公开(公告)号：US4258411A

公开(公告)日：1981-03-24

申请号：US40648

申请日：1979-05-21

Applicant: Charles J. Sherman

Inventor： Charles J. Sherman

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K1/0231 ,  H05K3/305 ,  H05K1/0203 ,  H05K1/18 ,  H05K2201/0209 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  Y02P70/613

Abstract: The subject electronic device packaging arrangement is designed to enhance heat transfer from an electronic device to the printed circuit board to which it is attached. This is accomplished by employing a thermally conductive base having a depression in the top thereof into which the electronic device is placed and bonded. The base has a protuberance in the bottom thereof corresponding to the depression in the top, which protuberance is attached to the associated printed circuit board. The protuberance on the base is formed to be in contact with the printed circuit board surface to provide thermal dissipation into the board by conduction processes. Continuous or segmented conductors are bonded both to the electronic device and to the base. These conductors are bent over the edge of the base to the bottom of the base where they align with corresponding contact points on the printed circuit board.

Abstract translation: 主题电子设备封装装置被设计成增强从电子设备到其所连接的印刷电路板的热传递。 这通过使用在其顶部具有凹陷的导热基底来实现，电子器件被放置和结合到该基底中。 底座在其底部具有与顶部凹陷相对应的凸起，该凸起附接到相关联的印刷电路板。 基底上的突起形成为与印刷电路板表面接触，以通过传导过程向板提供散热。 连续的或分段的导体都粘合到电子设备和基座上。 这些导体在基座的边缘上弯曲到底座的底部，在底部与印刷电路板上的相应接触点对齐。

公开(公告)号：US3905038A

公开(公告)日：1975-09-09

申请号：US33554273

申请日：1973-02-26

Applicant: SIGNETICS CORP

Inventor： BEYERLEIN FRITZ W

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/11 ,  H05K3/30 ,  H05K3/34 ,  H01L29/52

CPC classification number: H01L23/49541 ,  H01L23/49861 ,  H01L24/01 ,  H01L25/117 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/3426 ,  H05K3/3473 ,  H05K3/3494 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/087 ,  H05K2203/1581 ,  Y02P70/613 ,  H01L2924/00

Abstract: Semiconductor assembly and method in which very small pill-like packages can be mounted directly on boards and can be directly mounted in assemblies and stacks. The pill-like package encapsulates a semiconductor body having at least a portion of an electrical circuit formed therein with contact pads in a predetermined pattern carried by the body and lying in a common plane with a plurality of first leads bonded to the contact pads and the first leads extending outwardly from the semiconductor body and having outer extremities which lie in a predetermined pattern with encapsulating means encapsulating the semiconductor body and the portions of the first leads in engagement with the contact pads. The pill-like package is very small and has a spider-like conformation. The leads are formed in such a manner so that the packages can be directly mounted upon printed circuit boards without extending the leads through holes. The pill-like packages can be stacked into assemblies in which the leads are interconnected.

Abstract translation: 半导体组件和方法，其中非常小的药丸状包装可以直接安装在板上，并且可以直接安装在组件和堆叠中。 药丸状包装封装半导体本体，其具有形成在其中的电路的至少一部分，接触垫以预定的图案承载，并且与公共平面相连，多个第一引线与接触垫接合，并且 第一引线从半导体本体向外延伸并且具有以预定图案形成的外端，封装装置封装半导体本体，并且第一引线的部分与接触焊盘接合。 丸状包装非常小，具有蜘蛛状构型。 引线以这样的方式形成，使得封装可以直接安装在印刷电路板上，而不会使引线通过孔延伸。 药丸状包装可以堆叠在其中引线相互连接的组件中。

公开(公告)号：US20240347939A1

公开(公告)日：2024-10-17

申请号：US18632884

申请日：2024-04-11

Applicant: TE Connectivity Solutions GmbH ,  Tyco Electronics (Shanghai) Co., Ltd.

Inventor： Wei (David) Zhao ,  Joshua Tyler Sechrist ,  Christopher Blackburn

IPC: H01R12/71 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01R12/714 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10265 ,  H05K2201/1053 ,  H05K2201/10598

Abstract: An electronic assembly comprises a circuit board, a connector module, and a fixing assembly. The connector module includes a module housing and connection members at least partially accommodated therein. An engagement structure is formed on the module housing. The fixing assembly is adapted to be engaged with the engagement structure to secure the connector module to the circuit board, such that the connection members are electrically connected to the circuit board.

公开(公告)号：US20240290763A1

公开(公告)日：2024-08-29

申请号：US18659676

申请日：2024-05-09

Applicant: Google LLC

Inventor： Houle Gan ,  Richard Stuart Roy ,  Yujeong Shim ,  William F. Edwards, JR. ,  Chenhao Nan

IPC: H01L25/16 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/162 ,  H05K1/11 ,  H05K1/183 ,  H01L24/16 ,  H01L2224/16225 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10704 ,  H05K2201/10719

Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.

公开(公告)号：US12025506B2

公开(公告)日：2024-07-02

申请号：US17219433

申请日：2021-03-31

Applicant: STMicroelectronics S.r.l.

Inventor： Massimiliano Pesaturo ,  Marco Omar Ghidoni

IPC: G01K7/01 ,  H05K1/18

CPC classification number: G01K7/015 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An ambient temperature sensor is provided that may be coupled to a PCB. The ambient temperature sensor includes a package including a first cap and an insulating structure. The insulating structure is formed of thermally insulating material, and the first cap and the insulating structure delimit a first cavity. A semiconductor device is included and generates an electrical signal indicative of a temperature. The semiconductor device is fixed on top of the insulating structure and arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity, which extends below the semiconductor device and is open laterally.

公开(公告)号：US20240196539A1

公开(公告)日：2024-06-13

申请号：US18533234

申请日：2023-12-08

Applicant: MEDIATEK INC.

Inventor： Chun-Ping Chen ,  Pei-San Chen ,  Hui-Chi Tang

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H05K1/183 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L2224/13005 ,  H01L2224/16227 ,  H01L2924/2076 ,  H05K1/021 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734

Abstract: A printed circuit board assembly including a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a first thickness; a cavity disposed within a chip module mounting region of the substrate on the first surface that caves in towards the second surface, wherein the chip module mounting region of the substrate has a second thickness, wherein the second thickness is smaller than the first thickness; a plurality of bonding pads in the cavity; and a chip module mounted in the cavity and electrically connected to the substrate through the plurality of bonding pads.

公开(公告)号：US20230309230A1

公开(公告)日：2023-09-28

申请号：US18298451

申请日：2023-04-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi TAKAKURA ,  Yoshihito OTSUBO ,  Tadashi NOMURA ,  Hideo NAKAGOSHI

IPC: H05K1/18 ,  H01L25/16 ,  H01L23/552 ,  H05K9/00 ,  H01L25/00 ,  H01L25/065 ,  H05K3/34 ,  H05K3/32

CPC classification number: H05K1/18 ,  H01L23/552 ,  H01L25/0657 ,  H01L25/162 ,  H01L25/50 ,  H05K3/321 ,  H05K3/34 ,  H05K9/0022 ,  H01L24/16 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053

Abstract: The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two main surfaces of the wiring board, a second electronic component disposed on the other of the two main surfaces of the wiring board, and a first sealing member that covers the wiring board, the first electronic component, and the second electronic component.

公开(公告)号：US11735563B2

公开(公告)日：2023-08-22

申请号：US17512123

申请日：2021-10-27

Applicant: Invensas LLC

Inventor： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H05K3/34

CPC classification number: H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/43 ,  H01L24/78 ,  H01L25/105 ,  H01L25/50 ,  H01L21/565 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/4554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4824 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/1053 ,  H05K2201/10515 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45565 ,  H01L2224/45144 ,  H01L2224/45664 ,  H01L2924/19107 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2924/19107 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2224/85986 ,  H01L2224/8518 ,  H01L2224/85951 ,  H01L2224/49171 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/49171 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/4824 ,  H01L2224/49171 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/45144 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2924/00 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/00 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2224/45015 ,  H01L2924/20756 ,  H01L2224/45015 ,  H01L2924/20757 ,  H01L2224/45015 ,  H01L2924/20758 ,  H01L2224/45015 ,  H01L2924/20759 ,  H01L2224/45015 ,  H01L2924/2076 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2924/01049

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

公开(公告)号：US11652034B2

公开(公告)日：2023-05-16

申请号：US17132041

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Darryl Becker ,  Mark J. Jeanson ,  Gerald Bartley ,  Matthew Doyle

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/58 ,  H05K1/02 ,  H05K3/34 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01L23/49811 ,  H01L23/58 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/3436 ,  H01G4/232 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/1053 ,  H05K2201/10378 ,  H05K2201/10515

Abstract: A method of attaching an integrated circuit (IC) package to a printed circuit board (PCB) with a set of direct current (DC) blocking capacitors includes: applying a conductive attachment material to a first set of attachment pads located on a first planar surface of the IC package; aligning the set of DC blocking capacitors in accordance with corresponding positions of the first set of attachment pads; attaching the set of DC blocking capacitors to the IC package by: positioning the aligned set of DC blocking capacitors so that a first surface of a first DC blocking capacitor of the set of DC blocking capacitors is adjacent to a corresponding attachment pad of the first set of attachment pads; and connecting the conductive attachment material to the IC package and to the first surface of the first DC blocking capacitor to create an IC package assembly.

公开(公告)号：US11646301B2

公开(公告)日：2023-05-09

申请号：US17511600

申请日：2021-10-27

Applicant: Au Optronics Corporation

Inventor： Chi-Ho Chang ,  Yang-En Wu

IPC: H01L25/16 ,  G06F3/041 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L25/167 ,  G06F3/041 ,  H05K1/181 ,  H01L25/162 ,  H05K1/0274 ,  H05K2201/1053 ,  H05K2201/10106 ,  H05K2201/10492 ,  H05K2201/10515

Abstract: A display device includes a circuit board and a plurality of light-emitting units disposed on the circuit board. The circuit board includes a substrate and a plurality of signal lines disposed on the substrate. Each light-emitting unit includes a base board, at least one light-emitting element and a driving circuit layer. The light-emitting element is between the base board and the substrate. The driving circuit layer is between the light-emitting element and the base board, and electrically connected to the light-emitting element and the signal line.