公开(公告)号：US20170125349A1

公开(公告)日：2017-05-04

申请号：US15350393

申请日：2016-11-14

Applicant: Intel Corporation

Inventor： Mihir K. Roy ,  Stefanie M. Lotz ,  Wei-Lun Kane Jen

IPC: H01L23/538 ,  H01L21/683 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2924/0002 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1579 ,  H01L2924/2064 ,  H05K1/0313 ,  H05K1/141 ,  H05K1/142 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/467 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2203/016 ,  H01L2924/00

Abstract: Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

公开(公告)号：US09491865B1

公开(公告)日：2016-11-08

申请号：US14695057

申请日：2015-04-24

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Ming-Hao Wu ,  Cheng-Po Yu

IPC: H01L35/30 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

Abstract translation: 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US09357646B2

公开(公告)日：2016-05-31

申请号：US14460909

申请日：2014-08-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sang Min Lee ,  Moon Il Kim ,  Yong Soon Jang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/11 ,  H01L21/56 ,  H05K3/30 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L2224/16225 ,  H05K3/28 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/048 ,  H05K2201/09709 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613

Abstract: A package substrate includes an insulating layer; and circuit patterns formed on the insulating layer and divided into pad areas and pattern areas that have different heights. In one aspect, there can be a non-conductive paste (NCP) interposed between the circuit patterns and pads of a die connected to the circuit patterns to fix the die onto the insulating layer.

Abstract translation: 封装基板包括绝缘层; 以及形成在绝缘层上并分成具有不同高度的焊盘区域和图案区域的电路图案。 在一个方面，可以存在插入在电路图案和连接到电路图案的管芯的焊盘之间的非导电膏（NCP），以将管芯固定到绝缘层上。

公开(公告)号：US09338895B2

公开(公告)日：2016-05-10

申请号：US13573969

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/36 ,  B23K1/00 ,  H05K1/14

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/141 ,  H05K3/32 ,  H05K3/366 ,  H05K3/40 ,  H05K2201/046 ,  H05K2201/048 ,  H05K2201/052 ,  Y10T29/49126 ,  Y10T156/1002

Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Abstract translation: 一种制造电路的方法包括以下步骤：在至少一个表面上形成具有多个电触点的刚性印刷电路板; 形成在至少一个表面上具有多个电气部件的多层柔性电路板，并且还沿着一个边缘具有分叉区域; 当分叉区域分开约180°时，在柔性电路板的分叉区域的内表面上分别形成电极焊盘，该电极焊盘分别与刚性电路板上的电触点对准; 将分叉区域分开并将电极焊盘与电触点对准; 以及在电极焊盘和电触点之间形成电连接。

公开(公告)号：US09093767B2

公开(公告)日：2015-07-28

申请号：US13879883

申请日：2011-11-29

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01R31/06 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H05K3/10 ,  H05K3/12 ,  H05K1/14

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：US09066436B2

公开(公告)日：2015-06-23

申请号：US13503319

申请日：2010-10-04

Applicant: Masahiro Takahashi ,  Isao Kajima

Inventor： Masahiro Takahashi ,  Isao Kajima

IPC: G09G3/36 ,  G06F3/038 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28

CPC classification number: H05K1/118 ,  H05K1/0275 ,  H05K3/281 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/10598

Abstract: A flexible wiring board includes a base member having flexibility, a write terminal section which is formed on the base member and which is a section to be protected, a protecting section which is integrally formed with the base member and which is folded back so as to cover the write terminal section, and a slit which is formed in the base member in a position that overlaps with the protecting section in a folded state and into which the protecting section can be inserted.

Abstract translation: 柔性布线板包括具有柔性的基底构件，形成在基底构件上并且是待保护部分的写入端子部分，与底部构件整体形成并被折回的保护部分 覆盖写入端子部分，以及在折叠状态下形成在与保护部分重叠的位置的基部部件中的可以插入保护部分的狭缝。

公开(公告)号：US20150053463A1

公开(公告)日：2015-02-26

申请号：US14093660

申请日：2013-12-02

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHI-SHIANG CHEN ,  HSIU-CHING HU ,  KUN-WU LI ,  FANG-PING WU

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/185 ,  H05K3/0011 ,  H05K3/0035 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/007 ,  H05K3/4644 ,  H05K3/4694 ,  H05K2201/048 ,  H05K2203/0384 ,  H05K2203/167 ,  Y10T29/49155

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract translation: 刚性柔性板模块包括刚性柔性电路板和高密度互连电路板。 刚性柔性电路板包括柔性电路板，第一刚性电路板和第一粘合剂层。 柔性电路板包括弯曲部和连接到弯曲部的接合部。 刚性柔性电路板设置在接合部分上以露出弯曲部分。 第一刚性电路板与柔性电路板电连接。 第一粘合剂层连接第一刚性电路板和接合部分。 高密度互连电路板设置在第一刚性电路板中并与第一刚性电路板电连接。

公开(公告)号：US20140368987A1

公开(公告)日：2014-12-18

申请号：US14103857

申请日：2013-12-12

Applicant: Hon Hai Precision Industry Co., Ltd. ,  Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.

Inventor： XIAO-CONG WEI ,  XIAO-ZHAN PENG

IPC: H05K1/02

CPC classification number: H05K1/142 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/048

Abstract: An exemplary integrated printed circuit board (PCB) includes a main PCB and a peripheral PCB. The main PCB includes a number of general purpose input/output (GPIO) ports and a number of first bonding pads, the bonding pads are located on edges of the main PCB and each GPIO port is electrically connected to one of the first bonding pads. The peripheral PCB includes a receiving space and a number of second bonding pads, the receiving space is used to receive the main PCB, the second bonding pads are located at inner peripheral edges of the peripheral PCB surrounding the receiving space. When the first bonding pads of the main PCB are respectively welded with the second bonding pads, the main PCB and the peripheral PCB are connected to each other to form the integrated PCB. An electronic device incorporating an integrated PCB is also provided.

Abstract translation: 示例性的集成印刷电路板（PCB）包括主PCB和外围PCB。 主PCB包括多个通用输入/输出（GPIO）端口和多个第一接合焊盘，接合焊盘位于主PCB的边缘上，并且每个GPIO端口电连接到第一焊盘之一。 外围PCB包括接收空间和多个第二接合焊盘，接收空间用于接收主PCB，第二接合焊盘位于围绕接收空间的外围PCB的内周边缘处。 当主PCB的第一接合焊盘分别与第二接合焊盘焊接时，主PCB和外围PCB彼此连接以形成集成PCB。 还提供了结合集成PCB的电子设备。

公开(公告)号：US08908377B2

公开(公告)日：2014-12-09

申请号：US13483830

申请日：2012-05-30

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K3/4694 ,  H05K3/42 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/2072 ,  Y10T29/49126

Abstract: A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid wiring board and the second rigid wiring board, and a joint conductor extending in a direction from a first surface of the first rigid wiring board to a second surface of the first rigid wiring board on the opposite side of the first surface of the first rigid wiring board such that the joint conductor is penetrating through the boundary between the first rigid wiring board and the second rigid wiring board and joining the first rigid wiring board and the second rigid wiring board.

Abstract translation: 布线基板具有容纳部的第一刚性布线板，容纳在容纳部中的第二刚性布线基板，形成在第一刚性布线基板和第二刚性布线基板上的绝缘层，以及沿着方向 从第一刚性布线板的第一表面到第一刚性布线板的与第一刚性布线板的第一表面相反的一侧的第二表面，使得接合导体穿过第一刚性布线板 和第二刚性布线板，并且连接第一刚性布线板和第二刚性布线板。

公开(公告)号：US20140102626A1

公开(公告)日：2014-04-17

申请号：US13573969

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K3/36 ,  B23K1/20 ,  B29C65/48

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/141 ,  H05K3/32 ,  H05K3/366 ,  H05K3/40 ,  H05K2201/046 ,  H05K2201/048 ,  H05K2201/052 ,  Y10T29/49126 ,  Y10T156/1002

Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Abstract translation: 一种制造电路的方法包括以下步骤：在至少一个表面上形成具有多个电触点的刚性印刷电路板; 形成在至少一个表面上具有多个电气部件的多层柔性电路板，并且还沿着一个边缘具有分叉区域; 当分叉区域分开约180°时，在柔性电路板的分叉区域的内表面上分别形成电极焊盘，该电极焊盘分别与刚性电路板上的电触点对准; 将分叉区域分开并将电极焊盘与电触点对准; 以及在电极焊盘和电触点之间形成电连接。