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    METHOD TO PACKAGE MULTIPLE MEMS SENSORS AND ACTUATORS AT DIFFERENT GASES AND CAVITY PRESSURES
    123.
    发明申请
    METHOD TO PACKAGE MULTIPLE MEMS SENSORS AND ACTUATORS AT DIFFERENT GASES AND CAVITY PRESSURES 审中-公开
    在不同气体和气压下封装多个MEMS传感器和执行器的方法

    公开(公告)号：US20160039667A1

    公开(公告)日：2016-02-11

    申请号：US14887622

    申请日：2015-10-20

    Applicant: mCube Inc.

    Inventor： WENHUA ZHANG ,  SHINGO YONEOKA

    IPC: B81C1/00 ,  H01L21/56

    CPC classification number: B81B7/02 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L41/1132

    Abstract: A method for fabricating a multiple MEMS device includes providing a semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel. The first MEMS is encapsulated within the first cavity and the second MEMS device is encapsulated within the second cavity. These devices is encapsulated within a first encapsulation environment at a first air pressure, and encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity is then subjected to a second encapsulating environment at a second air pressure via the channel of the second cavity.

    Abstract translation: 一种用于制造多个MEMS器件的方法包括提供具有第一和第二MEMS器件的半导体衬底以及包括至少一个通道的具有第一腔和第二腔的封装晶片。 第一MEMS封装在第一腔内，第二MEMS器件被封装在第二腔内。 这些装置在第一空气压力下封装在第一封装环境内，并且在第一空气压力下将第一MEMS装置封装在第一空腔内。 然后第二腔内的第二MEMS器件经由第二腔的通道在第二空气压力下经受第二封装环境。

    Distributed MEMS devices time synchronization methods and system
    124.
    发明授权
    Distributed MEMS devices time synchronization methods and system 有权
    分布式MEMS器件的时间同步方法和系统

    公开(公告)号：US09174838B2

    公开(公告)日：2015-11-03

    申请号：US14102465

    申请日：2013-12-10

    Applicant: mCube Inc.

    Inventor： Wenhua Zhang ,  Shingo Yoneoka

    IPC: H01L21/00 ,  B81C1/00 ,  H01L41/113

    CPC classification number: B81B7/02 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L41/1132

    Abstract: A method for fabricating a multiple MEMS device. A semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided. The first MEMS can be encapsulated within the first cavity and the second MEMS device can be encapsulated within the second cavity. These devices can be encapsulated within a provided first encapsulation environment at a first air pressure, encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity can then be subjected to a provided second encapsulating environment at a second air pressure via the channel of the second cavity.

    Abstract translation: 一种用于制造多个MEMS器件的方法。 可以提供具有第一和第二MEMS器件的半导体衬底以及包括至少一个通道的具有第一腔和第二腔的封装晶片。 第一MEMS可以封装在第一腔内，并且第二MEMS器件可被封装在第二腔内。 这些装置可以以第一空气压力封装在所提供的第一封装环境内，在第一空气压力下将第一MEMS装置封装在第一空腔内。 然后可以在第二空腔内的第二MEMS装置经由第二空腔的通道在第二空气压力下经受所提供的第二封装环境。

    DEVICE COMPRISING A FLUID CHANNEL FITTED WITH AT LEAST ONE MICROELECTRONIC OR NANOELECTRONIC SYSTEM, AND METHOD FOR MANUFACTURING SUCH A DEVICE
    127.
    发明申请
    DEVICE COMPRISING A FLUID CHANNEL FITTED WITH AT LEAST ONE MICROELECTRONIC OR NANOELECTRONIC SYSTEM, AND METHOD FOR MANUFACTURING SUCH A DEVICE 有权
    一种包含至少一个微电子或纳米电子系统的流体通道的装置，以及用于制造这样的装置的方法

    公开(公告)号：US20150021720A1

    公开(公告)日：2015-01-22

    申请号：US14336351

    申请日：2014-07-21

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

    Inventor： Eric OLLIER ,  Carine MARCOUX

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0061 ,  B81B7/007 ,  B81B2201/0214 ,  B81B2201/0292 ,  B81B2201/058 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00309 ,  B81C2203/0118 ,  G01N30/6095

    Abstract: A device comprising a substrate comprising at least one microelectronic and/or nanoelectronic structure comprising at least one sensitive portion and one fluid channel (2) defined between said substrate and a cap (6), where said fluid channel (2) comprises at least two apertures to provide a flow in said channel, where said microelectronic and/or nanoelectronic structure is located within the fluid channel, where said cap is assembled with the substrate at an assembly interface, where said device comprises electrical connections between said microelectronic and/or nanoelectronic structure and the exterior of the fluid channel (2), where said electrical connections (8) are formed by vias made through the substrate (4) directly below the microelectronic and/or nanoelectronic structure, and in electrical contact with said microelectronic and/or nanoelectronic structure.

    Abstract translation: 一种包括衬底的器件，包括至少一个微电子和/或纳米电子结构，所述微电子和/或纳米电子结构包括限定在所述衬底和帽（6）之间的至少一个敏感部分和一个流体通道（2），其中所述流体通道（2）包括至少两个 孔，以在所述通道中提供流动，其中所述微电子和/或纳米电子结构位于流体通道内，其中所述盖与基板组装在组装界面处，其中所述装置包括所述微电子和/或纳米电子 结构和流体通道（2）的外部，其中所述电连接（8）由通过直接在微电子和/或纳米电子结构下面的基板（4）制成的通孔形成，并且与所述微电子和/或 纳米电子结构。

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