公开(公告)号：US20090183911A1

公开(公告)日：2009-07-23

申请号：US12348514

申请日：2009-01-05

Applicant: Masahiro SUNOHARA ,  Kei Murayama ,  Takaharu Yamano

Inventor： Masahiro SUNOHARA ,  Kei Murayama ,  Takaharu Yamano

IPC: H05K1/11 ,  B05D5/12

CPC classification number: H05K3/4092 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2924/01322 ,  H05K3/062 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0311 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/1059 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A wiring board includes an external connection terminal of a cylindrical shape, in which an electrode terminal of the electronic component to be mounted is fitted. In one configuration, a portion of the external connection terminal is electrically connected to a pad portion formed on an electronic component mounting surface side of the wiring board, and the external connection terminal is curvedly formed in such a shape that the outer periphery of the electrode terminal comes into close contact with the inner periphery of the middle portion of the external connection terminal when the electrode terminal is inserted into the external connection terminal.

Abstract translation: 布线基板包括一个圆柱形外部连接端子，其中安装有电子元件的电极端子。 在一种构造中，外部连接端子的一部分电连接到形成在布线板的电子部件安装表面侧上的焊盘部分，并且外部连接端子被弯曲地形成为使得电极的外周 当电极端子插入外部连接端子时，端子与外部连接端子的中间部分的内周紧密接触。

公开(公告)号：US20090008540A1

公开(公告)日：2009-01-08

申请号：US12217400

申请日：2008-07-03

Applicant: Yoshinori Tanida

Inventor： Yoshinori Tanida

IPC: H01L27/14

CPC classification number: H04N5/2251 ,  H04M1/0264 ,  H04N5/2257 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/10121 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611

Abstract: In a camera device of the present invention, a camera module 2 is mounted on a substrate 1 provided in the camera device by use of contact pins 3 for connecting first terminals provided on a backside of the camera module 2 to second terminals provided on the substrate 1. The contact pins 3 have first and second ends, and the first ends are soldered to ones of the first and second terminals and the second ends have contact with the other ones of the first and second terminals, respectively, so that the camera module 2 is electrically connected to the substrate 1, and the contact pins 3 are provided independently. This decreases restrictions on mounting the camera module 2 on the substrate 1, and also makes it possible to provide a camera device, in which the camera module 2 can be easily mounted on the substrate 1.

Abstract translation: 在本发明的相机装置中，相机模块2通过使用用于将设置在相机模块2的背面的第一端子连接到设置在基板上的第二端子的接触针3安装在设置在相机装置中的基板1上 接触销3具有第一和第二端，并且第一端被焊接到第一端子和第二端子中的一端，并且第二端分别与第一端子和第二端子中的另一端接触，使得相机模块 2电连接到基板1，并且接触销3独立地设置。 这降低了将相机模块2安装在基板1上的限制，并且还能够提供相机装置，其中相机模块2可以容易地安装在基板1上。

公开(公告)号：US20080305650A1

公开(公告)日：2008-12-11

申请号：US11758003

申请日：2007-06-05

Applicant: I-Ming Chen

Inventor： I-Ming Chen

IPC: H01R12/00

CPC classification number: H01R13/2442 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10424 ,  H05K2201/10924

Abstract: A conducting terminal mounting structure is disclosed to include a housing having an accommodation chamber and an insertion hole, a circuit board, which is mounted in the accommodation chamber inside the housing and has multiple electric contacts and an adapter interface electrically connectable to an external electronic apparatus, and a terminal set, which comprises multiple conducting terminals and an electrically insulative locating block formed integral with the conducting terminals and fastened to the circuit board to hold the conducting terminals in connection with the circuit board electrically.

Abstract translation: 公开了一种导电端子安装结构，包括具有容纳室和插入孔的壳体，电路板，其安装在壳体内的容纳室中，并具有多个电触头和可与外部电子设备电连接的适配器接口 以及端子组，其包括多个导电端子和与导电端子一体形成的电绝缘定位块，并且固定到电路板以将导电端子与电路板电连接。

公开(公告)号：US07458844B2

公开(公告)日：2008-12-02

申请号：US11309403

申请日：2006-08-04

Applicant: Chun-Hung Chen

Inventor： Chun-Hung Chen

IPC: H01R31/08

CPC classification number: H05K1/0216 ,  H05K1/0215 ,  H05K3/222 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/10409

Abstract: A grounding device for reducing electromagnetic interference (EMI) on a printed circuit board (PCB) includes a grounded portion formed on the PCB, a threaded hole defined in the PCB, and a connecting member. The grounded portion is a part of a grounding layer of the PCB and with high impedance. The threaded hole is grounded and with low impedance. The connecting member includes a first connecting tab and a second connecting tab separately formed at opposite ends thereof. The first connecting tab is electrically connected with the threaded hole via a screw. The second connecting end resiliently abuts against the grounded portion of the PCB.

Abstract translation: 用于降低印刷电路板（PCB）上的电磁干扰（EMI）的接地装置包括形成在PCB上的接地部分，在PCB中限定的螺纹孔和连接部件。 接地部分是PCB的接地层的一部分，具有高阻抗。 螺纹孔接地，阻抗低。 连接构件包括分别形成在其相对端部处的第一连接翼片和第二连接翼片。 第一连接片通过螺丝与螺纹孔电连接。 第二连接端弹性地邻接PCB的接地部分。

公开(公告)号：US20080293261A1

公开(公告)日：2008-11-27

申请号：US12055848

申请日：2008-03-26

Applicant: Olaf Zschieschang ,  Andreas Laschek-Enders

Inventor： Olaf Zschieschang ,  Andreas Laschek-Enders

IPC: H05K1/00

CPC classification number: H01L23/433 ,  H01L23/367 ,  H01L23/4093 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/0311 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An arrangement between a power semiconductor module and a printed circuit board is disclosed, A printed circuit board includes strip conductors, and a power semiconductor module includes a module housing and power terminals. The power terminals extend to the exterior of the module housing and into contact with the strip conductors. A heat sink is disposed on a side of the power semiconductor module opposite the circuit board. A deformable means is disposed between the module housing and the circuit board and is configured to relieve a contact pressure load on the power terminals. A contact-pressure element is disposed on a side of the circuit board opposite the power semiconductor module. The contact-pressure element is integral with a first housing part of an arrangement housing, and the heat sink is integral with a second housing part of the arrangement housing. The two housing parts enclose the circuit board.

Abstract translation: 公开了功率半导体模块和印刷电路板之间的布置。印刷电路板包括带状导体，功率半导体模块包括模块外壳和电源端子。 电源端子延伸到模块外壳的外部并与条形导体接触。 散热器设置在与电路板相对的功率半导体模块的一侧。 可变形装置设置在模块壳体和电路板之间，并且构造成减轻电源端子上的接触压力负载。 接触压力元件设置在与功率半导体模块相对的电路板的一侧。 接触压力元件与布置壳体的第一壳体部分成一体，并且散热器与布置壳体的第二壳体部分成一体。 两个外壳部分包围电路板。

公开(公告)号：US20080218799A1

公开(公告)日：2008-09-11

申请号：US12124081

申请日：2008-05-20

Applicant: Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

Inventor： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC: G06K1/00 ,  H01R13/627 ,  H05K3/30

CPC classification number: G06F1/1632 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01R24/62 ,  H01R2107/00 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications.

Abstract translation: 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB存储卡包括PCBA，PCBA具有设置在PCB上侧的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展型接触弹簧。 无源元件使用SMT方法安装在PCB的下表面上，IC芯片使用COB方法安装，然后元件和IC芯片被塑料模制外壳覆盖。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。 PCBA包括用于USB和EUSB通信的双人格电子设备。

公开(公告)号：US07292439B2

公开(公告)日：2007-11-06

申请号：US11039212

申请日：2005-01-19

Applicant: James S. Wilson ,  Michael A. Moore

Inventor： James S. Wilson ,  Michael A. Moore

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/3677 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/10734 ,  H05K2203/083 ,  H01L2924/00

Abstract: According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.

Abstract translation: 根据本发明的一个实施例，一种用于电子组件的热管理系统包括耦合到基板的电子部件，耦合到冷板的基板，设置在电子部件和冷板之间并与之接合的弹簧部件，以及 传热元件设置在由弹簧构件形成的腔室内。

公开(公告)号：US07284991B2

公开(公告)日：2007-10-23

申请号：US11140232

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Shigeyuki Hoshikawa ,  Hiroshi Ikeda

Inventor： Atsuhito Noda ,  Shigeyuki Hoshikawa ,  Hiroshi Ikeda

IPC: H01R12/00

CPC classification number: H01R4/028 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81012 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R12/52 ,  H01R12/57 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10719 ,  H05K2201/10946 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环形成为在环的外表面上具有至少一个突起。 突起具有顶点或点，当放置在表面上时，当环被径向作用在环上的力压缩时，将擦拭或刮擦表面。 通过用顶点擦拭接触表面，可以去除可能干扰电信号的表面污染物和分层材料。

公开(公告)号：US07273380B2

公开(公告)日：2007-09-25

申请号：US11657995

申请日：2007-01-25

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20070145996A1

公开(公告)日：2007-06-28

申请号：US11321297

申请日：2005-12-22

Applicant: Sam Shiao ,  Robert Chen

Inventor： Sam Shiao ,  Robert Chen

IPC: G01R31/26

CPC classification number: H05K1/144 ,  H05K1/0271 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2045

Abstract: A circuit board damping assembly provides a damping node for a circuit board coupled in spaced relationship to another circuit board or chassis. The circuit board damping assembly includes a chassis or circuit board forming a base member; a circuit board coupled in spaced relationship to the base member; a first attachment member coupled to the base member; a second attachment member coupled to the circuit board; and a connector coupled between the first and second attachment members. The connector may be a wire coupled to the first and second attachment members.

Abstract translation: 电路板阻尼组件为与另一个电路板或底盘隔开关联的电路板提供阻尼节点。 电路板阻尼组件包括形成基座构件的底座或电路板; 电路板，其与所述基座部件间隔开地联接; 耦合到所述基座构件的第一附接构件; 耦合到所述电路板的第二附接构件; 以及连接在所述第一和第二附接构件之间的连接器。 连接器可以是联接到第一和第二附接构件的线。