公开(公告)号：US09930772B2

公开(公告)日：2018-03-27

申请号：US14983829

申请日：2015-12-30

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： Chad William Morgan ,  Masayuki Aizawa ,  Arash Behziz ,  Brian Patrick Costello ,  Nathan Lincoln Tracy ,  Michael David Herring

IPC: H05K1/02

CPC classification number: H05K1/0245 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0248 ,  H05K1/115 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: Printed circuit includes a planar substrate having opposite sides and a thickness extending therebetween. The sides extend parallel to a lateral plane. The printed circuit also includes a plurality of conductive vias extending through the planar substrate in a direction that is perpendicular to the lateral plane. The conductive vias include ground vias and signal vias. The signal vias form a plurality of quad groups in which each quad group includes a two-by-two array of the signal vias. Optionally, the printed circuit also includes signal traces that electrically couple to the signal vias. The signal traces may form a plurality of quad lines in which each quad line includes four of the signal traces. The four signal traces of each quad line may extend parallel to one another and be in a two-by-two formation.

公开(公告)号：US09545023B2

公开(公告)日：2017-01-10

申请号：US14322538

申请日：2014-07-02

Applicant: Schroff GmbH

Inventor： Dietmar Mann ,  Sergej Dizel ,  Dietmar Gauges ,  Jochen Müller

IPC: H05K7/14 ,  H05K7/18 ,  H05K5/02 ,  H05K1/14

CPC classification number: H05K5/0256 ,  H05K1/144 ,  H05K7/1427 ,  H05K7/1445 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y10T29/53183

Abstract: A cabinet for housing electronic plug-in cards has front and rear card baskets for inserting plug-in cards and first and second vertical backplanes. The front side of the first backplane faces the front of the cabinet and the front side of the second backplane faces the back of the cabinet. A distance piece connects the two backplanes and a counterbore is disposed in at least one of the rear sides of the two backplanes. The depth of the counterbore or the residual thicknesses of the backplane after drilling the counterbore is sized such that the distance between the front side of the second backplane and the front of the cabinet is a predetermined value. This ensures that the plug-in cards pushed onto the second backplane are completely received inside the rear card basket and the front plate of the plug-in cards ends flush with the rear card basket.

Abstract translation: 用于容纳电子插件卡的机柜具有用于插入插卡和第一和第二垂直背板的前后卡筐。 第一背板的前侧面向机柜的前部，第二个背板的前侧面向机柜后部。 距离件连接两个背板，并且在两个背板的至少一个后侧设置沉孔。 钻孔后沉孔的深度或背板的残余厚度的尺寸使得第二背板前侧与机柜前部之间的距离为预定值。 这确保了推到第二背板上的插入卡被完全接收在后卡筐内，插卡的前板与后卡筐齐平。

公开(公告)号：US09468093B2

公开(公告)日：2016-10-11

申请号：US14294865

申请日：2014-06-03

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Eric C. Peterson ,  Christian L. Belady

IPC: H05K1/14 ,  H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0278 ,  G06F1/185 ,  H05K1/141 ,  H05K1/147 ,  H05K3/4691 ,  H05K2201/044

Abstract: A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.

Abstract translation: 柔性中平面包括：印刷电路板，包括：中间部分和至少一个侧部分; 以及设置在中间部分和每个侧部分之间的柔性区域; 其中每个柔性区域允许相应的侧部部分相对于中间部分弯曲。

公开(公告)号：US09320154B2

公开(公告)日：2016-04-19

申请号：US14287242

申请日：2014-05-27

Applicant: HITACHI, LTD.

Inventor： Akira Soeda ,  Chiko Yorita ,  Shinichirou Tooya ,  Takayuki Ono ,  Mitsuru Takahira ,  Yuuichi Sekino ,  Akira Goto ,  Yoshimasa Tashiro ,  Hiroyuki Doi ,  Tsutomu Sakamoto

IPC: H05K3/20 ,  H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K3/4614 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0094 ,  H05K3/306 ,  H05K2201/044 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2201/10189 ,  H05K2201/10234 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49165

Abstract: An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded.

Abstract translation: 在具有穿刺TH的第一多层基板的接合表面上形成连接到需要导电的TH垫的电极，以在电极上形成焊料凸块。 连接到TH焊盘的电极形成在与要形成在第一多层基板上的电极相对的位置处具有穿刺TH的待接合的第二多层基板的接合表面上，以在电极上形成焊料凸块。 通过将作为树脂材料的粘合剂施加到作为固化树脂的芯材的两个表面的树脂材料上，并且在与TH和焊料凸块相对应的位置处分别具有孔，形成三层片。 然后将第一和第二多层基板层压，其中具有彼此面对的接合表面，同时具有定位并插入其中的三层片材，并进行批量热压接。

公开(公告)号：US20150282320A1

公开(公告)日：2015-10-01

申请号：US14666376

申请日：2015-03-24

Applicant: NEC Corporation

Inventor： Wenda HAO

IPC: H05K1/14 ,  H05K7/14

CPC classification number: H05K1/141 ,  H05K3/366 ,  H05K7/1485 ,  H05K7/1487 ,  H05K2201/044 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09127

Abstract: An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.

Abstract translation: 电子设备包括具有形成在主面上的连接器的基板和具有可拆卸地连接到基板的连接器的端子的模块。 该模块包括在安装方向上在终端下方突出的延伸部分。 当该模块连接到基板时，该基板包括旁路部分，旁路部分绕该延伸部分。 旁路部分是形成在基板中的切口或凹部。 延伸部容纳沿安装方向对准的多个部件。 扩展部分从模块的下端通过与每个部件的大小相对应的第一尺寸和从模块的上端到终端的端部的第二尺寸之间的差来延伸。

公开(公告)号：US20150049451A1

公开(公告)日：2015-02-19

申请号：US14531521

申请日：2014-11-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Baoqi Wang ,  Guodong Zhang ,  Fangming Liu

IPC: H05K5/00

CPC classification number: H01R12/737 ,  H04Q1/15 ,  H05K1/14 ,  H05K3/366 ,  H05K5/0065 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189

Abstract: An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Curved male connectors re arranged on each of the first boards and curved female connectors are arranged on each of the second boards. The curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence.

Abstract translation: 互连系统包括第一板组，与第一板组正交的第二板组，以及布置在第一板组和第二板组之间的中心背板。 第一板组包括彼此平行的多个第一板，并且第二板组包括彼此平行的多个第二板。 布置在每个第一板和弯曲阴连接器上的弯曲的阳连接器布置在每个第二板上。 弯曲的阳连接器和弯曲的阴连接器直接配合并且一一对应连接。

公开(公告)号：US08866023B2

公开(公告)日：2014-10-21

申请号：US13265323

申请日：2009-04-17

Applicant: Rachid M. Kadri ,  Stephen F. Contreras

Inventor： Rachid M. Kadri ,  Stephen F. Contreras

IPC: H05K1/11 ,  H05K1/18 ,  G11C5/06 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/181 ,  G11C5/066 ,  H05K1/0237 ,  H05K1/114 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09227 ,  H05K2201/10189 ,  H05K2201/10545 ,  Y02P70/611 ,  Y10T29/49147

Abstract: A method and system are disclosed to reduce trace length and capacitance in a large memory footprint. When more dual in-line memory module (DIMM) connectors are used per memory channel, the overall bus bandwidth may be affected by trace length and trace capacitance. In order to reduce the overall trace length and trace capacitance, the system and method use a palm tree topology placement, i.e., back-to-back DIMM placement, to place surface mount technology (SMT) DIMM connectors (instead of through-hole connectors) back-to-back in a mirror fashion on each side of a printed circuit board (PCB). The system and method may improve signal propagation time when compared to the commonly used traditional topology placements in which all DIMM connectors are placed on one side of the PCB.

Abstract translation: 公开了一种方法和系统，以在大的存储器占用空间中减少迹线长度和电容。 当每个存储器通道使用更多的双列直插存储器模块（DIMM）连接器时，总线带宽可能会受到迹线长度和迹线电容的影响。 为了减少总体走线长度和跟踪电容，系统和方法使用棕榈树拓扑布局，即背对背DIMM放置，放置表面贴装技术（SMT）DIMM连接器（而不是通孔连接器 ）以印刷电路板（PCB）的每一面以镜面方式背对背。 与所有DIMM连接器放置在PCB一侧的常用传统拓扑布局相比，该系统和方法可以提高信号传播时间。

公开(公告)号：US20140295706A1

公开(公告)日：2014-10-02

申请号：US14360408

申请日：2012-11-22

Applicant: ERNI Production GmbH & Co. KG

Inventor： Juergen Lappoehn

IPC: H01R13/6581

CPC classification number: H01R13/6581 ,  H01R12/52 ,  H01R12/585 ,  H01R12/7082 ,  H01R12/737 ,  H01R13/6587 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10189

Abstract: A plug connector featuring shielding of the signal contacts that are arranged in a contact pattern of differential pairs and that form a contact group together with a shielding element surrounding same. The contact groups are arranged in rows and columns. Each shielding contact includes a shielding element and at least one shielding contact element. Each signal contact includes a blade element and a signal contact element. All shielding contact elements within a row are aligned in a straight line. Each of the signal contact elements of each differential pair are aligned in a straight line that forms a 45° angle with the straight line of the shielding contact elements within the row. An arrangement can be made from two such plug connectors and a circuit board, wherein the two plug connectors are rotated 90° relative to each other.

Abstract translation: 一种插头连接器，其特征在于，以差分对的接触图案布置的信号触点屏蔽，并且与围绕其的屏蔽元件一起形成接触组。 接触组按行和列排列。 每个屏蔽触点包括屏蔽元件和至少一个屏蔽触点元件。 每个信号触点包括刀片元件和信号接触元件。 一行内的所有屏蔽接触元件都以直线对齐。 每个差分对的每个信号接触元件以与行内的屏蔽接触元件的直线形成45°角的直线对准。 可以从两个这样的插头连接器和电路板进行布置，其中两个插头连接器相对于彼此旋转90度。

公开(公告)号：US08841560B1

公开(公告)日：2014-09-23

申请号：US13289558

申请日：2011-11-04

Applicant: Brian Doane Roberts

Inventor： Brian Doane Roberts

IPC: H05K1/11 ,  H05K7/00

CPC classification number: H05K7/1449 ,  H05K1/114 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/044

Abstract: Herein disclosed are an apparatus, a system and a method, selectively linking signals between or among slots on a backplane. A backplane printed circuit board has defined slots, each of which receives a card or module. One or more arrays of solder ball mounting pads correspond to signal lines of the slots. Each of one or more signal mapping overlay printed circuit boards has at least one signal trace connected to solder ball landing pads. Selected solder ball mounting pads of the backplane printed circuit board are connected to selected solder ball landing pads of the signal mapping overlay printed circuit board by solder balls. The signal trace or traces of the signal mapping overlay printed circuit board or boards connect the corresponding selected signal lines between or among the slots of the backplane. The backplane and signal mapping overlay printed circuit boards may have mirrored connection arrays.

Abstract translation: 这里公开了一种装置，系统和方法，有选择地在背板之间或槽之间链接信号。 背板印刷电路板具有限定的槽，每个槽接收卡或模块。 焊球安装焊盘的一个或多个阵列对应于槽的信号线。 一个或多个信号映射重叠印刷电路板中的每一个具有连接到焊球着陆焊盘的至少一个信号迹线。 背板印刷电路板的选定的焊球安装焊盘通过焊球连接到信号映射覆盖印刷电路板的选定焊球着陆焊盘。 信号映射叠加印刷电路板或电路板的信号迹线或迹线连接背板之间或之间的相应选定信号线。 背板和信号映射覆盖印刷电路板可能具有镜像连接阵列。

公开(公告)号：US08715006B2

公开(公告)日：2014-05-06

申请号：US13493632

申请日：2012-06-11

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R13/648

CPC classification number: H01R13/6594 ,  H01R12/585 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09618 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2203/0207 ,  H05K2203/0242

Abstract: A circuit board including a board substrate having opposite first and second sides. The board substrate has a thickness measured along a z-axis that is perpendicular to the first and second sides. The circuit board also includes plated thru-hole (PTH) vias extending along the z-axis from the first side into the board substrate. The PTH vias are arranged to form multiple signal pairs. The circuit board also includes signal traces that are directly coupled to the PTH vias and extend perpendicular to the z-axis in the board substrate. The signal traces and the PTH vias are configured to transmit differential signals. The circuit board also includes ground columns that extend along the z-axis in the board substrate. The ground columns are distributed relative to the signal pairs to form shield arrays. Each of the shield arrays surrounds one of the signal pairs, wherein the ground columns comprise microvias.

Abstract translation: 一种电路板，包括具有相对的第一和第二侧面的板基板。 板基板具有沿着垂直于第一和第二侧的z轴测量的厚度。 电路板还包括沿着z轴从第一侧延伸到板基板的电镀通孔（PTH）通孔。 PTH通孔被布置成形成多个信号对。 电路板还包括直接耦合到PTH通孔并垂直于板基板中的z轴延伸的信号迹线。 信号迹线和PTH通孔配置为传输差分信号。 电路板还包括沿着板基板中的z轴延伸的接地柱。 接地柱相对于信号对分布以形成屏蔽阵列。 每个屏蔽阵列围绕信号对中的一个，其中接地列包括微孔。