公开(公告)号：US20020064674A1

公开(公告)日：2002-05-30

申请号：US09995591

申请日：2001-11-29

Applicant: PIONEER CORPORATION

Inventor： Kazuto Kadokawa

IPC: H05K007/00

CPC classification number: H05K3/3447 ,  H01L23/3675 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/10166 ,  Y10T428/12354 ,  Y10T428/12361 ,  Y10T428/1241 ,  Y10T428/12528 ,  H01L2924/00

Abstract: A part has a body unit; and one or more leg formed on the body unit. One or more slit is formed on the body unit adjacent to the leg. The legs are inserted to insert holes of a printed wiring board or the like and soldered thereto. Since the slit is formed adjacent to the leg, the heat applied to the leg for the soldering is not radiated by the body unit by virtue of the slit. Therefore, the part can be reliably attached to the printed wiring board or the like.

Abstract translation: 一部分有一个身体单位; 以及形成在身体单元上的一个或多个腿。 在与腿部相邻的主体单元上形成一个或多个狭缝。 插入腿以插入印刷线路板等的孔并焊接到其上。 由于狭缝与腿部相邻地形成，所以施加到用于焊接的腿部的热量由于狭缝而不被身体单元辐射。 因此，该部件可以可靠地附接到印刷线路板等。

公开(公告)号：US20020011918A1

公开(公告)日：2002-01-31

申请号：US09960787

申请日：2001-09-21

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C007/10

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract translation: 在过电流保护电路中使用的具有正电阻 - 温度特性的热敏电阻具有相互相对的主表面上的电极，并且被安装到具有导电构件的基板上，使得可以控制由于发热引起的耐电压劣化。 与连接到热敏电阻电极之一的焊料之间插入具有比衬底更小的导热性并且被具有小横截面面积的导体片穿透的间隔物。 另一个电极通过细长的连接构件通过其横向于其纵向方向的截面来接触，使得导电的横截面面积减小。

公开(公告)号：US06235994B1

公开(公告)日：2001-05-22

申请号：US09106909

申请日：1998-06-29

Applicant: Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Randall J. Stutzman ,  George H. Thiel

Inventor： Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Randall J. Stutzman ,  George H. Thiel

IPC: H05K100

CPC classification number: H05K1/0201 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0969

Abstract: A multi-layer printed circuit board including at least one layer of an electrically conducting material and at least one layer of an electrically insulating material. At least one through hole formed at least through the at least one layer of electrically conducting material. The at least one through hole includes a material plated on an interior surface thereof. At least one thermal break is provided in the at least one layer of electrically conducting material, such that heat passing between the through hole and the at least one layer of electrically conducting material passes through the at least one thermal break. At least one electrical connection provided in the at least one layer of electrically conducting material between the material plated on the interior surface of the through hole and the at least one layer of electrically conducting material. At least a portion of the at least one electrical connection is between the through hole and the at least one thermal break.

Abstract translation: 一种多层印刷电路板，包括至少一层导电材料层和至少一层电绝缘材料层。 至少一个至少通过至少一层导电材料形成的通孔。 所述至少一个通孔包括镀在其内表面上的材料。 在所述至少一层导电材料中提供至少一个热断裂，使得在所述通孔和所述至少一层导电材料之间通过的热量通过所述至少一个热断裂。 在所述至少一层导电材料中的至少一个电连接处，所述至少一层电导材料涂覆在所述通孔的内表面上的所述材料与所述至少一层导电材料之间。 至少一个电连接的至少一部分在通孔和至少一个热断裂之间。

公开(公告)号：US06205028B1

公开(公告)日：2001-03-20

申请号：US09119528

申请日：1998-07-21

Applicant: Hiroshi Matsumura

Inventor： Hiroshi Matsumura

IPC: H05K720

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09063

Abstract: A circuit substrate includes a plurality of electronic devices including a heat-generating electronic device, and a printed circuit board having the plurality of electronic devices mounted thereon and having a slit hole for thermally isolating a portion for mounting the heat-generating electronic device and a portion for mounting other electronic devices.

Abstract translation: 电路基板包括多个电子装置，其包括发热电子装置和安装有多个电子装置的印刷电路板，并具有用于热隔离用于安装发热电子装置的部分的狭缝孔和 用于安装其他电子设备的部分。

公开(公告)号：US5973931A

公开(公告)日：1999-10-26

申请号：US201203

申请日：1998-11-30

Applicant: Hiroyuki Fukasawa

Inventor： Hiroyuki Fukasawa

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3452 ,  H01L23/49838 ,  H05K3/3436 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17. An electronic module comprising the electronic device of the invention mounted on a mother board can be widely used by being incorporated into various types of electronic equipment.

Abstract translation: 确实地防止了印刷线路板和使用该印刷线路板的电子装置，其中形成在印刷线路板上的凸台上的突出的外部电极的基部形成裂缝。 对于具有形成在要形成外部电极13的布线图案中的焊盘16和具有要形成外部电极13的开口17a的图案保护膜17的印刷布线板11， 图形保护膜17中的开口17a被设定为比焊盘16的外径D2更大的预定尺寸，并且由此在每个外部电极13和图案保护膜17之间设置间隙，使得外部电极 13和图案保护膜17彼此不接触，结果不会由外部电极13和图案保护膜17的热膨胀差导致外部电极13的开裂。一种电子模块，包括 安装在母板上的本发明的电子装置可以被并入各种类型的电子设备中而广泛使用。

公开(公告)号：US5793611A

公开(公告)日：1998-08-11

申请号：US752009

申请日：1996-11-19

Applicant: Norio Nakazato ,  Shigeki Hirasawa ,  Shoji Masukawa ,  Heikichi Kuwahara

Inventor： Norio Nakazato ,  Shigeki Hirasawa ,  Shoji Masukawa ,  Heikichi Kuwahara

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H05K1/0207 ,  H05K7/20509 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2201/10416 ,  H05K2203/304

Abstract: An electronic device comprises a substrate having electronic parts, electric conductive wires for electrically connecting between the electronic parts, a front surface on which the electronic parts and electric conductive wires are mounted, a reverse surface and at least one electronic part back portion opposite to the electronic parts; and at least one high thermal conductivity member, a thermal conductivity coefficient thereof being higher than that of the substrate, the high thermal conductivity member being connected to the electronic part back portion while the high thermal conductivity member is opposite to the electronic parts in a substrate width direction to decrease a difference in temperature between the electronic parts.

Abstract translation: 电子设备包括具有电子部件的基板，用于电连接电子部件的导电线，安装有电子部件和导电线的前表面，反面以及与该电子部件相对的至少一个电子部件后部 电子零件; 和至少一个高导热性部件，其导热系数高于基板的导热系数，高导热性部件连接到电子部件背部，同时高导热性部件与基板中的电子部件相对 宽度方向以减小电子部件之间的温度差。

公开(公告)号：US5519580A

公开(公告)日：1996-05-21

申请号：US303440

申请日：1994-09-09

Applicant: Siva Natarajan ,  Debendra Mallik

Inventor： Siva Natarajan ,  Debendra Mallik

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H05K1/111 ,  H05K1/114 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

Abstract: A ball grid array (BGA) package which has a plurality of solder balls attached to solder landings that each have a number of tabs which extend from a center area of the landing. The tabs assist in a symmetric formation of solder balls that are formed on the landings. When constructing the package, a solder mask is applied to a bottom package surface before the application of the solder balls. The solder mask has a plurality of openings which expose the solder landings and are larger than the center area of the landings. Solder balls are then placed onto the solder landings and reflowed so that the balls become attached to the landings. The fully exposed center areas of the solder landings allow the solder to flow vertically along the outer walls of the landings, thereby providing a more robust solder joint. The exposed solder landings also allow a solder flux to be thoroughly cleaned after the solder balls are attached to the landings. Additionally, the land tabs insure an even solder flow about the solder landings to produce a symmetric uniform solder balls.

Abstract translation: 一种球栅阵列（BGA）封装，其具有附接到焊接着陆点的多个焊球，每个焊球均具有从层站的中心区域延伸的多个突片。 凸片有助于形成在平台上的焊球对称地形成。 当构造封装时，在施加焊球之前，将焊接掩模施加到底部封装表面。 焊接掩模具有多个露出焊接着陆的开口，并且大于平台的中心区域。 然后将焊球放置在焊接层上并回流，使得球附着到平台上。 焊接着陆的完全暴露的中心区域允许焊料沿着平台的外壁垂直流动，从而提供更坚固的焊点。 暴露的焊接着陆还允许在焊球附接到着陆点之后彻底清洁焊剂。 另外，焊盘可以确保焊料平齐地焊接在焊盘上，以产生对称均匀的焊球。

公开(公告)号：US5473813A

公开(公告)日：1995-12-12

申请号：US303711

申请日：1994-09-09

Applicant: Ivan I. Chobot ,  John A. Covert ,  Randy L. Haight ,  Keith D. Mansfield ,  Donald W. Miller ,  Reinaldo A. Neira ,  Alexander Petrovich ,  Paul C. Sviedrys ,  Louise A. Tiemann ,  Gerald A. Valenta ,  Thurston B. Youngs, Jr.

Inventor： Ivan I. Chobot ,  John A. Covert ,  Randy L. Haight ,  Keith D. Mansfield ,  Donald W. Miller ,  Reinaldo A. Neira ,  Alexander Petrovich ,  Paul C. Sviedrys ,  Louise A. Tiemann ,  Gerald A. Valenta ,  Thurston B. Youngs, Jr.

IPC: H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K1/0201 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K3/429 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49165

Abstract: A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith. An electrically insulating material is deposited on at least one side of each of the conductive planes. The planes are placed on top of each other such that a layer of electrically insulating material is located between each of the conductive planes. The conductive planes are joined together to form the multi-layer circuit board or card.

Abstract translation: 一种形成多层电路板或卡的方法。 该方法包括形成多个导电平面的步骤。 导电平面包括地面，信号或电力平面。 通过至少一个导电平面形成至少一个通孔。 将导电材料沉积在所述至少一个通孔的内表面上以形成电镀通孔。 至少一个热释放通道至少形成在所述至少一个导电平面中，用于防止在通过加热所述电路板或卡将固定或移除或切屑或其它部件中的热量扩散到整个电路板或卡 沉积在至少一个通孔中的材料到高于其熔点的温度。 所述至少一个热释放通道位于所述至少一个通孔的附近，并且与所述至少一个通孔没有电连接。 电绝缘材料沉积在每个导电平面的至少一侧上。 平面被放置在彼此的顶部，使得电绝缘材料层位于每个导电平面之间。 导电平面连接在一起以形成多层电路板或卡。

公开(公告)号：US5434365A

公开(公告)日：1995-07-18

申请号：US9095

申请日：1993-01-26

Applicant: Akira Mori ,  Takeshi Nakamura ,  Yoshiaki Heinouchi

Inventor： Akira Mori ,  Takeshi Nakamura ,  Yoshiaki Heinouchi

IPC: G01C19/56 ,  H03H9/05 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K1/00

CPC classification number: G01C19/5663 ,  H05K1/116 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/0969 ,  H05K3/3447

Abstract: In a mounting board, two through-holes are formed which are used for inserting both ends of a supporting member for a vibrator. On a surface of the mounting board, a ground conductor pattern is formed. In the ground conductor pattern, two portions of arcs, where the ground conductor pattern is removed, are formed on respective peripheries of the two through-holes. Furthermore, on the mounting board, two connecting conductor patterns are formed on surfaces of portions defined by the two through-holes and so on, so as to extend from the ground conductor pattern. Both ends of the supporting member for the vibrator are respectively inserted into the two through-holes and soldered to two connecting conductor patterns.

Abstract translation: 在安装板中，形成两个用于插入用于振动器的支撑构件的两端的通孔。 在安装板的表面上形成接地导体图形。 在接地导体图案中，在两个通孔的相应周边上形成有去除接地导体图案的弧形的两部分。 此外，在安装板上，由两个通孔等限定的部分的表面上形成两个连接导体图案，以便从接地导体图案延伸。 用于振动器的支撑构件的两端分别插入两个通孔中并焊接到两个连接导体图案。

公开(公告)号：US5371653A

公开(公告)日：1994-12-06

申请号：US29919

申请日：1993-03-11

Applicant: Masatsugu Kametani ,  Kazuhiro Umekita

Inventor： Masatsugu Kametani ,  Kazuhiro Umekita

IPC: H05K1/11 ,  H01L23/467 ,  H01L23/538 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K7/20

CPC classification number: H05K1/0207 ,  H01L23/467 ,  H01L23/5383 ,  H01L23/5384 ,  H05K3/429 ,  H05K3/4641 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0206 ,  H05K2201/0209 ,  H05K2201/0352 ,  H05K2201/062 ,  H05K2201/09327 ,  H05K2201/09581 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09881 ,  H05K2201/10689 ,  H05K3/3447

Abstract: A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally, The circuit board can be formed to be compact, In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner, It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer, Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

Abstract translation: 电路板包括电路导体层，接地层和电源层，通过其间的介电层叠加成多层形式。通过电路板内部的热传导增强，使得安装在电路板上的电路芯片可以 冷却到能够正常工作的水平。电路板可以形成为紧凑的。为了增强电路板中的热传递，接地层和电源层中的至少一个以多层形式形成， 优选以比电路导体层的厚度大的方式形成这些层。此外，优选地，安装在基板上的芯片的引脚和接地层和电源层中的至少一个彼此连接 以增强热传导的方式。