公开(公告)号：US06724631B2

公开(公告)日：2004-04-20

申请号：US10127896

申请日：2002-04-22

Applicant: Runqing Ye ,  Alpha J. Zhang

Inventor： Runqing Ye ,  Alpha J. Zhang

IPC: H05K720

CPC classification number: H05K7/20418 ,  H01L23/36 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/3421 ,  H05K7/209 ,  H05K2201/10477 ,  Y10T29/4935 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.

Abstract translation: 用于电源转换器的封装，其中所有部件与一个多层电路板电连接。 具有至少具有功率耗散芯片的子封装，具有裸露的顶部向上的热插块，通过多个对称引线与板电连接。 散热器直接连接到具有导热绝缘体的其他部件的子封装，平面磁性部件和顶表面的裸顶部热塞上。 由子封装消散的热量通过裸顶部散热片传递到附着的散热器，并进一步转移到环境中。 该组件具有紧凑且廉价的功率转换器封装，具有改进的电气性能和增强的热管理。

公开(公告)号：US06667556B2

公开(公告)日：2003-12-23

申请号：US10302594

申请日：2002-11-22

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L2348

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/141 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

公开(公告)号：US20030198022A1

公开(公告)日：2003-10-23

申请号：US10127896

申请日：2002-04-22

Inventor： Runqing Ye ,  Alpha J. Zhang

IPC: H05K007/20

CPC classification number: H05K7/20418 ,  H01L23/36 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/3421 ,  H05K7/209 ,  H05K2201/10477 ,  Y10T29/4935 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.

Abstract translation: 用于电源转换器的封装，其中所有部件与一个多层电路板电连接。 具有至少具有功率耗散芯片的子封装，具有裸露的顶部向上的热插块，通过多个对称引线与板电连接。 散热器直接连接到具有导热绝缘体的其他部件的子封装，平面磁性部件和顶表面的裸顶部热塞上。 由子封装散发的热量通过裸顶部散热片传递到附着的散热器，并进一步转移到环境中。 该组件具有紧凑且廉价的功率转换器封装，具有改进的电气性能和增强的热管理。

公开(公告)号：US20030127729A1

公开(公告)日：2003-07-10

申请号：US10377639

申请日：2003-03-04

Inventor： Takakazu Fukumoto ,  Muneharu Tokunaga ,  Tetsuya Matsuura

IPC: H01L023/48

CPC classification number: H05K1/144 ,  H01L25/105 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1627 ,  H05K1/141 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.

公开(公告)号：US06566610B1

公开(公告)日：2003-05-20

申请号：US10032908

申请日：2001-11-01

Applicant: Chinh Nguyen ,  Phu Hoang ,  Phan Hoang ,  Andy Le

Inventor： Chinh Nguyen ,  Phu Hoang ,  Phan Hoang ,  Andy Le

IPC: H05K116

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract translation: 在本发明的一个实施例中，堆叠元件包括印刷电路板（PCB）和多个焊料凸块。 PCB具有顶侧和底侧。 顶侧连接到第一设备的第一个引脚。 多个焊料凸块位于底侧，并附接到第二器件的第二引脚的上部区域，以提供第一引脚和第二引脚之间的电连接。

公开(公告)号：US06555756B2

公开(公告)日：2003-04-29

申请号：US09855671

申请日：2001-05-16

Applicant: Yasuaki Nakamura ,  Masayuki Sakurai ,  Kazumitsu Ishikawa ,  Hiroyuki Kudoh

Inventor： Yasuaki Nakamura ,  Masayuki Sakurai ,  Kazumitsu Ishikawa ,  Hiroyuki Kudoh

IPC: H05K103

CPC classification number: H05K1/141 ,  H01L23/057 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/1532 ,  H01L2924/19106 ,  H05K1/183 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/429 ,  H05K2201/09181 ,  H05K2201/09627 ,  H05K2201/10477 ,  H01L2924/00

Abstract: A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7′), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc., can be received or stored within a space of the cavity (20), thereby enabling the mounting of the electronic parts thereon with high density and reliability, such as on a motherboard (40).

Abstract translation: 一种具有用于在其中安装电子部件的空腔（20）的印刷电路板（1）及其制造方法，包括：在两侧具有平坦表面的上布线基板（1A） 下板体（1B）固定在所述上布线基板的背面，并且在其一部分中形成有所述空腔（20），用于在其内部容纳电子部件（30）; 设置在上布线基板的两个侧表面上的导体层（3），用于通过形成电镀通孔（7）或平坦通孔（7'），特别是在空腔的区域中形成电子部件 其背面; 以及形成在印刷电路板的侧端面或下端面上的外部电极（5），其中至少电子部件例如是混合IC，芯片状部件，诸如SAW滤波器的功能部件 ，传感器部件等可以被接收或存储在空腔（20）的空间内，从而能够以高密度和可靠性安装电子部件，例如在主板（40）上。

公开(公告)号：US20030043557A1

公开(公告)日：2003-03-06

申请号：US09943954

申请日：2001-08-31

Inventor： Paul Aurelio Martinez

IPC: H05K001/14

CPC classification number: H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/10477 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A system and method for reducing an apparent height of a board system are provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.

Abstract translation: 提供了一种用于降低板系统的表观高度的系统和方法。 板系统可以包括例如载体，组件，印刷电路板和/或焊料材料。 该部件安装在载体的第一侧上。 印刷电路板具有构造成容纳部件的孔。 焊料将载体焊接到印刷电路板上，并在载体和印刷电路板之间提供结构粘合。 焊料材料的至少一部分在载体和印刷电路板之间提供电耦合，并且在将载体焊接到印刷电路板之后，部件的至少一部分保持在孔中。

公开(公告)号：US20020182903A1

公开(公告)日：2002-12-05

申请号：US10195865

申请日：2002-07-15

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H01R012/00

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，所述材料将接合销接合到相对方垫81.接合销由大于通孔的开口直径的接合头部11构成，并形成接合 以及具有能够将该腿部插入通孔的尺寸的腿部12。 脚部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。大体上具有球形而不是接合销的接合球也可以连接到通孔 由导电材料制成。

公开(公告)号：US20020181208A1

公开(公告)日：2002-12-05

申请号：US09872985

申请日：2001-05-31

Inventor： Thomas Lloyd Credelle ,  Glenn Gengel ,  Roger Green Stewart ,  William Hill Joseph

IPC: H05K001/14

CPC classification number: H01L24/96 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07752 ,  G06K19/07779 ,  G06K19/07783 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L29/0657 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/95085 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01Q7/00 ,  H05K1/141 ,  H05K1/183 ,  H05K3/222 ,  H05K3/321 ,  H05K2201/10477 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Abstract translation: 电子组件的方法和装置。 电子组件具有从主体衬底产生并分离的第一对象。 第一个对象在其中具有第一电路。 载体基板耦合到第一物体，其中第一物体正在凹陷在载体基底的表面下方。 载体基板还包括第一载体连接焊盘和使用金属连接器与第一对象互连的第二载体连接焊盘。 接收基板，其基本上是平面的，包括第二电路，第一接收连接焊盘和与使用金属连接器与第二电路互连的第二接收连接焊盘。 使用所述连接焊盘将载体衬底耦合到接收衬底。

公开(公告)号：US06414849B1

公开(公告)日：2002-07-02

申请号：US09429045

申请日：1999-10-29

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H05K702

CPC classification number: H01L23/13 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0141 ,  H05K2201/09045 ,  H05K2201/10477 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A low stress, low profile, cavity down wire bond or flip-chip BGA package is formed by injection molding or thermosetting of liquid crystal plastic (LCP) to form a die carrier including a polymer solder grid array (PSGA) of standoff posts formed during molding of the die carrier. The standoff posts are coated with copper during plating of the die carrier, on the surfaces of which conductive traces are etched from the standoff posts into a die cavity, including on the sidewalls of the die cavity, to wire bond sites or small solderable areas at the bottom of the cavity. After mounting of a wire bond or flip-chip integrated circuit die within the die cavity of the die carrier, the packaged integrated circuit is mounted on a main printed circuit board (PCB) substrate utilizing conductive paste to electrically connect the standoff posts to conductive solderable areas on the main PCB substrate. The high aspect ratio and/or large height of the plated standoff posts reduces stress on the solder joints and, combined with the flexibility of the LCP die carrier, improves solder joint reliability after reflow and during operation.

Abstract translation: 通过液晶塑料（LCP）的注射成型或热固化形成低应力，低轮廓，空腔下引线接合或倒装芯片BGA封装，以形成包含在其中形成的支柱的聚合物焊丝阵列（PSGA）的模具载体 模具载体的模制。 在裸片载体的电镀期间，间隔柱涂覆有铜，其表面上的导电迹线从支架柱蚀刻到包括在模腔的侧壁上的模腔中，到导线接合位置或小的可焊接区域 腔的底部。 将引线接合或倒装芯片集成电路管芯安装在管芯载体的管腔内之后，使用导电膏将封装的集成电路安装在主印刷电路板（PCB）基板上，以使支座柱电连接到导电可焊接 主PCB基板上的区域。 电镀间隔柱的高纵横比和/或高高度减少了焊点的应力，并且与LCP模具载体的灵活性相结合，在回流和操作之后提高了焊点的可靠性。