Abstract:
An ion implantation system composed of an ion source to generate ion beam, a mass analyzing region to select ions having a predetermined mass from the ion beam, an acceleration region to accelerate the ion beam selected, scanning regions to respectively scan the ion beam toward the X and Y directions, and protecting means located along the exposed surface of the inner wall of the mass analyzing region. The protecting means may be formed of a thin silicon plate, and located to cover the inner wall of the mass analyzing region. Preferably, the silicon plate is located at an upper and a lower portion of an exposed surface of the inner wall of the mass analyzing region. The protecting means may be formed of plurality of silicon plates that can be disassembled.
Abstract:
An ion implantation apparatus including a resolving aperture-shutter assembly (31) placed in the ion beam path (18). The resolving aperture-shutter assembly includes a movable shutter (34) and a shutter housing surrounding the movable shutter (34). Selected ions in an ion beam path (18) pass through a hole (44) in movable shutter (34) when the movable shutter (34) is in a first position, and are blocked by the solid surfaces when the movable shutter (34) is in a second position. The enclosure (32, 33, 39) completely surrounds the movable shutter (34). The enclosure (32, 33, 39) includes a first aperture (42) aligned with the ion beam path (18) for allowing the selected ions to enter the enclosure and a second aperture (41) aligned with the ion beam path (18) for allowing the selected ions to exit the enclosure after passing through the hole (44) in the movable shutter.
Abstract:
A charged particle beam exposure system is directed to an exposure process of an electron beam for sequentially scanning an electron beam employing a blanking aperture array including a plurality of blanking apertures. The system facilitates re-focusing for compensation of focus error due to Coulumb effect and makes wiring the blanking aperture array easier. The system further allows exposure without an irradiation gap. The blanking aperture array 6 is formed with a plurality of said blanking apertures 62 arranged in a two-dimensional configuration. A control system 24 controls the blanking aperture array 62 to set the blanking aperture to the ON state where the charged particle beams pass through the blanking aperture and reach the object 19 to be exposed or the OFF state where the charged particle beams cannot reach the object 19 to be exposed. The other control system of the control means performs a control so that a plurality of said charged particle beams that have passed through different blanking apertures of said blanking aperture array overlaps and is irradiated a plurality of times onto the specified position or the peripheral position in the vicinity of the specified position of the object to be exposed to the charged particle beams.
Abstract:
An electron-beam exposure apparatus includes a sample stage for holding a sample, an electron gun, a first aperture for shaping an electron beam emitted from the electron gun, an electro-optical device for causing an electron beam formed by the first aperture to be deflected and to be converged on a sample held on the sample stage, a second aperture in which a plurality of block patterns are formed, for shaping an electron beam from an electro-optical device, and a movement device for moving the second aperture in order to cause an electron beam from the electro-optical device to strike a desired block pattern among a plurality of the block patterns.
Abstract:
An ion implantation system is modified to allow variation in the size of the aperture of the mass resolving system, thereby allowing more ions of one mass or ion of more than one mass, such as isotopes, to pass through said opening. Including all isotopes of the desired dopant ions to be collected increases beam current, and consequently the throughput of the implantation process, reduces contamination, and improves the dosage control.
Abstract:
The invention relates to a process for the protection of a diaphragm during the generation of electron-beam pulses by means of alternately deflecting the electron beam onto the diaphragm and onto a processing site.In order to prevent damage to the diaphragm from the thermal effect of the electron beam, the electron beam is distributed with respect to space and/or time over an enlarged striking surface.
Abstract:
A scanning electron microscope includes a heater coil which is arranged around a sample, an electron beam which is radiated when the sample is heated, and a secondary electron generated from the sample which is attracted to a photo multiplier. In this electron microscope, a shield plate is provided having an extracting hole for extracting the secondary electron outside of the heat coil in such a manner that the extracting hole is aligned with a light axis of the electron beam. The shield plate is connected to a power source which supplies a variable voltage so that a desired voltage can be applied to the shield plate so as to shield thermal electrons.
Abstract:
A shaping aperture used in a charged particle forming system and provided with a slit for shaping the cross section of a charged beam emitted is disclosed in which at least two thin plates each provided with a through-hole for passing the charged particle beam therethrough are piled so as to form a shaping slit of a desired form by the through-holes.
Abstract:
An electron microscope comprises an objective lens, at least an intermediate lens and a projector lens arrayed in this order on an optical axis. A movable aperture element is disposed between the objective lens and the intermediate lens whose disposition and magnetic excitation are so selected that electron beam diverging from a crossover produced at a back focal plane of the objective lens is focused on a plane of the movable aperture element. In the case of an electron microscope comprising an objective lens, an objective aperture element, a selected area aperture element, at least an intermediate lens and a projector lens arrayed in this order along an optical axis, an additional lens is disposed between the objective aperture element and the selected area aperture element. Disposition and magnetic excitation of the additional lens are so selected that electron beam diverging from a crossover produced at a back focal plane of the objective lens is focused at a plane of the selected area aperture element. In both electron microscopes, divergence angle of the electron beam scattered by a specimen is restricted by the movable aperture element or the selected area aperture element.
Abstract:
A method of manufacturing an aperture stop with a rectangular aperture for an electron beam exposure device, comprising the steps of: preparing a single-crystal silicon substrate with one side having a (100) face; providing a mask on said side of the substrate; selectively etching the substrate through the mask from said side to form a projecting portion of rectangular cross section by anisotropic etching; forming an aperture layer by covering said one side of the etched substrate with a high-melting-point metal having good electric conductivity, thereby surrounding said projecting portion; and forming in said aperture layer a rectangular aperture with a cross section corresponding to the cross section of said projecting portion by removing said substrate from the aperture layer.