中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

147 records (took 0.014 seconds)

    Root mean square sensor device
    113.
    发明授权
    Root mean square sensor device 有权

    公开(公告)号：US11884538B2

    公开(公告)日：2024-01-30

    申请号：US17487203

    申请日：2021-09-28

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Marco Corsi ,  Barry Jon Male

    IPC: B81B7/02 ,  B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/008 ,  B81B7/007 ,  B81B7/02 ,  B81C1/00238 ,  B81B2201/0278

    Abstract: A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.

    Sensor and electronic device
    114.
    发明授权
    Sensor and electronic device 有权

    公开(公告)号：US11834326B2

    公开(公告)日：2023-12-05

    申请号：US17461835

    申请日：2021-08-30

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Kei Masunishi ,  Yasushi Tomizawa ,  Etsuji Ogawa ,  Ryunosuke Gando ,  Shiori Kaji ,  Hiroki Hiraga ,  Fumito Miyazaki ,  Daiki Ono

    IPC: B81B3/00

    CPC classification number: B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2203/04 ,  B81B2203/06

    Abstract: According to one embodiment, a sensor includes a first detection element. The first detection element includes a base body, a first support member fixed to the base body, a conductive first movable member, and a first conductive part fixed to the base body. The first movable member includes first, second, third, fourth and fifth movable parts. In a second direction crossing a first direction from the base body toward the first movable member, the third movable part is between the first and second movable parts. In the second direction, the fourth movable part is between the first and third movable parts. In the second direction, the fifth movable part is between the third and second movable parts. The first movable part is supported by the first support member. The second, third, fourth and fifth movable parts are separated from the base body.

    ENVIRONMENTAL SENSOR AND MANUFACTURING METHOD THEREOF
    119.
    发明申请
    ENVIRONMENTAL SENSOR AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20180356255A1

    公开(公告)日：2018-12-13

    申请号：US15781352

    申请日：2015-12-14

    Applicant: Goertek Inc.

    Inventor： Junkai ZHAN ,  Mengjin CAI

    IPC: G01D5/241

    CPC classification number: G01D5/2417 ,  B81B2201/0214 ,  B81B2201/0221 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/053 ,  B81C1/00182 ,  B81C1/00214 ,  G01K7/34 ,  G01L9/0045 ,  G01L9/0047 ,  G01L9/0073

    Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.

Patent Agency Ranking