公开(公告)号：US20240014118A1

公开(公告)日：2024-01-11

申请号：US18214572

申请日：2023-06-27

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Chih-Ming Peng ,  Pi-Yu Peng ,  Hui-Yu Huang ,  Yin-Chen Lin

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L24/14 ,  H01L24/13 ,  H01L2224/14163 ,  H01L2224/13013 ,  H01L2224/16227

Abstract: In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.

公开(公告)号：US20230380072A1

公开(公告)日：2023-11-23

申请号：US18109334

申请日：2023-02-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Hui Chen ,  Yi-Hua Huang ,  Yen-Ping Huang ,  Shih-Chieh Chang

IPC: H05K3/04

CPC classification number: H05K3/041 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0191 ,  H05K2203/0278

Abstract: A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.

公开(公告)号：US20230378044A1

公开(公告)日：2023-11-23

申请号：US18109337

申请日：2023-02-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chin-Tang Hsieh ,  Lung-Hua Ho ,  Chih-Ming Kuo ,  Chun-Ting Kuo ,  Yu-Hui Hu ,  Chih-Hao Chiang ,  Chen-Yu Wang ,  Kung-An Lin ,  Pai-Sheng Cheng

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13014 ,  H01L2224/16227

Abstract: A flip-chip bonding structure includes a substrate and a chip. A lead of the substrate includes a body, a hollow opening, a bonding island and at least one connecting bridge. The hollow opening is in the body and surrounded by the body. The bonding island is located in the hollow opening such that there is a hollow space in the hollow opening and located between the body and the bonding island. The connecting bridge is located in the hollow space to connect the body and the bonding island. A bump of the chip is bonded to the bonding island by a solder. The solder is restricted on the bonding island and separated from the body by the hollow space so as to avoid the solder from overflowing to the body and avoid the chip from shifting.

公开(公告)号：US20230326894A1

公开(公告)日：2023-10-12

申请号：US18078170

申请日：2022-12-09

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Fei-Jain Wu ,  Sheng-Jen Wu ,  Hsueh-Shun Yeh

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/13 ,  H01L2224/05573 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/81 ,  H01L24/05 ,  H01L21/563 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/3011 ,  H01L2224/32225 ,  H01L2224/81201 ,  H01L2224/83201 ,  H01L2224/13007 ,  H01L2224/13019 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L24/73

Abstract: In a bonding process of a flip chip bonding method, a chip is bonded to contact pads of a substrate by composite bumps which each includes a raiser, a UBM layer and a bonding layer. Before the bonding process, the surface of the bonding layer facing toward the substrate is referred to as a surface to be bonded. During the bonding process, the surface to be bonded is boned to the contact pad and become a bonding surface on the contact pad. The bonding surface has an area greater than that of the surface to be bonded so as to reduce electrical impedance between the chip and the substrate.

公开(公告)号：US20230187378A1

公开(公告)日：2023-06-15

申请号：US17988846

申请日：2022-11-17

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Shrane-Ning Jenq ,  Chen-Yu Wang ,  Chin-Tang Hsieh ,  Shu-Yeh Chang ,  Lung-Hua Ho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/49811 ,  H01L21/561

Abstract: In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.

公开(公告)号：US11581283B2

公开(公告)日：2023-02-14

申请号：US16910461

申请日：2020-06-24

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/498

Abstract: A flip chip package includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board. The solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit is on the inner bonding area. The T-shaped circuit unit has a main part, a connection part, and a branch part. The connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to inhibit solder shorts caused by solder overflow on the branch part.

公开(公告)号：US20230044345A1

公开(公告)日：2023-02-09

申请号：US17848481

申请日：2022-06-24

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Pei-Wen Wang ,  Hsin-Hao Huang ,  Gwo-Shyan Sheu

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/498

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a circuit layer, a flip-chip element and an anti-stress circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. Bonding circuits and transmission circuits of the circuit layer are disposed on the chip mounting area and the circuit area respectively. The flip-chip element is disposed on the chip mounting area and includes bumps and a chip having a long side margin and conductive pads, the bumps are provided to connect the conductive pads and the bonding circuits. Anti-stress circuits of the anti-stress circuit layer are disposed on the chip mounting area and parallel to the long side margin of the chip, and the bumps are located between the anti-stress circuits and the long side margin of the chip.

公开(公告)号：US20230039895A1

公开(公告)日：2023-02-09

申请号：US17741543

申请日：2022-05-11

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K1/11

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

公开(公告)号：US11503698B1

公开(公告)日：2022-11-15

申请号：US17494002

申请日：2021-10-05

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Ling Hsieh ,  Pei-Ying Lee ,  Dong-Sheng Li

IPC: H05K1/02 ,  F28F21/08 ,  H05K7/20

Abstract: A flexible circuit board includes a flexible substrate, an electronic component and a heat spreader. The electronic component and the heat spreader are disposed on a top surface and a bottom surface of the flexible substrate, respectively. The heat spreader includes a copper layer which contains more than or equal to 50% copper grains by volume with (1,0,0) crystallographic orientation.

公开(公告)号：US20220337216A1

公开(公告)日：2022-10-20

申请号：US17856036

申请日：2022-07-01

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Cheng-Fan Lin

IPC: H03H9/02 ,  H01L41/047 ,  H03H9/05 ,  H03H9/145

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a supportive layer, a cover layer and a pillar bump. The supportive layer is disposed on the piezoelectric substrate and around a transducer, the cover layer covers the supportive layer, and the pillar bump is located in a lower via hole of the supportive layer and an upper via hole of the cover layer. The upper via hole has a lateral opening located on a lateral surface of the cover layer, and the pillar bump in the cover layer protrudes from the lateral surface of the cover layer via the lateral opening.