公开(公告)号：US20080214136A1

公开(公告)日：2008-09-04

申请号：US12121828

申请日：2008-05-16

Applicant: Gerard James Hayes ,  Scott Ladell Vance

Inventor： Gerard James Hayes ,  Scott Ladell Vance

IPC: H04B1/10

CPC classification number: H05K9/0039 ,  H04B1/3838 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/167 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10446

Abstract: The present invention uses metallization termination techniques to reduce the electro-magnetic field scattering at the edges of metallized areas. The metallization termination techniques provide a gradual transition from high conductivity areas to high impedance areas. The mobile phone antenna illuminates the PCB allowing currents to flow on the PCB. When the currents reach edges of the PCB they flow through a region of increasingly high impedance without reflecting back or scattering.

公开(公告)号：US07324348B2

公开(公告)日：2008-01-29

申请号：US11171081

申请日：2005-06-28

Applicant: Robin Berg, Jr. ,  Todd Husom ,  Derek Sayres

Inventor： Robin Berg, Jr. ,  Todd Husom ,  Derek Sayres

IPC: H05K5/00

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：US07199308B2

公开(公告)日：2007-04-03

申请号：US10949290

申请日：2004-09-27

Applicant: Tohru Ohsaka

Inventor： Tohru Ohsaka

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K2201/09336 ,  H05K2201/09345 ,  H05K2201/09354

Abstract: A multi-layered printed wiring board, capable of securing required wiring density even with a decreased number of wiring layers and reducing radiation noises, has at least three wiring layers each at least having at least one power supply line or a ground line, and another kind of line, the wiring layers each having an outer edge. A ground line is formed at the outer edge of at least one of the wiring layers. A basic power supply line is formed inside the ground line. At least one power supply line extends from the basic power supply line. A plurality of electronic parts are mounted on at least one of the wiring layers. The at least one power supply line is wired to mounting positions of the electronic parts via at least one of the wiring layers.

Abstract translation: 即使在布线层数量的减少和辐射噪声减少的情况下，也能够确保所需布线密度的多层印刷布线板具有至少三个至少具有至少一个电源线或接地线的布线层，另外 各种线路，各层具有外缘。 在至少一个布线层的外边缘处形成接地线。 在地线内形成基本电源线。 至少一条电源线从基本电源线延伸。 多个电子部件安装在至少一个布线层上。 所述至少一个电源线通过所述布线层中的至少一个布线到所述电子部件的安装位置。

公开(公告)号：US20070039171A1

公开(公告)日：2007-02-22

申请号：US11537754

申请日：2006-10-02

Applicant: Joel Goergen

Inventor： Joel Goergen

IPC: H01R43/00

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: Method and apparatus are disclosed for flow control over Point-to-Point Protocol (PPP) data links. A method of negotiating such flow control between two PPP peers is disclosed, along with methods for operating flow control across a PPP link. In one embodiment, flow control frames carry an IEEE802.3x MAC control frame payload—the PPP implementation repackages such frames as MAC control frames and passes them to a MAC, which performs flow control. In another embodiment, flow control frames allow flow control commands to be applied differently to different service classes such that PPP flow can be controlled on a per-class basis.

Abstract translation: 公开了用于在点对点协议（PPP）数据链路上的流控制的方法和装置。 公开了一种在两个PPP对等体之间协商这种流量控制的方法，以及用于在PPP链路上操作流量控制的方法。 在一个实施例中，流控制帧携带IEEE802.3x MAC控制帧有效载荷 - PPP实现将诸如MAC控制帧的帧重新封装，并将其传递给执行流控制的MAC。 在另一个实施例中，流控制帧允许流控制命令被不同地应用于不同的服务类，使得PPP流可以基于每个级别进行控制。

公开(公告)号：US20060125076A1

公开(公告)日：2006-06-15

申请号：US11096452

申请日：2005-03-31

Applicant: Masato Fukagaya ,  Osamu Koido

Inventor： Masato Fukagaya ,  Osamu Koido

IPC: H01L23/48

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/163 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0298 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/3473 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/09481 ,  H05K2203/175

Abstract: A circuit board 3 includes a ceramic substrate 6 with an internal layer circuit 7 therein. The internal layer circuit 7 is used to electroplate a plurality of component electrodes 8, a plurality of terminal electrodes 9, and a loop electrode 10 that surrounds the component electrodes 8 on surfaces of the substrate 6 by using the internal layer circuit 7. A hole is bored in a periphery of the substrate 6 to sever the internal layer circuit 7 and isolate the component electrodes 8 from the loop electrode 10. Part of the severed internal layer circuit 7 is then used to electroplate a surface of the loop electrode 10 with a brazing material 5 to provide the circuit board 3.

Abstract translation: 电路板3包括其内部层电路7的陶瓷基板6。 内层电路7用于通过使用内层电路7对多个元件电极8，多个端子电极9和围绕基板6的表面上的元件电极8的环形电极10进行电镀。 在基板6的周围钻孔，切断内层电路7，并将元件电极8与环形电极10隔离。 然后将切断的内层电路7的一部分用钎焊材料5电镀环形电极10的表面以提供电路板3。

公开(公告)号：US06988162B2

公开(公告)日：2006-01-17

申请号：US10068418

申请日：2002-02-05

Applicant: Joel R. Goergen

Inventor： Joel R. Goergen

IPC: G06F13/00

CPC classification number: H05K1/0245 ,  H04Q1/03 ,  H04Q1/10 ,  H04Q1/155 ,  H04Q2201/12 ,  H05K3/4641 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09636

Abstract: A high-speed, high-power modular router is disclosed. As opposed to conventional designs using optical backplane signaling and/or bus bars for power distribution, the disclosed embodiments combine high-power, low-noise power distribution with high-speed signal routing in a common backplane. Disclosed backplane features allow backplane signaling at 2.5 Gbps or greater on electrical differential pairs distributed on multiple high-speed signaling layers. Relatively thick power distribution layers are embedded within the backplane, shielded from the high-speed signaling layers by digital ground layers and other shielding features. A router using such a backplane provides a level of performance and economy that is believed to be unattainable by the prior art.

公开(公告)号：US20060002098A1

公开(公告)日：2006-01-05

申请号：US11171081

申请日：2005-06-28

Applicant: Robin Berg ,  Todd Husom ,  Derek Sayres

Inventor： Robin Berg ,  Todd Husom ,  Derek Sayres

IPC: H05K7/18

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

公开(公告)号：US20050276027A1

公开(公告)日：2005-12-15

申请号：US11142529

申请日：2005-06-01

Applicant: Ling-Ling Shen ,  Yu-Xiang Wang ,  Hui Chen

Inventor： Ling-Ling Shen ,  Yu-Xiang Wang ,  Hui Chen

IPC: G12B17/02 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K9/0037 ,  H05K1/0218 ,  H05K2201/09354 ,  H05K2201/10371

Abstract: A electronic device for shielding electromagnetic interference (EMI) including a metal shield, a printed circuit board (PCB) having a ground layer, and a number of ground pads arranged at edges of the PCB and in electrical conductivity with the ground layer. The ground pads lies close to edges of the metal shield. During solder reflowing process, solder is laid on the ground pads, and a height of the solder is adjusted to meet spaces or gaps of the shield. When the PCB is placed into the shield, the solder on the ground pads is in electrical conductivity with the metal shield to eliminate spaces or gaps thereof. So the EMI coupling which causes EMI signals interfering with sensitive components is avoided.

Abstract translation: 一种用于屏蔽包括金属屏蔽的电磁干扰（EMI）的电子设备，具有接地层的印刷电路板（PCB）和布置在PCB的边缘处并与接地层导电的多个接地焊盘。 接地垫靠近金属屏蔽层的边缘。 在焊锡回流过程中，将焊料铺设在接地焊盘上，并调整焊料的高度以满足屏蔽层的空间或间隙。 当PCB被放置在屏蔽层中时，接地焊盘上的焊料与金属屏蔽层导电，以消除其间隙或间隙。 因此避免了导致EMI信号干扰敏感元件的EMI耦合。

公开(公告)号：US06958445B1

公开(公告)日：2005-10-25

申请号：US11014292

申请日：2004-12-16

Applicant: Brent A. Boudreaux ,  Richard A. Schumacher

Inventor： Brent A. Boudreaux ,  Richard A. Schumacher

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K9/0024 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2201/09354 ,  H05K2201/10371 ,  H05K2203/1572 ,  Y10S174/35

Abstract: A system composes a circuit board, electronic devices mounted on a first surface of the circuit board, and an electromagnetic interference (EMI) shield removably mounted to the first surface of the circuit board. The EMI shield defines a chamber to contain the electronic devices. An electrically conductive member is mounted to a second surface of the circuit board. At least an electrically conductive structure extends from the first surface to the second surface of the circuit board to electrically connect the EMI shield to the electrically conductive member.

Abstract translation: 系统包括电路板，安装在电路板的第一表面上的电子装置以及可移除地安装到电路板的第一表面的电磁干扰（EMI）屏蔽。 EMI屏蔽件限定一个容纳电子设备的腔室。 导电构件安装到电路板的第二表面。 至少导电结构从电路板的第一表面延伸到第二表面，以将EMI屏蔽电连接到导电构件。

公开(公告)号：US20050122645A1

公开(公告)日：2005-06-09

申请号：US10726641

申请日：2003-12-04

Applicant: Ming-Dou Ker ,  Kun-Hsien Lin

Inventor： Ming-Dou Ker ,  Kun-Hsien Lin

IPC: H05K1/02 ,  H05K1/11 ,  H05K9/00 ,  H02H9/00

CPC classification number: H05K1/0259 ,  H05K1/117 ,  H05K9/0067 ,  H05K2201/09354 ,  H05K2201/094 ,  H05K2201/10689

Abstract: An interface device coupled to a board on which integrated circuits are mounted for providing electrostatic discharge protection for the integrated circuits that comprises a plurality of first contact members, each of the first contact members including one end connected to the board and the other end to connect to an external device, and at least one second contact member connected to a voltage line of a voltage level, wherein the at least one second contact member includes a length greater than that of each of the first contact members.

Abstract translation: 一种接口装置，其耦合到其上安装有集成电路的板，用于为包括多个第一接触构件的集成电路提供静电放电保护，所述第一接触构件中的每一个包括连接到所述板的一端和用于连接的另一端 连接到电压电平的电压线的至少一个第二接触构件，其中所述至少一个第二接触构件的长度大于每个所述第一接触构件的长度。