A1

公开(公告)日：2012-05-17

申请号：US13375742

申请日：2010-05-26

Applicant: Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uetmatsu

Inventor： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uetmatsu

IPC: G01R29/26 ,  H05K7/06

CPC classification number: G01R31/001 ,  G01R29/26 ,  G01R31/281 ,  H05K1/0215 ,  H05K1/0234 ,  H05K1/141 ,  H05K3/325 ,  H05K9/0039 ,  H05K9/0069 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate (103) on which an electronic component is mounted is secured to a housing (102) by a metal spacer (108) and a screw (104). A noise control member (100) mainly composed of an insulation substance is disposed between the metal spacer (108) and the substrate (103). A first conductive film is formed on the metal spacer-side of the noise control member (100), and a second conductive film is formed on the substrate-side of the noise control member (100). A resistance member (101) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

Abstract translation: 通过其中安装有电子部件的基板的噪声电流被抑制在壳体中，以提供电子设备的故障。 其上安装有电子部件的基板（103）通过金属间隔件（108）和螺钉（104）固定到壳体（102）。 主要由绝缘物质组成的噪声控制构件（100）设置在金属间隔件（108）和基板（103）之间。 第一导电膜形成在噪声控制部件（100）的金属间隔件侧上，第二导电膜形成在噪声控制部件（100）的基板侧。 电阻构件（101）设置在第一导电膜和第二导电膜之间。 可以通过电阻元件来抑制从外壳引入基板的噪声电流。

公开(公告)号：US08179681B2

公开(公告)日：2012-05-15

申请号：US12607306

申请日：2009-10-28

Applicant: Fumio Aoki

Inventor： Fumio Aoki

IPC: H05K1/14

CPC classification number: H01R12/7005 ,  H01R12/57 ,  H01R13/6315 ,  H05K1/141 ,  H05K3/301 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T29/49963

Abstract: An apparatus includes a case including a surface, a bottom face and a first hole arranged on the bottom face; a first connector on the bottom face of the case; and a guide pin arranged in the first hole and being capable of moving in the first hole.

Abstract translation: 一种装置包括：壳体，包括设置在底面上的表面，底面和第一孔; 在壳体的底面上的第一连接器; 以及布置在所述第一孔中并且能够在所述第一孔中移动的引导销。

公开(公告)号：US20120098020A1

公开(公告)日：2012-04-26

申请号：US13343204

申请日：2012-01-04

Applicant: Yoshiyuki FUKUDA ,  Hiromasa KATO

Inventor： Yoshiyuki FUKUDA ,  Hiromasa KATO

IPC: H01L33/58 ,  H05K7/00 ,  B32B3/24 ,  H01L33/48

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T428/24273

Abstract: According to one embodiment, a ceramic substrate for mounting a device is provided. The ceramic substrate includes a through-hole and a recessed portion provided on at least one edge surface thereof.

Abstract translation: 根据一个实施例，提供了一种用于安装装置的陶瓷基板。 陶瓷基板包括设置在其至少一个边缘表面上的通孔和凹部。

公开(公告)号：US20120057279A1

公开(公告)日：2012-03-08

申请号：US13093650

申请日：2011-04-25

Applicant: Takahiro Sugai

Inventor： Takahiro Sugai

IPC: H05K7/02

CPC classification number: H05K3/325 ,  G06F1/169 ,  G06F3/03547 ,  H05K3/1241 ,  H05K7/1076 ,  H05K2201/0311 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2201/10409

Abstract: According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.

Abstract translation: 根据一个实施例，电子设备包括壳体，布线图案，凹部，垫部分和电子部件。 布线图案由导电粘合剂形成在外壳的内表面上。 凹槽位于壳体的内表面。 焊盘部分从导电粘合剂形成在凹部中并连接到布线图案的端部。 电子部件包括接触焊盘部分的端子。

公开(公告)号：US08130511B2

公开(公告)日：2012-03-06

申请号：US12227059

申请日：2007-05-14

Applicant: Junya Sato ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

Inventor： Junya Sato ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC: H05K1/11

CPC classification number: H05K3/368 ,  H01L2224/16225 ,  H01R12/61 ,  H01R12/714 ,  H05K1/144 ,  H05K3/365 ,  H05K2201/0314 ,  H05K2201/042 ,  H05K2201/09409 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.

Abstract translation: 提供电路板装置，布线板连接方法和电路板模块装置，用于控制各向异性导电构件在最佳范围内的压缩比，以便限制各向异性导电构件的冲击弹力的变化，即使增加 为了抑制布线基板的变形以及各向异性导电部件的冲击弹力的波动，即使施加静电外力等，也能够抑制各向异性导电部件的线膨胀，甚至 如果环境温度变化，则增加电连接的稳定性，并且用于减小各向异性导电构件的冲击弹性力以允许减小厚度。 电路板装置包括配线板101-104，放置在各个布线板之间的各向异性导电构件105，与各向异性导电构件105分离的功能块106，并且与各向异性导电构件105放置在同一平面上，以包围各向异性导电构件 105，以及一对夹持布线板101-104的保持块107,108。 这些布线板101-104被夹持在一对保持块107,108之间时被保持压缩，使得它们通过各向异性导电构件105彼此电连接。

公开(公告)号：US08125783B2

公开(公告)日：2012-02-28

申请号：US12560243

申请日：2009-09-15

Applicant: Makoto Tanaka

Inventor： Makoto Tanaka

IPC: H05K7/20

CPC classification number: H05K1/0271 ,  G06F1/203 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/2009 ,  H01L2924/00

Abstract: According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. A reinforcing plate secured to the other of the first and second surfaces in said at least one of the first and second areas. The first fixing portion is provided on a border line that defines the first and second areas. The first fixing portion can fix the reinforcing plate to both the first and second areas. The second fixing portion comprises a plurality of apertures arranged symmetrical with respect to the border line.

Abstract translation: 根据一个实施例，印刷电路板包括印刷线路板，电路部件，加强板以及第一和第二固定部分。 印刷电路板包括第一和第二区域。 一个固定在所述第一和第二区域的所述至少一个中的第一和第二表面中的另一个表面上的加强板。 第一固定部分设置在限定第一和第二区域的边界线上。 第一固定部分可以将加强板固定到第一和第二区域。 第二固定部分包括相对于边界线对称布置的多个孔。

公开(公告)号：US20120026702A1

公开(公告)日：2012-02-02

申请号：US13016618

申请日：2011-01-28

Applicant: Takahiro Sugai

Inventor： Takahiro Sugai

IPC: H05K5/00

CPC classification number: H05K3/321 ,  G06F1/181 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10378 ,  H05K2201/10409

Abstract: According to one embodiment, there is provided an electronic apparatus, including: an electrically-insulative housing having a first part and a second part attachable to and detachable from the first part; a circuit board housed in the housing; a signal wire formed on an inner face of the second part; and a connector formed to electrically connect the signal wire and a terminal part of the circuit board.

Abstract translation: 根据一个实施例，提供一种电子设备，包括：电绝缘壳体，其具有可附接到第一部分并可从第一部分拆卸的第一部分和第二部分; 容纳在壳体中的电路板; 信号线，形成在所述第二部分的内表面上; 以及形成为将信号线和电路板的端子部电连接的连接器。

公开(公告)号：US08077472B2

公开(公告)日：2011-12-13

申请号：US12211035

申请日：2008-09-15

Applicant: Shu-Tzu Liu

Inventor： Shu-Tzu Liu

IPC: H05K5/00 ,  H05K1/09

CPC classification number: H05K3/0094 ,  H05K1/0215 ,  H05K1/05 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10409 ,  H05K2203/043

Abstract: A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.

Abstract translation: 本公开的印刷电路板包括主体，锡层和焊料掩模。 主体限定了连接到接地部件的通孔。 锡层围绕通孔形成在主体的表面上。 锡层接触接地部件。 在通孔的周边和锡层之间形成焊料掩模。 焊锡掩模被配置为防止锡层的锡膏流入通孔。

公开(公告)号：US08053804B2

公开(公告)日：2011-11-08

申请号：US12693994

申请日：2010-01-26

Applicant: Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

Inventor： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

IPC: H01L33/64

CPC classification number: H05K1/0206 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

Abstract: Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

Abstract translation: 这里公开了配备有LED的背光单元。 背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。 绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。 上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。 下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。 上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。