公开(公告)号：US07048866B2

公开(公告)日：2006-05-23

申请号：US10454111

申请日：2003-06-03

Applicant: Jynji Nakamura ,  Noboru Kamihira

Inventor： Jynji Nakamura ,  Noboru Kamihira

IPC: C23F4/00 ,  H01L21/027

CPC classification number: H05K1/0271 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/061 ,  H05K2201/098 ,  H05K2201/09845 ,  Y10T428/12535 ,  H01L2924/00

Abstract: There is provided a method for producing a metal/ceramic bonding article wherein a metal member 12 is formed so as to have a predetermined shape by printing a resist 14 in a predetermined region on the metal member 12 to etch the metal member 12 after bonding the metal member 12 to a ceramic member 10. In this method, at least one strip-like non-printed portion 16 having a width of, e.g. 0.01 to 0.5 mm, in which the resist is not printed, is provided in a region inwardly spaced from the outer periphery of the resist 14 by a predetermined distance, e.g. 0.01 to 0.5 mm, to control the etch rate in the outer peripheral portion of the metal member 12. Thus, the width and thickness of a fillet is freely changed. For example, a stepped portion (or a stepped portion and fillet) having a width of 0.05 to 0.5 mm and a thickness of 0.005 to 0.25 mm is formed in the outer peripheral portion of the metal member 12.

公开(公告)号：US07034389B2

公开(公告)日：2006-04-25

申请号：US10839157

申请日：2004-05-06

Applicant: Kenji Morimoto ,  Hiroshi Ochi

Inventor： Kenji Morimoto ,  Hiroshi Ochi

IPC: H01L23/48

CPC classification number: H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H05K1/092 ,  H05K1/111 ,  H05K3/02 ,  H05K3/321 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/10674 ,  H05K2203/0514 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: According to the present invention, when a semiconductor element having protruding electrodes formed thereon is connected to a circuit board via conductive resin, stable connection is made even when an electrode pitch is small on the semiconductor element. On semiconductor element package regions on the circuit board, a paste electrode material containing photopolymerizable materials is printed to form a film having a prescribed thickness, and this electrode material film is baked after exposure and development thereof so as to obtain circuit electrodes having edges warped in a direction of going apart from the circuit board surface. Then, the protruding electrodes and the concave surfaces of the circuit electrodes are brought in abutment with each other and connected via the conductive resin which surrounds the abutments between the respective electrodes and is held on the concave surfaces of the circuit electrodes. With this arrangement, the concave surfaces of the circuit electrodes act as saucers and prevent the conductive resin from being squeezed out, thereby eliminating possible occurrence of short circuits.

公开(公告)号：US20060055021A1

公开(公告)日：2006-03-16

申请号：US11084805

申请日：2005-03-18

Applicant: Mitsuhiko Yamamoto

Inventor： Mitsuhiko Yamamoto

IPC: H01L23/48

CPC classification number: H05K1/0265 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/205 ,  H05K3/244 ,  H05K3/245 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/09881 ,  H01L2924/00 ,  H01L2224/0401

Abstract: According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t larger than a width W.

Abstract translation: 根据本发明，布线基板包括由引线形成的导电图案，每个引线形成在有机层上并且具有大于宽度W的厚度t

公开(公告)号：US20050194179A1

公开(公告)日：2005-09-08

申请号：US10794008

申请日：2004-03-04

Applicant: Shuo Hu ,  Chih-Feng Sung

Inventor： Shuo Hu ,  Chih-Feng Sung

IPC: H05B33/02 ,  H05B33/08 ,  H05B33/12 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0265 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2201/09909

Abstract: A conducting device for a display device is disclosed. It comprises one or more non-conducting base lines formed in predetermined locations on a substrate layer, and one or more conducting line structures formed over the non-conducting base lines on the substrate layer, wherein the non-conducting base lines raise the conducting line structures in height for increasing a cross-sectional area thereof for reducing a resistance of the conducting line structures.

Abstract translation: 公开了一种用于显示装置的导电装置。 它包括一个或多个形成在基底层上的预定位置的非导电基线，以及一个或多个导电线结构，形成在基底层上的非导电基线之上，其中非导电基线增加导线 用于增加其横截面面积以降低导线结构的电阻的高度结构。

公开(公告)号：US20050145595A1

公开(公告)日：2005-07-07

申请号：US10707640

申请日：2003-12-29

Applicant: Jose Cubero Pitel

Inventor： Jose Cubero Pitel

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/28 ,  H01B13/00

CPC classification number: H05K3/28 ,  H05K1/0263 ,  H05K3/06 ,  H05K2201/0195 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/1121

Abstract: It comprises the steps of: a) arranging a dielectric substrate (1) with at least one conducting plate (2) joined by an adhesive (8) to at least one of its sides; b) removing areas of said plate (2) by selective chemical milling to provide conducting tracks (5) joined to the substrate (1) and separated by spaces between tracks (6); c) applying and hardening by radiation an electroinsulating filler material (7) to fill said spaces between tracks (6), covering the tracks (5); d) applying an abrasion treatment to obtain flush upper surfaces (3) of the filler material (7) and of the tracks; and e) cooling, after step c) and during step d), the printed circuit board to reduce the temperature of the filler material (7) to under its glass transition temperature.

Abstract translation: 它包括以下步骤：a）将具有至少一个导电板（2）的介电基片（1）布置成由粘合剂（8）连接到其至少一个侧面; b）通过选择性化学研磨去除所述板（2）的区域，以提供连接到基板（1）并由轨道（6）之间的间隔分隔的导电轨道（5）; c）通过辐射施加和硬化电绝缘填充材料（7）以填充覆盖轨道（5）的轨道（6）之间的所述空间; d）进行磨损处理以获得填充材料（7）和轨道的平齐的上表面（3）; 和e）在步骤c）之后和步骤d）期间冷却印刷​​电路板，以将填料（7）的温度降低到其玻璃化转变温度以下。

公开(公告)号：US06914334B2

公开(公告)日：2005-07-05

申请号：US10167904

申请日：2002-06-12

Applicant: Yuan-Liang Li ,  Jiangqi He ,  Dong Zhong ,  David G. Figueroa

Inventor： Yuan-Liang Li ,  Jiangqi He ,  Dong Zhong ,  David G. Figueroa

IPC: H01L23/498 ,  H01L23/66 ,  H01P3/08 ,  H05K1/02 ,  H01L23/48

CPC classification number: H01P3/081 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/0265 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/098 ,  H05K2203/0733 ,  H01L2924/00

Abstract: Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set of conductive traces parallel to the first set and disposed within the conductive material. The second set is separated from the first set by non-conductive material. Corresponding traces of the first and second sets may be in a stacked configuration. In other embodiments, conductive material may be provided between corresponding traces of the first and second sets resulting in an “I-shaped” or “U-shaped” cross-section. In yet other embodiments, the trace configurations have “T-shaped” and “L-shaped” cross-sections.

Abstract translation: 用于承载高速数字差分信号的跟踪配置提供了降低的传导损耗和改善的信号完整性。 在一个实施例中，电路板具有设置在非导电材料上的第一组导电迹线和平行于第一组并设置在导电材料内的第二组导电迹线。 第二组与非导电材料与第一组分离。 第一组和第二组的相应迹线可以是堆叠配置。 在其他实施例中，导电材料可以设置在第一组和第二组的相应迹线之间，导致“I形”或“U形”横截面。 在其它实施例中，迹线构造具有“T形”和“L形”横截面。

公开(公告)号：US20050126707A1

公开(公告)日：2005-06-16

申请号：US11047962

申请日：2005-02-01

Applicant: Laurence Lai ,  Anthony Russell ,  Michael Shaw

Inventor： Laurence Lai ,  Anthony Russell ,  Michael Shaw

IPC: B05D3/10 ,  B32B15/04 ,  C23F1/02 ,  C23F1/32 ,  H04R7/04 ,  H04R31/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/06 ,  H01L21/306 ,  B32B3/00 ,  B32B15/00

CPC classification number: H05K1/0265 ,  B32B15/04 ,  C23F1/02 ,  H04R7/04 ,  H04R31/003 ,  H05K1/09 ,  H05K1/165 ,  H05K3/06 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T428/10 ,  Y10T428/24 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: To achieve a large thickness of conductive metal-containing material in a feature of a product unit processed with a liquid-based etch process, the desired thickness of material is apportioned to the two opposing surfaces of a substrate to create a two-part feature. Conventional features are made by identically patterning two same-thickness metal-containing layers and electrically connecting the resulting patterned parts in any suitable manner. However, features may also be made that do not have identical parts on opposite sides of the substrate, the two parts being electrically connected but differing in thickness, in shape, or both Moreover, having two metal-containing layers separated by an insulator is also useful for allowing different sections of the same feature or circuit to cross one another without shorting, or to overlap in whole or in part without shorting.

Abstract translation: 为了在用基于液体的蚀刻工艺处理的产品单元的特征中实现大厚度的含导电金属的材料，将所需的材料厚度分配给基板的两个相对的表面以产生两部分特征。 传统的特征是通过相同地构图两个相同厚度的含金属层并以任何合适的方式电连接所得到的图案化部分。 然而，也可以在衬底的相对侧上不具有相同部件的特征，两个部分电连接但是在厚度，形状或两者上不同。另外，由绝缘体隔开的两个含金属层也是 有助于允许相同特征或电路的不同部分彼此交叉而不短路，或者全部或部分重叠而不短路。

公开(公告)号：US06800807B2

公开(公告)日：2004-10-05

申请号：US10606857

申请日：2003-06-27

Applicant: Masaaki Ishiguro ,  Akiyoshi Sato

Inventor： Masaaki Ishiguro ,  Akiyoshi Sato

IPC: H02G308

CPC classification number: B60R16/0239 ,  H01R9/226 ,  H01R9/24 ,  H05K3/103 ,  H05K2201/098 ,  H05K2201/10287

Abstract: An electric junction box is provided, by which the circuit density can be increased and the whole structure can be lightweight and compact. The electric junction box includes: an insulating board; and a plurality of electrically conductive metal wire rods having a square or a nearly square shape in cross section, which are arranged on the insulating board, wherein an end of at least one of the metal wire rod extends curvedly or straight forming a terminal part and at least a portion of the terminal part protrudes toward a housing of a body of the electric junction box. At least one of the metal wire rods is cut to a suitable length, bent into a suitable shape, and arranged on the insulating board. One terminal part of the metal wire rod protrudes toward the housing, while an opposite terminal part of the at least one metal wire rods is connected to a component or terminal or, alternatively, protrudes toward another housing.

Abstract translation: 提供电接线盒，通过该电接线盒可提高电路密度，整体结构可轻便且紧凑。 电接线盒包括：绝缘板; 以及布置在所述绝缘板上的多个横截面为方形或近似正方形的导电金属线材，其中至少一个所述金属线材的端部弯曲或直线地形成终端部分，并且 端子部分的至少一部分朝向电接线盒的主体的壳体突出。 将金属线材中的至少一个切割成合适的长度，弯曲成合适的形状，并且布置在绝缘板上。 金属线材的一个端子部分朝着壳体突出，而至少一个金属线材的相对的端子部分连接到部件或端子，或者替代地朝向另一壳体突出。

公开(公告)号：US20040097086A1

公开(公告)日：2004-05-20

申请号：US10664333

申请日：2003-09-17

Inventor： Yusuke Igarashi ,  Hideki Mizuhara ,  Noriaki Sakamoto

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K3/205 ,  H01L21/566 ,  H01L23/3128 ,  H01L23/538 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/07802 ,  H01L2924/15311 ,  H05K1/185 ,  H05K1/187 ,  H05K3/062 ,  H05K3/108 ,  H05K3/284 ,  H05K2201/098 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wiring structure cannot be formed and warping of the insulating resin sheet in the manufacturing process is prominent. In order to solve these problems, a laminated plate 10 formed by laminating a first conductive film 11 and a second conductive film 12 is covered with a photoresist layer PR having opening portions 13 with inclined surfaces 13S, a conductive wiring layer 14 is formed in the opening portions by electrolytic plating to form inverted inclined surfaces 14R, and then, when covering the same with the sealing resin layer 21, an anchoring effect is produced by making the sealing resin layer 21 bite into the inverted inclined surfaces 14R so as to strengthen bonding of the sealing resin layer 21 with the conductive wiring layer 14.

Abstract translation: 优选地，其中使用具有导电图案的柔性片的半导体器件作为支撑衬底，在其上安装半导体元件，并且已经开发了组合。 在这种情况下，存在无法形成多层布线结构并且在制造工艺中绝缘树脂片翘曲突出的问题。 为了解决这些问题，通过层叠第一导电膜11和第二导电膜12而形成的层叠板10被具有带有倾斜面13S的开口部13的光致抗蚀剂层PR覆盖，导电布线层14形成在 通过电解电镀形成开口部，以形成倒置的倾斜面14R，然后，当用密封树脂层21覆盖时，通过使密封树脂层21咬合到倒置的倾斜面14R中而形成锚定效果，从而加强接合 的密封树脂层21。

公开(公告)号：US06724575B1

公开(公告)日：2004-04-20

申请号：US09713963

申请日：2000-11-15

Applicant: Eunkyu Jang

Inventor： Eunkyu Jang

IPC: G11B548

CPC classification number: H05K1/0237 ,  G11B5/4853 ,  H05K1/0254 ,  H05K1/056 ,  H05K2201/098

Abstract: The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer; and a first conductive layer attached to the dielectric layer, in which the first conductive layer has an elliptical cross-section. The electrical substrate may be used in a flexible circuit that connects the read/write head to electronic circuitry in a hard disk drive.

Abstract translation: 本发明是提供电气基板的方法和装置。 电气基板包括电介质层; 以及附着到电介质层的第一导电层，其中第一导电层具有椭圆形截面。 电气基板可以用于将读/写头连接到硬盘驱动器中的电子电路的柔性电路中。