公开(公告)号：US20100270673A1

公开(公告)日：2010-10-28

申请号：US12742176

申请日：2008-11-14

Applicant: Hermann Oppermann

Inventor： Hermann Oppermann

IPC: H01L23/538 ,  H01L21/60 ,  H01L21/70

CPC classification number: H05K3/24 ,  B22F2003/244 ,  B81C3/001 ,  B81C2203/032 ,  C22C1/08 ,  H01L24/10 ,  H01L24/28 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/325 ,  H05K3/383 ,  H05K2201/0116 ,  H05K2201/209 ,  H05K2203/0307 ,  H05K2203/0361

Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.

Abstract translation: 本发明涉及一种用于连接两个接合表面的方法，特别是在半导体领域中，其中至少一个接合表面通过将包含20至40％的金和80至60％的银的层沉积到衬底上而产生，并选择性地除去 银，以便产生作为接合表面的纳米多孔金层。 具有纳米多孔金层的接合表面和另外的接合表面一个放置在另一个上并压在一起。

公开(公告)号：US20080220634A1

公开(公告)日：2008-09-11

申请号：US12031156

申请日：2008-02-14

Applicant: William L. Brodsky ,  Mark G. Clark ,  Amanda E.E. Mikhail ,  Arvind K. Sinha ,  Scott A. Shurson ,  Jason T. Stoll

Inventor： William L. Brodsky ,  Mark G. Clark ,  Amanda E.E. Mikhail ,  Arvind K. Sinha ,  Scott A. Shurson ,  Jason T. Stoll

IPC: H01R12/00

CPC classification number: H01R12/7011 ,  H01R12/716 ,  H01R12/721 ,  H01R13/514 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10537 ,  H05K2201/209 ,  Y02P70/611

Abstract: An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).

Abstract translation: 电连接器包括具有从其延伸的互锁特征的第一连接器主体。 互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩 连接到印刷电路板（PCB）。

公开(公告)号：US20080169563A1

公开(公告)日：2008-07-17

申请号：US11898750

申请日：2007-09-14

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L23/49 ,  H01L21/60

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。

公开(公告)号：US20070159204A1

公开(公告)日：2007-07-12

申请号：US11620799

申请日：2007-01-08

Applicant: Satoru Hara ,  Shuzo Akejima

Inventor： Satoru Hara ,  Shuzo Akejima

IPC: G01R31/26

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/4046 ,  H05K7/142 ,  H05K2201/10416 ,  H05K2201/10704 ,  H05K2201/2036 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract translation: 半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。 外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。

公开(公告)号：US20070128845A1

公开(公告)日：2007-06-07

申请号：US11408072

申请日：2006-04-21

Applicant: Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

Inventor： Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC: H01L21/4763 ,  H01L23/48

CPC classification number: H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

Abstract: An interconnect structure of an integrated circuit and manufacturing method therefor are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

Abstract translation: 提供了一种集成电路的互连结构及其制造方法，涉及柔性封装的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US07215540B2

公开(公告)日：2007-05-08

申请号：US11008901

申请日：2004-12-10

Applicant: Shih-Hsiung Lien

Inventor： Shih-Hsiung Lien

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H01R12/16

CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

Abstract: A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.

Abstract translation: 存储器模块包括多个存储器单元，组装保持器和接合装置。 组装保持器包括细长单元壳体，其具有沿其延伸的至少一个细长的接收槽。 接合装置包括设置在其中一个存储器基板的侧边缘部分处的第一组装接头和设置在相邻存储器基板的相应侧边缘部分处的第二组装接头，其中第一组装接头可以与 相邻存储器单元的第二组装接头，以边缘到边缘方式彼此对准地将存储单元彼此对准地插入到细长单元壳体的接收槽中。

公开(公告)号：US20070025108A1

公开(公告)日：2007-02-01

申请号：US11495043

申请日：2006-07-28

Applicant: Howard Kingsford ,  Kristel Ferry ,  William Clune ,  Mark Clarner ,  Bryan Blackmon

Inventor： Howard Kingsford ,  Kristel Ferry ,  William Clune ,  Mark Clarner ,  Bryan Blackmon

IPC: F21V29/00

CPC classification number: H05K3/0014 ,  B29C2043/465 ,  B29L2031/729 ,  F21S4/20 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/301 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10S362/80

Abstract: A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The mounting structure is a pin receptacle constructed to receive a pin of the light emitting diode device. An electrically conductive portion is carried by the resin base and positioned for electric connection to conductors of the device. Another flexible circuit carries discrete integrated circuit chips and a field of fastener elements extending from a surface of a resin strip carrying conductive traces interconnecting the chips.

Abstract translation: 柔性电路具有卷成型热塑性树脂基片，其具有整体模制的安装结构，其被定位成在发光位置接收发光二极管器件。 安装结构是构造成接收发光二极管器件的引脚的引脚插座。 导电部分由树脂基底承载并且定位成与装置的导体电连接。 另一个柔性电路承载分离的集成电路芯片和从承载导电迹线的树脂带的表面延伸的紧固件元件的领域，互连芯片。

公开(公告)号：US07137826B2

公开(公告)日：2006-11-21

申请号：US10906810

申请日：2005-03-08

Applicant: William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Robin A. Susko ,  James R. Wilcox

Inventor： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Robin A. Susko ,  James R. Wilcox

IPC: H01R12/00

CPC classification number: H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0501 ,  H01L2224/05011 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R4/01 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/068 ,  H05K2201/209 ,  H05K2203/1105 ,  H01L2224/05099

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract translation: 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。

公开(公告)号：US20060078732A1

公开(公告)日：2006-04-13

申请号：US11286532

申请日：2005-11-22

Applicant: Christopher Gallant ,  Michel Labrecque ,  Mark Clarner ,  John Demain

Inventor： Christopher Gallant ,  Michel Labrecque ,  Mark Clarner ,  John Demain

IPC: B32B3/26 ,  B32B37/14 ,  B32B18/00

CPC classification number: B29C43/28 ,  B29C43/222 ,  B29C2043/465 ,  B29L2031/729 ,  B60R16/0207 ,  B60R16/0215 ,  H01B7/08 ,  H01B7/40 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/09118 ,  H05K2201/209 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T428/2933

Abstract: An elongated electrical cable or flexible circuit board includes an electrically conductive path and an insulating body encompassing and electrically isolating the conductive path, the insulating body including an exposed surface having an array of fastener elements extending therefrom, the fastener elements arranged and constructed to engage mating fastener elements associated with a supporting surface to selectively secure the cable or flexible circuit board to the supporting surface. The fastener elements can be loop-engageable fasteners and/or loops. Such a cable or flexible circuit board is continuously formed by introducing an electrical insulating material including a thermoplastic resin into a gap formed adjacent a peripheral surface of a rotating mold roll, the mold roll defining an array of cavities therein, the insulating material being introduced under pressure and temperature conditions selected to cause the insulating material to at least partially fill the cavities to form fastener element stems integrally with and extending from one broad side of a strip of said insulation material; while introducing conductive wires and/or a conductive path formed on or within a substrate to the gap so as to cause the insulating material to envelop and electrically isolate the conductive path and/or to cause the conductive path to become an integral part of the strip of insulation material from which the fastener element stems extend.

Abstract translation: 细长的电缆或柔性电路板包括导电路径和绝缘体，其包围并电绝缘导电路径，绝缘体包括具有从其延伸的紧固件元件阵列的暴露表面，所述紧固件元件被布置和构造为接合配合 与支撑表面相关联的紧固元件以选择性地将电缆或柔性电路板固定到支撑表面。 紧固件元件可以是可与圈接合的紧固件和/或环。 这种电缆或柔性电路板通过将包括热塑性树脂的电绝缘材料引入到邻近旋转模具辊的周边表面形成的间隙中而连续地形成，模具辊在其中限定一系列空腔，绝缘材料被引入到 选择的压力和温度条件使得绝缘材料至少部分地填充空腔以与所述绝缘材料的条带的一个宽侧一体地形成并从其延伸; 同时将导电线和/或形成在基板上或内部的导电路径引入到间隙，以便使绝缘材料包封并电绝缘导电路径和/或使导电路径成为带的整体部分 的绝缘材料，紧固件元件从其延伸。

公开(公告)号：US20050146856A1

公开(公告)日：2005-07-07

申请号：US11008901

申请日：2004-12-10

Applicant: Shih-Hsiung Lien

Inventor： Shih-Hsiung Lien

IPC: H05K1/14 ,  H05K5/00

CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

Abstract: A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.

Abstract translation: 存储器模块包括多个存储器单元，组装保持器和接合装置。 组装保持器包括细长单元壳体，其具有沿其延伸的至少一个细长的接收槽。 接合装置包括设置在其中一个存储器基板的侧边缘部分处的第一组装接头和设置在相邻存储器基板的相应侧边缘部分处的第二组装接头，其中第一组装接头可以与 相邻存储器单元的第二组装接头，以边缘到边缘方式彼此对准地将存储单元彼此对准地插入到细长单元壳体的接收槽中。