公开(公告)号：US20100027229A1

公开(公告)日：2010-02-04

申请号：US12577867

申请日：2009-10-13

Applicant: Tomofumi Kitada ,  Hiroki Maruo

Inventor： Tomofumi Kitada ,  Hiroki Maruo

IPC: H05K7/00 ,  H05K1/09

CPC classification number: H05K3/363 ,  H05K1/117 ,  H05K2201/09427 ,  H05K2201/097 ,  H05K2201/09727

Abstract: A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.

Abstract translation: 一种具有绝缘基材的印刷线路板; 形成在所述绝缘基材的至少一个表面上的布线，所述布线形成预定的电路图案; 第一连接端子部分，形成在表面上并电连接到布线，第一连接端子部分具有第一宽度; 形成在表面上并电连接到布线的第二连接端子部分，第二连接端子部分具有第二宽度; 以及覆盖层，其被配置为覆盖所述布线并暴露所述第一连接端子部和所述第二连接端子部。

公开(公告)号：US20090315856A1

公开(公告)日：2009-12-24

申请号：US12485624

申请日：2009-06-16

Applicant: Harutoshi OIKAWA ,  Kiyohiro KIMURA

Inventor： Harutoshi OIKAWA ,  Kiyohiro KIMURA

IPC: G06F3/045 ,  H05K1/02

CPC classification number: H05K3/361 ,  G06F3/045 ,  H05K3/281 ,  H05K3/323 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/097 ,  H05K2201/0979 ,  H05K2203/1572

Abstract: A flexible printed circuit includes: a first wiring layer and a second wiring layer being in contact with one surface of a flexible substrate, a third wiring layer and a fourth wiring layer on the other surface of the flexible substrate, a first conductive member being formed on surfaces in proximity to a through hole of the second wiring layer and the fourth wiring layer; a second conductive member being formed on surfaces in proximity to the first end section of the first wiring layer and the third wiring layer; and an insulating layer being formed in a space between the first wiring layer and the second conductive member, and the second wiring layer and the first conductive member and a space between the third wiring layer and the second conductive member, and the fourth wiring layer and the first conductive member.

Abstract translation: 柔性印刷电路包括：第一布线层和与柔性基板的一个表面接触的第二布线层，在柔性基板的另一个表面上的第三布线层和第四布线层，形成第一导电部件 在第二布线层和第四布线层的通孔附近的表面上; 第二导电构件形成在靠近第一布线层和第三布线层的第一端部的表面上; 以及在所述第一布线层和所述第二导电构件之间的空间中形成绝缘层，以及所述第二布线层和所述第一导电构件以及所述第三布线层和所述第二导电构件之间的空间，以及所述第四布线层和 第一导电构件。

公开(公告)号：US20090184910A1

公开(公告)日：2009-07-23

申请号：US12186348

申请日：2008-08-05

Applicant: Sung-Kyu LEE ,  On-Sik Choi ,  Do-Wan Kim ,  Sung-Wook Kang

Inventor： Sung-Kyu LEE ,  On-Sik Choi ,  Do-Wan Kim ,  Sung-Wook Kang

IPC: G09G3/36 ,  H05K7/06

CPC classification number: H05K1/0245 ,  H05K1/0228 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/097

Abstract: One or more embodiments of the present disclosure relate to a circuit board having a substrate and a plurality of differential signal lines formed on the substrate and transmitting differential signals. The differential signal lines include a first signal line and a second signal line. The first signal line and the second signal line extend along at least two paths that are parallel to each other. The paths of the first signal line and the second signal line switch at path change portions, and the path change portions of neighboring differential signal lines are positioned at different distances away from an edge of the circuit board along the length direction of the differential signal line.

Abstract translation: 本公开的一个或多个实施例涉及具有衬底和形成在衬底上并传输差分信号的多个差分信号线的电路板。 差分信号线包括第一信号线和第二信号线。 第一信号线和第二信号线沿着彼此平行的至少两个路径延伸。 第一信号线和第二信号线开关在路径改变部分的路径，并且相邻差分信号线的路径变化部分位于与差分信号线的长度方向上离电路板边缘不同的距离处 。

公开(公告)号：US20090184418A1

公开(公告)日：2009-07-23

申请号：US12353317

申请日：2009-01-14

Applicant: Ji-Hwan HWANG ,  Dong-Han Kim ,  Chul-Woo Kim ,  Chung-Ye Chung ,  Kwang-Jin Bae

Inventor： Ji-Hwan HWANG ,  Dong-Han Kim ,  Chul-Woo Kim ,  Chung-Ye Chung ,  Kwang-Jin Bae

IPC: H01L23/498 ,  H05K1/18

CPC classification number: H05K1/0277 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.

Abstract translation: 布线基板包括基膜，多个第一布线和多个第二布线。 基膜具有芯片安装区域，用于在其上安装半导体芯片。 第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。 第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。 所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部， 连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

公开(公告)号：US07547213B2

公开(公告)日：2009-06-16

申请号：US10927607

申请日：2004-08-26

Applicant: George E. Pax

Inventor： George E. Pax

IPC: H01R13/60

CPC classification number: H05K1/117 ,  H05K2201/09145 ,  H05K2201/094 ,  H05K2201/097

Abstract: Memory modules and methods for manufacturing memory modules are disclosed herein. In one embodiment, a memory module includes a substrate, a microelectronic device carried by the substrate, and a plurality of external contact pads operably coupled to the microelectronic device. The substrate includes a first major surface with a first longitudinal edge and a second longitudinal edge. The external contact pads are disposed on the first major surface proximate to the second longitudinal edge. The contact pads include a first contact pad with a first end proximate to the second longitudinal edge and a second contact pad with a second end proximate to the second longitudinal edge. The first end is spaced apart from the first longitudinal edge by a first distance, and the second end is spaced apart from the first longitudinal edge by a second distance different than the first distance.

Abstract translation: 本文公开了用于制造存储器模块的存储器模块和方法。 在一个实施例中，存储器模块包括衬底，由衬底承载的微电子器件以及可操作地耦合到微电子器件的多个外部接触焊盘。 衬底包括具有第一纵向边缘和第二纵向边缘的第一主表面。 外部接触垫设置在靠近第二纵向边缘的第一主表面上。 接触焊盘包括第一接触垫，其具有靠近第二纵向边缘的第一端和第二接触垫，第二接触垫具有靠近第二纵向边缘的第二端。 第一端部与第一纵向边缘间隔开第一距离，并且第二端部与第一纵向边缘间隔开与第一距离不同的第二距离。

公开(公告)号：US07433195B2

公开(公告)日：2008-10-07

申请号：US10554545

申请日：2004-01-05

Applicant: Zhenya Li ,  Konggang Wei ,  Wenjian Li ,  Chenglong Wang ,  Guzheng Wu ,  Zhiguo Yang ,  Junwen Jin

Inventor： Zhenya Li ,  Konggang Wei ,  Wenjian Li ,  Chenglong Wang ,  Guzheng Wu ,  Zhiguo Yang ,  Junwen Jin

IPC: H05K1/14

CPC classification number: H01R12/52 ,  H01R31/06 ,  H05K1/18 ,  H05K2201/044 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: The invention discloses a double-sided pluggable backplane, having one side on which one or more than one front backplane connector is disposed according to width of plot positions and the other side on which one or more than one rear backplane connector is disposed according to width of plot positions, the front backplane connector and the adjacent rear backplane connector being located at the same horizontal level on the double-sided pluggable backplane and staggered right-and-left in turn, meanwhile the front backplane connector and the rear backplane connector having uniform specifications and the same contact pin definitions. The double-sided pluggable backplane according to the present invention can realize interchangeability of front boards and rear boards and have no special requirements for design and manufacture of printed circuit boards and machining of the backplane.

Abstract translation: 本发明公开了一种双面可插拔背板，其一侧根据图形位置的宽度设置有一个或多于一个的前背板连接器，另一侧根据宽度设置一个或多个后背板连接器 的前置背板连接器和相邻的后背板连接器依次位于双面可插拔背板相同的水平位置，依次交错排列，同时前背板连接器和后背板连接器具有均匀的 规格和相同的触针定义。 根据本发明的双面可插拔背板可以实现前板和后板的可互换性，并且对印刷电路板的设计和制造以及背板的加工没有特殊要求。

公开(公告)号：US07337453B2

公开(公告)日：2008-02-26

申请号：US10704811

申请日：2003-11-12

Applicant: Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

Inventor： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

IPC: G11B7/085 ,  G11B7/09

CPC classification number: H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

Abstract: An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

Abstract translation: 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。

公开(公告)号：US20080042785A1

公开(公告)日：2008-02-21

申请号：US11654017

申请日：2007-01-17

Applicant: Takatoshi Yagisawa

Inventor： Takatoshi Yagisawa

IPC: H01P1/00

CPC classification number: H01P1/2007 ,  H01F27/34 ,  H01F2005/006 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/165 ,  H05K2201/097

Abstract: An inductor circuit board that is made compatible with broadband by reducing parasitic capacitance of an inductor. The inductor circuit board is comprised of a flexible substrate made of a material, such as polyimide or liquid polymer, a transmission line formed on the flexible substrate, and an inductor. The inductor has a three-dimensional conical structure in which component inductors having different inductances are continuously connected to each other, with one end thereof connected to a portion of the transmission line between an input end and an output end thereof, and is formed according to a transmission line pattern by wiring on a plurality of surface layers of the flexible substrate and connecting portions wired on the surface layers by vias that connect between the layer surfaces of the substrate, such that the inductor is expanded in a fan-like manner as it is farther from the one end connected to the transmission line. A portion of the indictor closer to the transmission line has a smaller inductance, and a portion of the same farther from the transmission line has a larger inductance.

Abstract translation: 一个电感电路板，通过降低电感器的寄生电容与宽带兼容。 电感器电路板包括由诸如聚酰亚胺或液体聚合物的材料制成的柔性衬底，形成在柔性衬底上的传输线和电感器。 电感器具有三维锥形结构，其中具有不同电感的分量电感器彼此连续地连接，其一端连接到输入端和输出端之间的传输线的一部分，并根据 通过在柔性基板的多个表面层上布线的布线和通过连接在基板的层表面之间的通孔的布置在表面层上的连接部分的传输线图案，使得电感器以类似风扇的方式扩展 距离连接到传输线的一端更远。 靠近传输线的指示器的一部分具有较小的电感，并且与传输线相距较远的一部分具有较大的电感。

公开(公告)号：US20070294888A1

公开(公告)日：2007-12-27

申请号：US11895355

申请日：2007-08-24

Applicant: Ronald Whittaker ,  Joe Guerra ,  Ciprian Marcoci

Inventor： Ronald Whittaker ,  Joe Guerra ,  Ciprian Marcoci

IPC: H05K3/42

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 多层电路和磁性构件周围的多个绕组之间的电连接由多个电镀通孔导体提供。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层，来提供该镀铜的有机层的附着力。

公开(公告)号：US20070123387A1

公开(公告)日：2007-05-31

申请号：US11605253

申请日：2006-11-29

Applicant: Barry Mansell ,  Gail Mansell

Inventor： Barry Mansell ,  Gail Mansell

IPC: F16H61/00

CPC classification number: H05K1/165 ,  H01F17/0033 ,  H01F17/02 ,  H05K1/0237 ,  H05K2201/097 ,  Y10T477/6895

Abstract: A printed solenoid inductor delay line system comprises discrete delay sections, where the inductor is implemented in the form of a printed, spiraling solenoid, with the solenoid axis in the plane of the multi-layer printed circuit board (PCB).

Abstract translation: 印刷螺线管电感延迟线系统包括离散延迟部分，其中电感器以印刷螺旋形螺线管的形式实现，其中螺线管轴线在多层印刷电路板（PCB）的平面中。