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    Capacitive pressure sensor and method
    121.
    发明授权
    Capacitive pressure sensor and method 有权
    电容式压力传感器及方法

    公开(公告)号：US09302906B2

    公开(公告)日：2016-04-05

    申请号：US14042861

    申请日：2013-10-01

    Applicant: Robert Bosch GmbH

    Inventor： Ando Feyh ,  Andrew B. Graham

    IPC: G01L9/00 ,  B81C1/00 ,  B81B3/00

    CPC classification number: B81C1/00476 ,  B81B3/0021 ,  B81B2201/0264 ,  B81C1/00182 ,  G01L9/0042 ,  G01L9/0073

    Abstract: In one embodiment, a method of forming a MEMS device includes providing a silicon wafer with a base layer and an intermediate layer above an upper surface of the base layer. A first electrode is defined in the intermediate layer and an oxide portion is provided above an upper surface of the intermediate layer. A cap layer is provided on an upper surface of the oxide portion and a second electrode is defined in the cap layer. The method further includes etching the oxide portion to form a cavity such that when the second electrode and the cavity are projected onto the intermediate layer, the projected second electrode encompasses the projected cavity.

    Abstract translation: 在一个实施例中，形成MEMS器件的方法包括在基底层的上表面上方提供具有基底层和中间层的硅晶片。 在中间层中限定第一电极，并且在中间层的上表面上方设置氧化物部分。 盖层设置在氧化物部分的上表面上，第二电极限定在盖层中。 该方法还包括蚀刻氧化物部分以形成空腔，使得当第二电极和空腔被投射到中间层上时，突出的第二电极包围投影腔。

    PRESSURE SENSOR INCLUDING DEFORMABLE PRESSURE VESSEL(S)
    123.
    发明申请
    PRESSURE SENSOR INCLUDING DEFORMABLE PRESSURE VESSEL(S) 有权
    压力传感器，包括可变压力容器（S）

    公开(公告)号：US20160061679A1

    公开(公告)日：2016-03-03

    申请号：US14474059

    申请日：2014-08-29

    Applicant: Kionix, Inc.

    Inventor： Scott G. Adams ,  Charles W. Blackmer ,  Kristin J. Lynch

    IPC: G01L9/00

    CPC classification number: G01L9/003 ,  B81B3/0072 ,  B81B2201/0264 ,  B81C1/00 ,  B81C1/00666 ,  B81C2201/0167 ,  G01L9/0027 ,  G01L9/0055 ,  G01L9/0073 ,  G01L9/008 ,  G01L9/0082 ,  G01L13/00 ,  G01L13/02 ,  G01P15/006 ,  G01P15/08 ,  H01L21/00

    Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.

    Abstract translation: 本文描述了使用包括可变形压力容器的压力传感器进行压力感测的技术。 压力容器是具有限定空隙的横截面的物体。 可变形压力容器是具有至少一个弯曲部分的压力容器，该弯曲部分构造成基于空腔中的腔体压力之间的压力差而在结构上变形（例如弯曲，剪切，细长等），其中至少一个 压力容器的一部分被悬浮并且在压力容器中存在容器压力。

    MICRO ELECTRO MECHANICAL SYSTEM
    124.
    发明申请
    MICRO ELECTRO MECHANICAL SYSTEM 有权
    微电子机械系统

    公开(公告)号：US20160060098A1

    公开(公告)日：2016-03-03

    申请号：US14644184

    申请日：2015-03-10

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Tamio IKEHASHI

    IPC: B81B3/00

    CPC classification number: B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0127 ,  G01L9/0073

    Abstract: According to an embodiment, a MEMS includes a substrate; a substrate; a membrane arranged above the substrate; a first conductor with a first plane, the first conductor being connected to the membrane; and a second conductor with a second plane facing the first plane, the second conductor being arranged with a gap between the first conductor and the second conductor, wherein relative positions of the first conductor and the second conductor change in a direction in which an area of the first plane facing the second plane changes.

    Abstract translation: 根据实施例，MEMS包括基板; 底物; 布置在所述基板上方的膜; 具有第一平面的第一导体，所述第一导体连接到所述膜; 以及具有面向所述第一平面的第二平面的第二导体，所述第二导体在所述第一导体和所述第二导体之间布置有间隙，其中所述第一导体和所述第二导体的相对位置沿着 面对第二架飞机的第一架飞机改变了。

    High temperature pressure sensor
    126.
    发明授权
    High temperature pressure sensor 有权
    高温压力传感器

    公开(公告)号：US09261425B2

    公开(公告)日：2016-02-16

    申请号：US14192952

    申请日：2014-02-28

    Applicant: Rosemount Aerospace Inc.

    Inventor： Saeed Fahimi ,  Odd Harald Steen Eriksen ,  Charles Little ,  Anita Fink

    IPC: G01L19/04 ,  G01L19/06 ,  G01L19/00

    CPC classification number: G01L19/0681 ,  B81B2201/0264 ,  G01L19/0069 ,  G01L19/0084

    Abstract: A pressure sensor assembly includes a pressure sensor having a pressure sensing transducer connected to a plurality of electrode pins via a plurality of electrode pads disposed on the transducer, an inner casing configured to hold the pressure sensing transducer including a plurality of inner casing electrode pin channels having the electrode pins disposed therein. The pressure sensor further includes an outer casing holding the inner casing therein having a capsule header with a plurality of capsule header electrode pin channels defined therein which can include a ceramic seal disposed therein such that the capsule header electrode pin channels engage the electrode pins in an insulating sealed relationship. The outer casing further includes an isolator plate including an isolator plate fluid port defined therein and a pressure isolator disposed on the isolator plate and configured to deflect in response to a change in ambient pressure. The pressure sensor includes a pressure transmitting fluid disposed in the fluid volume.

    Abstract translation: 压力传感器组件包括压力传感器，压力传感器具有通过设置在换能器上的多个电极焊盘连接到多个电极引脚的压力感测传感器，配置成保持压力感测换能器的内壳体，该内部壳体包括多个内壳电极引脚通道 其中设置有电极引脚。 所述压力传感器还包括一个将所述内部壳体保持在其中的外壳，所述外壳具有胶囊集管，所述胶囊集管具有限定在其中的多个胶囊集管电极销通道，其中可以包括设置在其中的陶瓷密封件，使得所述胶囊集管电极销通道以 绝缘密封关系。 外壳还包括隔离板，隔离板包括限定在其中的隔离板流体端口和隔离器，隔离器设置在隔离板上并被配置为响应于环境压力的变化而偏转。 压力传感器包括设置在流体体积中的压力传递流体。

    CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
    128.
    发明申请
    CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    芯片包装及其制造方法

    公开(公告)号：US20160039663A1

    公开(公告)日：2016-02-11

    申请号：US14819174

    申请日：2015-08-05

    Applicant: XINTEC INC.

    Inventor： Chien-Min LIN

    IPC: B81B7/00 ,  H01L21/48 ,  B81C1/00 ,  H01L23/498

    CPC classification number: B81B7/007 ,  B81B7/0058 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2207/096 ,  B81C1/00301 ,  B81C1/00682 ,  B81C2203/0118 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method includes forming a bump on a lower surface of an interposer. A first insulation layer is formed to cover the lower surface and bump. A trench is formed extending from the lower towards an upper surface of the interposer. A polymer supporting adhesive layer is formed to surround the bump and couples between the interposer and a semiconductor chip. The semiconductor chip has at least a sensing component and a conductive pad electrically connected to the sensing component, and the bump is connected to the conductive pad. A via is formed extending from the upper towards the lower surface. A second insulation layer is formed to cover the upper surface and the via. A redistribution layer is formed on the second insulation layer and in the via. A packaging layer is formed to cover the redistribution layer and has a second opening.

    Abstract translation: 一种方法包括在插入器的下表面上形成凸块。 形成第一绝缘层以覆盖下表面和凸起。 形成从插入件的下表面延伸到上表面的沟槽。 形成聚合物支持粘合剂层以围绕凸起并且在插入器和半导体芯片之间耦合。 半导体芯片具有至少一个感测部件和电连接到感测部件的导电焊盘，并且凸块连接到导电焊盘。 通孔形成为从上部向下表面延伸。 形成第二绝缘层以覆盖上表面和通孔。 在第二绝缘层和通孔中形成再分布层。 形成包装层以覆盖再分布层并具有第二开口。

    CMOS-MEMS integrated flow for making a pressure sensitive transducer
    129.
    发明授权
    CMOS-MEMS integrated flow for making a pressure sensitive transducer 有权
    用于制造压敏传感器的CMOS-MEMS集成流

    公开(公告)号：US09254997B2

    公开(公告)日：2016-02-09

    申请号：US14013080

    申请日：2013-08-29

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chun-Wen Cheng ,  Kai-Chih Liang ,  Chia-Hua Chu

    IPC: H01L29/66 ,  B81C1/00

    CPC classification number: B81C1/00238 ,  B81B2201/0264

    Abstract: A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (MEMS) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate. A second substrate includes a complementary metal oxide semiconductor (CMOS) device and a receiving structure made up of sidewalls that meet a conductive surface which is recessed from a first face of the second substrate. A conductive bonding material physically adheres the conductive contact structure to the conductive surface and electrically couples the MEMS structure to the CMOS device.

    Abstract translation: 传感器由粘合在一起的两个基板组成。 第一衬底包括压敏微电机械（MEMS）结构和向外突出超过第一衬底的第一面的导电接触结构。 第二基板包括互补金属氧化物半导体（CMOS）器件和由侧壁构成的接收结构，所述接收结构满足从第二基板的第一面凹入的导电表面。 导电接合材料将导电接触结构物理地粘附到导电表面并将MEMS结构电耦合到CMOS器件。

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