公开(公告)号：US20150244120A1

公开(公告)日：2015-08-27

申请号：US14708366

申请日：2015-05-11

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott Lynn Michaelis

IPC: H01R24/64 ,  H01R13/6463 ,  H01R13/627 ,  H01R13/42

CPC classification number: H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/665 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/04 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US20150214666A1

公开(公告)日：2015-07-30

申请号：US14166897

申请日：2014-01-29

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01R13/6461 ,  H05K3/10 ,  H05K1/02 ,  H01R13/6477 ,  H01R24/64

CPC classification number: H01R13/6477 ,  H01R4/023 ,  H01R13/6461 ,  H01R13/6464 ,  H01R13/6469 ,  H01R24/64 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/165 ,  H05K3/10 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/1034 ,  Y02P70/611 ,  Y10T29/49155

Abstract: Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

Abstract translation: 提供了用于通信连接器的印刷电路板，其包括由具有第一介电常数的第一绝缘材料形成的电介质基板。 第一和第二对输入端子和第一和第二对输出端子设置在电介质基板上。 第一差分传输线将第一对输入端子电连接到第一对输出端子，并且第二差分传输线路将第二对输入端子电连接到第二对输出端子。 电介质基板包括位于第一差动传输线的导电路径之间的开口，该开口包含具有第二介电常数的第二绝缘材料。

公开(公告)号：US09070959B2

公开(公告)日：2015-06-30

申请号：US13571961

申请日：2012-08-10

Applicant: Norio Okada

Inventor： Norio Okada

IPC: H05K1/00 ,  H01P5/02 ,  H01R13/6474 ,  H01R12/62 ,  H05K3/36 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01P5/028 ,  H01R12/62 ,  H01R13/6474 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/025 ,  H05K1/0306 ,  H05K3/361 ,  H05K3/366 ,  H05K2201/0715 ,  H05K2201/1034

Abstract: A connection unit includes: a ceramic substrate; a first signal line on the ceramic substrate; a first grounded conductor on the ceramic substrate and electromagnetically coupled to the first signal line; a first lead pin having a first end connected to an upper surface of the first signal line and a second end protruding beyond the ceramic substrate; a second lead pin having a first end connected to an upper surface of the first grounded conductor and a second end protruding beyond the ceramic substrate; a flexible substrate including an insulating layer through which the first and second lead pins penetrate, a second signal line on a first major surface of the insulating layer and connected to the second end of the first lead pin, and a second grounded conductor on a second major surface of the insulating layer and connected to the second end of the second lead pin.

Abstract translation: 连接单元包括：陶瓷基板; 陶瓷基板上的第一信号线; 陶瓷衬底上的第一接地导体，并与第一信号线电磁耦合; 第一引脚，其具有连接到第一信号线的上表面的第一端和突出超过陶瓷基板的第二端; 第二引脚，其具有连接到第一接地导体的上表面的第一端和突出超过陶瓷基板的第二端; 柔性基板，其包括第一和第二引线引脚穿过的绝缘层，绝缘层的第一主表面上并连接到第一引脚的第二端的第二信号线，以及在第二引脚的第二引脚上的第二接地导体 绝缘层的主表面并连接到第二引脚的第二端。

公开(公告)号：US09054460B2

公开(公告)日：2015-06-09

申请号：US13762433

申请日：2013-02-08

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott L. Michaelis

IPC: H01R24/00 ,  H01R13/658 ,  H01R43/20 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/66 ,  H01R24/64 ,  H05K1/11 ,  H01R12/53 ,  H01R24/28 ,  H05K1/02

CPC classification number: H01R13/658 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R43/205 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。

公开(公告)号：US09039271B2

公开(公告)日：2015-05-26

申请号：US12730802

申请日：2010-03-24

Applicant: Edward Roger Adams

Inventor： Edward Roger Adams

IPC: H01R33/88 ,  H01J5/54 ,  F21K99/00 ,  F21V7/00 ,  F21V29/00 ,  H05K3/40 ,  F21Y101/02 ,  H05K1/11

CPC classification number: F21K9/23 ,  F21K9/90 ,  F21V7/0008 ,  F21V23/06 ,  F21V29/773 ,  F21Y2115/10 ,  H01J5/54 ,  H05K1/117 ,  H05K3/403 ,  H05K2201/1034

Abstract: Interfaces for electrical (e.g., lighting) devices involve use of electrically conductive edge contacts arranged on or protruding from edges of printed circuit boards (PCBs) that provide or facilitate electrical connections to first and second externally accessible electrical contacts, such as may include threaded and foot contacts of a lighting device including a screw-shaped male base. First and/or second edge contacts of a PCB may protrude through first and second openings in a housing to form first and second externally accessible contact, or directly engage first and second externally accessible contact elements associated with (e.g., retained by) the housing. A contact element retained by a housing may define a slot in the interior of the housing to directly engage an edge contact of the PCB. Electric power is supplied to the PCB via edge contacts without need for intervening wires or soldered connections.

Abstract translation: 用于电气（例如，照明）设备的接口涉及使用布置在印刷电路板（PCB）的边缘上或从其突出的导电边缘触点，印刷电路板（PCB）提供或促进与第一和第二外部可访问的电触点的电连接，例如可以包括螺纹和 包括螺旋形阳基座的照明装置的脚接触件。 PCB的第一和/或第二边缘触点可以突出穿过壳体中的第一和第二开口，以形成第一和第二外部可触及的触点，或者直接接合与壳体相关联的（例如保持）的第一和第二外部可触及的接触元件。 由壳体保持的接触元件可以在壳体的内部中限定直接接合PCB的边缘接触的槽。 电源通过边缘触点提供给PCB，而不需要插入电线或焊接连接。

公开(公告)号：US20150111432A1

公开(公告)日：2015-04-23

申请号：US14547165

申请日：2014-11-19

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R13/6469 ,  H01R13/6466 ,  H01R24/64

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

Abstract translation: 提供了包括至少具有第一至第四导体的通信电缆和附接到电缆的插头的跳线。 插头包括容纳电缆的外壳，印刷电路板，第一至第四插头触头以及将第一至第四导体连接到相应的第一至第四插头触头的第一至第四导电路径。 第一和第二导体，导电路径和插头触点形成第一差分传输线，并且第三和第四导体，导电路径和插头触点形成第二差分传输线。 第一至第四插头触点中的每一个具有沿着印刷电路板的第一表面纵向延伸的第一段，并且进入第一至第四插头触点中的至少一些的第一段的信号电流注入点进入中间部分 的各自的第一部分。

公开(公告)号：US20140369017A1

公开(公告)日：2014-12-18

申请号：US14364085

申请日：2013-01-25

Applicant: Electrolux Home Products Corporation N.V.

Inventor： Laurent Jeanneteau ,  Thibaut Rigolle ,  Alex Viroli ,  Andrea Fattorini

IPC: H05K1/14 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/142 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/14 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0183 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract translation: 本发明涉及包括印刷电路板（20），至少一个单独的电路板（10）和用于所述印刷电路板（20）的至少一个电力连接器（12）的电气和/或电子电路。 所述至少一个电源连接器（12）被连接或连接到相应的对应物。 在单独的电路板（10）处销售许多电和/或电子部件（22）。 所述至少一个单独的电路板（10）通过多个焊点（16）连接到所述印刷电路板（20）。 焊点（16）通过通孔技术连接到单独的电路板（10）。 焊接接头（16）通过SMD（表面安装器件）技术连接到印刷电路板（20）。 至少一个电源连接器（12）通过通孔技术紧固在单独的电路板（10）处。

公开(公告)号：US08817478B2

公开(公告)日：2014-08-26

申请号：US13241690

申请日：2011-09-23

Applicant: Eiichi Kodera

Inventor： Eiichi Kodera

IPC: H05K1/00

CPC classification number: H05K1/147 ,  H05K1/0219 ,  H05K3/363 ,  H05K2201/09618 ,  H05K2201/1034 ,  H05K2203/167

Abstract: There is provided a communication device that includes a first circuit board which includes a first ground pattern (GND) and a first signal line formed on a substrate, a ground pin electrically coupled with the first GND, where the ground pin protrudes from an end of the substrate, and a signal pin formed in the substrate and electrically coupled with the first signal line, where the signal pin protrudes from the end. The communication device further includes a send circuit board which includes a second GND and a second signal line, wherein when an end of the circuit board is inserted into a space between the ground pin and the signal pin, the first signal line and the second signal line are electrically coupled with each other via the signal pin and the first GND and the second GND are electrically coupled with each other via the ground pin.

Abstract translation: 提供了一种通信装置，其包括第一电路板，其包括形成在基板上的第一接地图案​​（GND）和第一信号线，与第一GND电耦合的接地引脚，其中接地引脚从接地引脚的端部突出 衬底和形成在衬底中并与第一信号线电耦合的信号引脚，其中信号引脚从端部突出。 通信装置还包括发送电路板，其包括第二GND和第二信号线，其中当电路板的一端插入到接地引脚和信号引脚之间的空间中时，第一信号线和第二信号 线经由信号引脚彼此电耦合，并且第一GND和第二GND经由接地引脚彼此电耦合。

公开(公告)号：US20140085772A1

公开(公告)日：2014-03-27

申请号：US14014773

申请日：2013-08-30

Applicant: SAMHWA CAPACITOR CO., LTD.

Inventor： Young Joo OH ,  Jung Rag YOON ,  Kyung Min LEE ,  Young Min YOO

IPC: H01G4/38

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/40 ,  H05K1/0231 ,  H05K1/116 ,  H05K3/306 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09718 ,  H05K2201/1034 ,  Y02T10/7022

Abstract: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Abstract translation: 直流（DC）链路电容器模块包括通过顺序地布置第一电极基板，绝缘基板，第二电极基板，第三电极基板形成的印刷电路板（PCB） 与第一电极基板和第二电极基板中的每一个并联连接的多个DC链路电容器; 多个第一Y电容器，与第一电极基板和第三电极基板中的每一个串联连接，并联连接到直流链路电容器; 以及与第一电极基板和第三电极基板中的每一个串联连接并与第一Y电容器并联连接的多个第二Y电容器，从而实现小型化，并且通过将多个DC链路 电容使用PCB。

公开(公告)号：US08624408B2

公开(公告)日：2014-01-07

申请号：US13189121

申请日：2011-07-22

Applicant: Katsuyoshi Mino ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

Inventor： Katsuyoshi Mino ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

IPC: H01L23/29

CPC classification number: H01L23/295 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3675 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/1034 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract translation: 在本发明的电路装置中，电路基板的下表面侧及其侧面的一部分被第二树脂密封剂覆盖，电路基板的上表面侧等被第一树脂密封剂 。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。