公开(公告)号：US20240284592A1

公开(公告)日：2024-08-22

申请号：US18201677

申请日：2023-05-24

Applicant: Tong Hsing Electronic Industries, Ltd.

Inventor： CHENG-YU CHEN ,  SHIH-HAN WU ,  JHIH-WEI LAI ,  JIAN-YU SHIH ,  MING-YEN PAN

IPC: H05K1/09 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K3/241 ,  H05K2201/0183 ,  H05K2201/095 ,  H05K2201/10416

Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a substrate having a plurality of through holes, a plurality of thermally-conductive blocks disposed in the through holes respectively, bonding structures respectively disposed in each through holes, and a metal circuit formed on the substrate. Particularly, the thermally-conductive block is tightly attached to the inner wall of the through hole through the bonding structure. In brief, the bonding structure includes a metal block and metal layers coated on both surfaces of the metal block to replace the conventional adhesive layer made of epoxy resin to tightly fix the thermally-conductive block in the through hole.

公开(公告)号：US20240224411A1

公开(公告)日：2024-07-04

申请号：US18148465

申请日：2022-12-30

Applicant: International Business Machines Corporation

Inventor： John S. Werner ,  Piyush Kashyap ,  Samuel R. Connor ,  Yuanchen Hu ,  Kevin O'Connell

IPC: H05K1/02

CPC classification number: H05K1/023 ,  H05K1/0207 ,  H05K2201/10416

Abstract: An apparatus for providing a safety and EMC compliant heat sink. The apparatus includes a heat sink configured to be attached to an internal power plane of a printed circuit board (PCB). The heat sink includes a plurality of fins extending outward from the heat sink. The apparatus further includes a compliance cage configured to be connected to a ground portion of the PCB, the compliance cage surrounding at least a portion of the heat sink. At least one capacitor plate contacting at least a portion of the compliance cage and extending inwards towards the heat sink and interleaving with the plurality of fins is present. Dielectric spacers are provided to fill a portion of the space between the capacitor plates and the heat sink fins.

公开(公告)号：US12004293B2

公开(公告)日：2024-06-04

申请号：US18186548

申请日：2023-03-20

Applicant: KYOCERA Corporation

Inventor： Yukio Morita ,  Noboru Kitazumi ,  Yousuke Moriyama

IPC: H05K1/03 ,  H01L23/12 ,  H01L23/373 ,  H05K1/02

CPC classification number: H05K1/036 ,  H01L23/12 ,  H01L23/373 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/03 ,  H05K2201/0323 ,  H05K2201/10416

Abstract: A first substrate includes a first surface and a second surface opposite to the first surface. A second substrate includes a third surface and a fourth surface opposite to the third surface. A third substrate includes a fifth surface and a sixth surface opposite to the fifth surface. The first substrate is made of an insulator, and includes a mounting portion for mounting an electronic element at the first surface, and the mounting portion is a rectangular shape. The third substrate is made of a carbon material, and the fifth surface is connected to at least the second surface at location overlapped with the mounting portion in plan view. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view.

公开(公告)号：US20240046965A1

公开(公告)日：2024-02-08

申请号：US18365718

申请日：2023-08-04

Applicant: Kioxia Corporation

Inventor： Kosuke AWAGA

IPC: G11B33/14 ,  H05K1/02

CPC classification number: G11B33/142 ,  H05K1/0203 ,  H05K2201/10416

Abstract: A semiconductor storage device has a substrate, a semiconductor chip, a capacitor, and a heatsink. The semiconductor chip is mounted on the substrate. The capacitor is mounted on the substrate and overlaps with the semiconductor chip in a thickness direction of the substrate. The heatsink has fins and the capacitor is mounted in the heatsink.

公开(公告)号：US11800633B2

公开(公告)日：2023-10-24

申请号：US17523018

申请日：2021-11-10

Applicant: CHILISIN ELECTRONICS CORP.

Inventor： Hung-Chih Liang ,  Pin-Yu Chen ,  Hsiu-Fa Yeh ,  Hang-Chun Lu ,  Ya-Wan Yang ,  Yu-Ting Hsu

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/1003 ,  H05K2201/10416

Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.

公开(公告)号：US11710995B2

公开(公告)日：2023-07-25

申请号：US16934872

申请日：2020-07-21

Applicant: Infinitum Electric, Inc.

Inventor： Rich Lee ,  Randal A. Lee ,  Paulo Guedes-Pinto

IPC: H02K3/26 ,  H02K9/22 ,  H05K1/16 ,  H02K1/12 ,  H02K21/24 ,  H02K11/26 ,  H02K11/30 ,  H01F17/00 ,  H01F27/22 ,  H01F27/28 ,  H02K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H02K3/26 ,  H01F17/0013 ,  H01F27/22 ,  H01F27/2804 ,  H02K1/12 ,  H02K1/182 ,  H02K9/22 ,  H02K11/26 ,  H02K11/30 ,  H02K21/24 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/165 ,  H01F2017/002 ,  H01F2017/0053 ,  H01F2027/2809 ,  H02K2203/03 ,  H02K2211/03 ,  H05K2201/093 ,  H05K2201/095 ,  H05K2201/10416

Abstract: An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof. Each PCB panel comprises discrete, PCB radial segments that are mechanically and electrically coupled together to form the respective PCB panels.

公开(公告)号：US20180281662A1

公开(公告)日：2018-10-04

申请号：US15941461

申请日：2018-03-30

Applicant: Valeo Iluminacion

Inventor： Jose-David ROLDAN ,  Miguel-Angel Pena ,  Antonio Domingo Illan

IPC: B60Q1/00 ,  H05K1/18 ,  H05K3/34 ,  F21S45/48

CPC classification number: B60Q1/0088 ,  F21S41/148 ,  F21S41/151 ,  F21S41/192 ,  F21S45/47 ,  F21S45/48 ,  H01R12/526 ,  H05K1/0366 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/4046 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10416 ,  H05K2201/10545 ,  H05K2201/10962

Abstract: An electrical power supply device for at least one light source of the light emitting diode type and at least one electronic component, including a circuit for driving the electrical power supply of the light source or each light source, the drive circuit including at least one electrical conductor track and a housing for accommodating an insert, and an insert in an electrically conducting material, the insert being inserted in the accommodation housing and including a first end portion electrically connected to the conductor track, and a second end portion suited to being electrically connected to at least one electronic component so as to supply electrical power to the electronic component.

公开(公告)号：US10061363B2

公开(公告)日：2018-08-28

申请号：US14846526

申请日：2015-09-04

Applicant: Apple Inc.

Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

IPC: G06F1/20 ,  H05K7/20 ,  H05K9/00 ,  H05K1/02

CPC classification number: G06F1/20 ,  G06F1/1656 ,  H05K1/0206 ,  H05K1/0209 ,  H05K7/20436 ,  H05K9/0049 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

公开(公告)号：US10039179B2

公开(公告)日：2018-07-31

申请号：US15350262

申请日：2016-11-14

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kensuke Matsuhashi

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/18 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/09845 ,  H05K2201/10416

Abstract: A wiring substrate includes: a substrate body made from ceramic, having a front surface and a rear surface, and having a through hole penetrating between the front surface and the rear surface; and a heatsink inserted into the through hole. A step portion protruding in a direction perpendicular to an axial direction of the through hole, is formed over an entire periphery on an inner wall surface of the through hole of the substrate body. A flange opposed to the step portion is provided so as to protrude, over an entire periphery on a side surface of the heatsink. A stress relaxing ring is arranged over an entire periphery between the step portion and a joining surface opposed to the step portion. A brazing material is provided between the ring, and the joining surface and the step portion.

公开(公告)号：US20180206325A1

公开(公告)日：2018-07-19

申请号：US15407012

申请日：2017-01-16

Applicant: HARRIS CORPORATION

Inventor： John R. McINTYRE ,  Kevin DELL ,  Timothy W. BURKS

IPC: H05K1/02 ,  H05K7/20 ,  H05K3/30

CPC classification number: H05K1/0209 ,  H05K1/0224 ,  H05K7/205 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.