公开(公告)号：US20240044946A1

公开(公告)日：2024-02-08

申请号：US17817796

申请日：2022-08-05

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R19/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  G01R15/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30

CPC classification number: G01R19/0092 ,  H01L23/4951 ,  H01L23/49531 ,  H01L21/4821 ,  H01L24/45 ,  G01R15/146 ,  H05K1/189 ,  H05K1/181 ,  H05K1/111 ,  H05K3/301 ,  H01L2224/4502 ,  H05K2201/09227 ,  H05K2201/09445 ,  H05K2201/10151 ,  H05K2201/10636 ,  H05K2201/10977

Abstract: A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.

公开(公告)号：US11725488B2

公开(公告)日：2023-08-15

申请号：US17666065

申请日：2022-02-07

Applicant: GEODYNAMICS, INC.

Inventor： Phillip Phelps ,  Brad Perry ,  Rick Wallace

IPC: E21B43/1185 ,  F42D1/055 ,  H01R12/71 ,  H05K1/11 ,  F42D1/05 ,  H01R13/08 ,  H01H1/18 ,  H01H1/24 ,  H01H9/02

CPC classification number: E21B43/1185 ,  F42D1/05 ,  F42D1/055 ,  H01R12/714 ,  H05K1/119 ,  H01H1/18 ,  H01H1/24 ,  H01H9/02 ,  H01R13/08 ,  H05K2201/09027 ,  H05K2201/09445 ,  H05K2201/09809

Abstract: A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator, a voltage measuring unit configured to locally measure a voltage (V) at the switch assembly after receiving the fire command to activate the detonator, a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator and after measuring the voltage (V), based on whether or not the measured voltage (V) at the switch assembly is larger than a threshold value.

公开(公告)号：US20230223049A1

公开(公告)日：2023-07-13

申请号：US18093759

申请日：2023-01-05

Applicant: NHK SPRING CO., LTD.

Inventor： Yukie YAMADA

IPC: G11B33/12 ,  H01R12/62 ,  H01R12/65 ,  H01R4/04 ,  H05K1/11

CPC classification number: G11B33/122 ,  H01R12/62 ,  H01R12/65 ,  H01R4/04 ,  H05K1/118 ,  H05K2201/09445 ,  H05K2201/094

Abstract: A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first sur face. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An ansotropic conductive film (ACE) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACE.

公开(公告)号：US20180063969A1

公开(公告)日：2018-03-01

申请号：US15691149

申请日：2017-08-30

Applicant: INGENICO GROUP

Inventor： Eric Philibert ,  Richard Allirot

IPC: H05K3/36 ,  H01R12/62 ,  H01R12/65 ,  H05K1/02

CPC classification number: H05K3/363 ,  H01R12/62 ,  H01R12/65 ,  H05K1/0275 ,  H05K1/028 ,  H05K2201/0394 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09445 ,  H05K2201/10977

Abstract: A flexible printed circuit board is proposed. The flexible printed circuit board includes at least one soldering element possessing a soldering face, accessible from a first face of the flexible printed circuit board, and a heating face, accessible from a second face of the flexible printed circuit board. Such a flexible printed circuit board includes a main part including the soldering element, and at least one foldable part, extending from the main part and being configured to pass: from a non-folded state, in which the at least one foldable part does not cover the heating face of the at least one soldering element; to a folded state in which the at least one foldable part covers the heating face of the at least one soldering element.

公开(公告)号：US20170290159A1

公开(公告)日：2017-10-05

申请号：US15409591

申请日：2017-01-19

Applicant: GE LIGHTING SOLUTIONS, LLC

Inventor： Zoltán Szabó ,  Katalin Eszter Horvath ,  Andras Majoros

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K3/222 ,  H05K1/02 ,  H05K1/0286 ,  H05K1/14 ,  H05K1/142 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10363

Abstract: Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

公开(公告)号：US09721199B2

公开(公告)日：2017-08-01

申请号：US14223242

申请日：2014-03-24

Applicant: Johnson Electric S.A.

Inventor： Vincent Daniel Jean Salle ,  Martin Wallace Edmonds

IPC: G06K19/02 ,  H05K1/02 ,  G06F21/86 ,  G08B13/24 ,  H05K1/03

CPC classification number: G06K19/02 ,  G06F21/86 ,  G08B13/2434 ,  H05K1/0275 ,  H05K1/0386 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09445

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.

公开(公告)号：US09544059B2

公开(公告)日：2017-01-10

申请号：US14868434

申请日：2015-09-29

Applicant: Oclaro Japan, Inc.

Inventor： Fumitoshi Goto

IPC: H04B10/40 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36

CPC classification number: H04B10/40 ,  G02B6/4279 ,  H05K1/0251 ,  H05K1/0274 ,  H05K1/115 ,  H05K3/363 ,  H05K2201/09445 ,  H05K2201/09618 ,  H05K2201/09727

Abstract: An optical module includes: a first circuit board including a first signal terminal part and a first ground terminal part formed on a front surface; and a second circuit board including a second signal terminal part and a second ground terminal part formed on a back surface. The first circuit board further includes: a first dielectric layer; a first signal wire formed on a front surface of the first dielectric layer; a first ground conductor layer formed on a back surface of the first dielectric layer; and a first through ground conductor passing through the first dielectric layer. The first ground terminal part is formed, in a first region and a second region respectively located on both sides of the first signal terminal part in a first direction, and in a third region prescribed at a location beyond the first signal terminal part in a second direction.

Abstract translation: 光学模块包括：第一电路板，包括形成在前表面上的第一信号端子部分和第一接地端子部分; 以及包括形成在背面上的第二信号端子部分和第二接地端子部分的第二电路板。 第一电路板还包括：第一电介质层; 形成在所述第一电介质层的前表面上的第一信号线; 形成在所述第一电介质层的背面上的第一接地导体层; 以及穿过第一介电层的第一通孔接地导体。 第一接地端子部分在第一区域和第二区域中形成，第一区域和第二区域分别位于第一方向上的第一信号端子部分的两侧，并且在第二区域中形成在第二区域中，第二区域在第二区域中被设置在超出第一信号端子部分的位置 方向。

公开(公告)号：US09460757B2

公开(公告)日：2016-10-04

申请号：US14071430

申请日：2013-11-04

Applicant: HGST Netherlands B.V.

Inventor： Edgar Dennis Rothenberg ,  Yiduo Zhang

IPC: G11B33/12 ,  H05K1/11 ,  H01R12/59 ,  H05K1/02 ,  G11B5/48

CPC classification number: G11B33/122 ,  G11B5/4846 ,  H01R12/592 ,  H05K1/118 ,  H05K2201/09445 ,  H05K2201/099

Abstract: A flexible printed circuit (FPC) may have reduced-tolerance electrical connection pads that comprise a connection portion and an adjacent window portion, where the position of a component that is mechanically and electrically connected to the FPC is limited by the geometry of the connection portion of the respective connection pads. The window portion includes an area void of conductive material and bounded by the connection portion on one side and may be bounded by peripheral portions on the other sides, where the peripheral portions are significantly narrower than the connection portion. A portion of the peripheral portions extending from the connection portion may be tucked under a portion of the FPC cover layer to prevent peeling of the peripheral portions.

Abstract translation: 柔性印刷电路（FPC）可以具有包含连接部分和相邻窗口部分的减小公差的电连接焊盘，其中机械地和电连接到FPC的部件的位置被连接部分的几何形状所限制 的各个连接焊盘。 窗口部分包括导电材料区域，并且由一侧上的连接部分限定，并且可以由另一侧的周边部分限定，其中周边部分比连接部分明显窄。 从连接部分延伸的周边部分的一部分可以卷在FPC覆盖层的一部分下面，以防止周边部分的剥离。

公开(公告)号：US20160204534A1

公开(公告)日：2016-07-14

申请号：US14916612

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK LTD.

Inventor： Yuki ISHIDA ,  Masayuki SUZUKI ,  Yuki NAKANO ,  Harunori URAI ,  Norifumi NAGAE

IPC: H01R12/78 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/78 ,  H01R12/772 ,  H01R12/88 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K2201/09236 ,  H05K2201/09445 ,  H05K2201/09681 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the wirings (9).

公开(公告)号：US20160064793A1

公开(公告)日：2016-03-03

申请号：US14938881

申请日：2015-11-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01P3/08

CPC classification number: H01P3/08 ,  H01L23/12 ,  H01L23/66 ,  H01L2924/0002 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0191 ,  H05K2201/058 ,  H05K2201/0919 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

Abstract translation: 作为信号传输部件的信号传输电缆包括层压体，其包括在第一方向上的相对端中的一个上的第一薄部分和在第一方向上的另一端的第二薄部分。 层叠体中的第一薄部分和第二薄部分之间的部分是主线部分。 第一和第二薄部分的厚度比主线部分的厚度薄。 由主线部分和第一和第二薄部分限定的层压体的厚度方向上的一端的表面是连续的平坦表面。 用于外部连接的连接器布置在第一和第二薄部分的表面上，其中每个薄部分和主线部分具有水平差。