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    SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS
    121.
    发明申请
    SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS 有权
    RFID标签的系统和方法

    公开(公告)号：US20170068882A1

    公开(公告)日：2017-03-09

    申请号：US15356448

    申请日：2016-11-18

    Applicant: NEOLOGY, INC.

    Inventor： Paul Elizondo ,  John Azevedo

    IPC: G06K19/077 ,  G06K7/00 ,  H05K1/02 ,  G06K19/07

    CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

    Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

    Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

    Printed circuit board and fabrication method thereof
    123.
    发明授权
    Printed circuit board and fabrication method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US09497865B2

    公开(公告)日：2016-11-15

    申请号：US14043609

    申请日：2013-10-01

    Applicant: NAN YA PCB Corporation

    Inventor： Hung-Wei Chang ,  Tai-Yi Chou

    IPC: H05K3/46 ,  H05K3/34 ,  H05K3/00

    CPC classification number: H05K3/4661 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0909 ,  Y10T29/49155

    Abstract: A method for forming a printed circuit board includes providing a substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.

    Abstract translation: 一种用于形成印刷电路板的方法，包括在第一器件区域和第二器件区域之间提供包括第一器件区域，第二器件区域和切割沟道区域的衬底。 在基板上形成第一电路。 在第一电路和基板上形成绝缘层。 在绝缘层上形成至少一个积聚电路。 在至少一个积聚电路上形成光致抗蚀剂层。 执行图像转印处理以对切割通道区域中的光致抗蚀剂层进行图案化以形成坝结构。 在至少一个积聚电路上形成焊接掩模层。 去除坝结构以在焊接掩模层中形成沟槽。

    Substrate components for packaging IC chips and electronic device packages of the same
    124.
    发明授权
    Substrate components for packaging IC chips and electronic device packages of the same 有权
    用于封装IC芯片的基板元件及其电子器件封装

    公开(公告)号：US09478472B2

    公开(公告)日：2016-10-25

    申请号：US14281733

    申请日：2014-05-19

    Applicant: Dyi-Chung Hu

    Inventor： Dyi-Chung Hu

    IPC: H01L23/15 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46

    CPC classification number: H01L23/15 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/112 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/4605 ,  H05K2201/068 ,  H05K2201/0909 ,  H05K2201/09154

    Abstract: Substrate components for packaging IC chips and electronic device packages are disclosed. A substrate component for packaging IC chips comprises: a glass core base with at least one conductive through via connecting a combination of metallization and dielectric structures on both an upper surface and a lower surface of the glass core base; and, tapered edges created at a peripheral region of the glass core base; wherein dielectric layers are disposed over the tapered edges at the peripheral region of the glass core base. In accordance with an embodiment of the invention, the dielectric layers have a substantial planar upper surface, a lower surface conformably interfaced with the tapered edges at peripheral region of the glass core base, and a steep cutting face with the tapered edges of the glass core base. Alternatively, the tapered edges at peripheral region of the glass core base are not covered by the dielectric layers, and an encapsulated material sealing the tapered edges at peripheral region of the glass core base.

    Abstract translation: 公开了用于封装IC芯片和电子器件封装的衬底元件。 用于封装IC芯片的基板部件包括：具有至少一个导电通孔的玻璃芯基座，该导电通孔在玻璃芯基座的上表面和下表面上连接金属化和电介质结构的组合; 以及在玻璃核心基座的周边区域处产生的锥形边缘; 其中电介质层设置在玻璃芯基底的周边区域的锥形边缘上方。 根据本发明的实施例，电介质层具有基本的平面上表面，下表面与玻璃芯基底的周边区域处的锥形边缘顺应地接合，以及具有玻璃芯的锥形边缘的陡峭切割面 基础。 或者，玻璃芯基部的周边区域的锥形边缘不被电介质层覆盖，并且在玻璃芯基部的周边区域封装有锥形边缘的封装材料。

    Systems and methods for synchronizing a plurality of RFID interrogators in a theatre of operation
    128.
    发明授权
    Systems and methods for synchronizing a plurality of RFID interrogators in a theatre of operation 有权
    用于在操作剧场中同步多个RFID询问器的系统和方法

    公开(公告)号：US09247634B2

    公开(公告)日：2016-01-26

    申请号：US14225359

    申请日：2014-03-25

    Applicant: Neology, Inc.

    Inventor： James Robert Kruest ,  Gary Bann

    IPC: H05K1/02 ,  H04J3/06 ,  G06K7/00 ,  G06K19/077 ,  G06K19/07 ,  G06Q10/08 ,  G06K7/10

    CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

    Abstract: RFID tags are used for many purpose including tracking. RFID interrogators are used to retrieve information from tags. In many applications, a plurality of RFID interrogators are required. Synchronization between interrogators in the same theater of operation is critical to ensure that their broadcasts do not interfere with each other. In fixed RFID interrogator applications, RFID interrogators can be wired together allowing a channel to synchronize the transmissions of the RFID interrogators. Methods described herein can ensure that synchronization is maintained in the event of the failure of a synchronizing master. Furthermore, additional methods for synchronizing RFID interrogators in wireless applications are described allowing synchronization in the absence of wired connections between interrogators.

    Abstract translation: RFID标签用于许多目的，包括跟踪。 RFID询问器用于从标签中检索信息。 在许多应用中，需要多个RFID询问器。 同一操作剧场中的询问器之间的同步至关重要，以确保他们的广播不会相互干扰。 在固定的RFID询问器应用中，RFID询问器可以连接在一起，允许信道同步RFID询问器的传输。 本文描述的方法可以确保在同步主机故障的情况下维持同步。 此外，描述了用于在无线应用中同步RFID询问器的附加方法，允许在询问器之间没有有线连接的情况下进行同步。

    Wiring substrate and multi-piece wiring substrate
    129.
    发明授权
    Wiring substrate and multi-piece wiring substrate 有权
    接线基板和多片接线基板

    公开(公告)号：US09215802B2

    公开(公告)日：2015-12-15

    申请号：US14234604

    申请日：2012-12-25

    Applicant: NGK SPARK PLUG CO., LTD.

    Inventor： Jyun Suzuki ,  Naoki Kito ,  Masami Hasegawa ,  Chizuo Nakashima

    IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K1/18 ,  H05K3/40

    CPC classification number: H05K1/0306 ,  H05K1/183 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09354

    Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.

    Abstract translation: 布线基板包括由板状陶瓷形成的基板主体，具有前表面，背面和0.8mm以下的高度; 在前表面开口的空腔，在平面上具有矩形形状; 以及在空腔的侧表面和基板主体的侧表面之间具有0.3mm或更小的厚度的侧壁。 布线基板还包括具有框架形式并形成在前表面上以包围空腔的开口的导电层; 陶瓷表面，其具有框架的形式并且与导电层相邻并且沿着前表面的外周定位; 以及形成在所述基板主体中的所述通孔导体，其沿​​着所述空腔的底表面和所述前表面之间的所述空腔的侧表面。

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