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公开(公告)号：US09957159B2
公开(公告)日：2018-05-01
申请号：US15470670
申请日：2017-03-27
Applicant: Evigia Systems, Inc.
Inventor： Weibin Zhu , Navid Yazdi
IPC: H01L31/058 , H01L21/76 , H01L21/302 , H01L21/461 , B81C1/00 , H01L27/12 , B81B7/00
CPC classification number: B81C1/0069 , B81B7/0019 , B81B7/0096 , B81B2201/0228 , B81B2201/0278 , B81B2207/07 , B81B2207/99 , B81C2201/0126 , B81C2201/0132 , B81C2203/0118 , H01L27/1207
Abstract: The present invention generally relates to an ovenized platform and a fabrication process thereof. Specifically, the invention relates to an ovenized hybrid Si/SiO2 platform compatible with typical CMOS and MEMS fabrication processes and methods of its manufacture. Embodiments of the invention may include support arms, CMOS circuitry, temperature sensors, IMUs, and/or heaters among other elements.
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122.发明申请公开(公告)号：US20180086629A1
公开(公告)日：2018-03-29
申请号：US15278359
申请日：2016-09-28
Applicant: U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration
Inventor： GEORGE MANOS , MANUEL A. BALVIN , MICHAEL P. CALLAHAN
CPC classification number: B81B7/0061 , B81B2201/0278 , B81C1/00309 , G01F1/6845 , G01F1/7084 , G01K7/01 , G01K7/015 , G01K13/02 , G01K2013/026
Abstract: An integrated circuit (IC) chip with a self-contained fluid sensor and method of making the chip. The sensor is in a conduit formed between a semiconductor substrate and a non-conductive cap with fluid entry and exit points through the cap. The conduit may be entirely in the cap, in the substrate or in both. The conduit includes encased temperature sensors at both ends and a central encased heater. The temperature sensors may each include multiple encased diodes and the heater may include multiple encased resistors.
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公开(公告)号：US09914638B2
公开(公告)日：2018-03-13
申请号：US14993738
申请日：2016-01-12
Applicant: Sensirion AG
Inventor： David Pustan , Werner Hunziker
CPC classification number: B81B3/0081 , B81B2201/0278 , B81B2203/0127 , B81B2207/098 , B81C1/00158 , B81C1/0069 , G01N33/0009 , H01L23/3107 , H01L2924/0002 , H01L2924/00
Abstract: A sensor package comprises a carrier comprising a through hole, and a sensor chip with a front side and a back side and a recess in the back side. The sensor chip is attached to the carrier with its back side facing the carrier by means of an attachment layer thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess. The through hole is arranged in the first area of the carrier.
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公开(公告)号：US09845236B2
公开(公告)日：2017-12-19
申请号：US14645826
申请日：2015-03-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shao-Chi Yu , Chia-Ming Hung , Hsin-Ting Huang , Hsiang-Fu Chen , Allen Timothy Chang , Wen-Chuan Tai
CPC classification number: B81C1/00269 , B81B7/02 , B81B2201/0214 , B81B2201/0264 , B81B2201/0278 , B81B2207/096 , B81C2203/0109 , G01K13/00 , G01L9/0073 , G01L19/0092 , G01N27/221 , G01N2027/222
Abstract: The present disclosure is directed to a monolithic MEMS (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the MEMS platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor. A dielectric layer is disposed over the semiconductor substrate. A cavity is disposed within an upper surface of the dielectric layer. A MEMS substrate is arranged onto the upper surface of the dielectric layer and has a first section and a second section. A pressure sensor has a first pressure sensor electrode that is vertically separated by the cavity from a second pressure sensor electrode within the first section of a MEMS substrate. A gas sensor has a polymer disposed between a first gas sensor electrode within the second section of a MEMS substrate and a second gas sensor electrode.
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125.发明申请公开(公告)号：US20170355596A1
公开(公告)日：2017-12-14
申请号：US15669916
申请日：2017-08-05
Applicant: Versana Micro Inc
Inventor： BISHNU PRASANNA GOGOI
CPC classification number: B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor,and a biological sensor.
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Patent Agency Ranking
公开(公告)号：US20170275157A1
公开(公告)日：2017-09-28
申请号：US15470670
申请日：2017-03-27
Applicant: Evigia Systems, Inc.
Inventor： Weibin Zhu , Navid Yazdi
CPC classification number: B81C1/0069 , B81B7/0019 , B81B7/0096 , B81B2201/0228 , B81B2201/0278 , B81B2207/07 , B81B2207/99 , B81C2201/0126 , B81C2201/0132 , B81C2203/0118 , H01L27/1207
Abstract: The present invention generally relates to an ovenized platform and a fabrication process thereof. Specifically, the invention relates to an ovenized hybrid Si/SiO2 platform compatible with typical CMOS and MEMS fabrication processes and methods of its manufacture. Embodiments of the invention may include support arms, CMOS circuitry, temperature sensors, IMUs, and/or heaters among other elements.
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127.发明申请公开(公告)号：US20170238107A1
公开(公告)日：2017-08-17
申请号：US15044663
申请日：2016-02-16
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe
CPC classification number: H04R29/004 , B81B7/02 , B81B2201/0257 , B81B2201/0278 , B81C1/00158 , G01K1/14 , G01K7/02 , G01K7/028 , H04R3/00 , H04R7/10 , H04R19/005 , H04R19/04 , H04R2307/027 , H04R2499/11
Abstract: A MEMS microphone and a method for manufacturing a MEMS microphone are disclosed. Embodiments of the invention provide a MEMS microphone including a MEMS microphone structure having at least one counter electrode structure and a diaphragm structure deflectable with respect to the counter electrode structure and a thermocouple arranged at the MEMS microphone structure.
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公开(公告)号：US20170233248A1
公开(公告)日：2017-08-17
申请号：US15132239
申请日：2016-04-19
Applicant: GlobalMEMS Co., Ltd.
Inventor： Hsi-Wen Tung , Ming-Ching Wu
CPC classification number: B81C1/00182 , B81B2201/0264 , B81B2201/0278 , B81B2203/0127 , B81B2207/07
Abstract: A micro sensor including a first substrate and a second substrate is provided. The first substrate has a surface with a cavity. The second substrate has a sensing structure. The surface of the first substrate with the cavity is bonded to the second substrate to seal the cavity, such that a pressure value in the cavity is a constant value. A manufacturing method thereof is also provided.
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公开(公告)号：US20170015548A1
公开(公告)日：2017-01-19
申请号：US14963362
申请日：2015-12-09
Applicant: Texas Instruments Incorporated
Inventor： Jie Mao , Hau Nguyen , Luu Nguyen , Anindya Poddar
CPC classification number: B81C1/00873 , B81B7/007 , B81B2201/0214 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2201/047 , B81B2207/07 , B81B2207/098 , B81C1/00333 , B81C2201/0125 , B81C2201/0132 , B81C2201/0159 , B81C2201/0181 , B81C2201/0188 , B81C2203/0136 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3121 , H01L24/19 , H01L2221/68359 , H01L2224/04105 , H01L2224/96 , H01L2924/3511
Abstract: A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.
Abstract translation: 一种以面板格式制造具有开口腔（110a）的封装半导体器件（100）的方法; 将具有平垫（230）和对称放置的垂直柱（231）的金属片的面板尺寸网格放置（处理201）在粘合剂载带上。 将具有传感器系统的半导体芯片（工艺202）面朝下地附接到带上; 层压（工艺203）和减薄（工艺204）低CTE绝缘材料（234）以填充芯片和网格之间的间隙; 翻转（过程205）组装以去除胶带; 等离子体清洁组件正面，溅射和图案化（工艺206）跨组合均匀的金属层和任选的电镀（工艺209）金属层以形成重新布线迹线和扩展的接触垫用于组装; 层压（工艺212）跨板的绝缘加强件; 在加强件中打开（过程213）空腔以接近传感器系统; 并通过切割金属片来分割（处理214）包装的装置。
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公开(公告)号：US20160320426A1
公开(公告)日：2016-11-03
申请号：US15206935
申请日：2016-07-11
Applicant: Motion Engine, Inc.
Inventor： Robert Mark Boysel , Louis Ross
IPC: G01P15/18 , G01P15/125 , B81B7/00
CPC classification number: B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2207/012 , B81B2207/07 , B81C1/00238 , G01P15/0802 , G01P15/125 , G01P15/18 , H01L2224/16145
Abstract: The present invention provides a 3D System (“3DS”) MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (SoC) or System in Package (SiP). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry.
Abstract translation: 本发明提供了一种3D系统（“3DS”）MEMS架构，其能够将MEMS器件与IC芯片集成以形成片上系统（SoC）或系统级封装（SiP）。 集成MEMS系统包括至少一个MEMS芯片，包括MEMS换能器，以及至少一个IC芯片，不仅包括MEMS处理电路，还包括用于处理辅助信号的附加/辅助电路。 MEMS芯片可以包括第一和第二绝缘导电路径。 第一路通过传感器和IC芯片之间的MEMS信号进行处理; 并且第二导电路径可以延伸穿过MEMS芯片的整个厚度，以将辅助信号（例如功率，RF，I / O）传送到IC芯片，以便处理附加电路。
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