中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

203 records (took 0.027 seconds)

    FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE
    122.
    发明申请
    FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE 审中-公开
    FLEX-RIGID接线板和电子设备

    公开(公告)号：US20100051326A1

    公开(公告)日：2010-03-04

    申请号：US12494553

    申请日：2009-06-30

    Applicant: Katsumi Sagisaka

    Inventor： Katsumi Sagisaka

    IPC: H05K1/00

    CPC classification number: H05K1/141 ,  H05K1/16 ,  H05K1/185 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/4602 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/096 ,  H05K2201/10265 ,  H05K2203/0455 ,  H05K2203/049

    Abstract: A flex-rigid wiring board including a rigid printed wiring board having a rectangular shape and having a rigid base material and a conductor, and a flexible printed wiring board having a flexible base material and a conductor formed over the flexible base material. The conductor of the flexible printed wiring board is electrically connected to the conductor of the rigid printed wiring board. The flexible printed wiring board is connected to the rigid printed wiring board and extends from one or more sides of the rectangular shape of the rigid printed wiring board such that the flexible printed wiring board extends in a direction which makes an acute angle with respect to one or more sides of the rectangular shape of the rigid printed wiring board.

    Abstract translation: 一种柔性刚性布线板，包括具有矩形形状并具有刚性基底材料和导体的刚性印刷线路板，以及柔性基底材料和形成在柔性基底材料上的导体的柔性印刷线路板。 柔性印刷电路板的导体电连接到刚性印刷线路板的导体。 柔性印刷电路板连接到刚性印刷线路板，并从刚性印刷线路板的矩形的一侧或多侧延伸，使得柔性印刷线路板沿相对于一个方向成锐角的方向延伸 或更多边的刚性印刷线路板的矩形形状。

    Connection configuration for rigid substrates
    123.
    发明授权
    Connection configuration for rigid substrates 失效
    刚性基板的连接配置

    公开(公告)号：US07642466B2

    公开(公告)日：2010-01-05

    申请号：US11679733

    申请日：2007-02-27

    Applicant: Shinichi Nikaido ,  Hiroki Maruo

    Inventor： Shinichi Nikaido ,  Hiroki Maruo

    IPC: H05K1/00

    CPC classification number: B32B27/38 ,  B32B3/06 ,  B32B3/18 ,  B32B7/045 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/36 ,  B32B2262/062 ,  B32B2262/101 ,  B32B2457/08 ,  H05K1/148 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2203/1572 ,  Y10T428/24802

    Abstract: There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.

    Abstract translation: 提供了一种结构，其中刚性基板通过柔性基板连接，该连接结构具有一对刚性基板，每个刚性基板在其前表面和后表面上均具有预定的电路图案，第一柔性基板安装在 一对刚性基板，以便电连接分别在前表面上设置的电路图形，第二柔性基板安装在该对刚性基板的相反表面上，以便电连接分别设置在反面上的电路图案 。 第一和第二基板之间的间隙小于一对刚性基板的厚度。

    Thin multi-chip flex module
    124.
    发明申请
    Thin multi-chip flex module 审中-公开
    薄多芯片柔性模块

    公开(公告)号：US20090166065A1

    公开(公告)日：2009-07-02

    申请号：US12317753

    申请日：2008-12-29

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H01R12/08

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

    Abstract translation: 柔性电路包括在其表面上具有导电图案的折叠电介质片，微电子器件连接到该表面上。 电介质片材围绕所选择的轴线折叠180°，并且接合层将它们的相应表面区域的一部分上的两半连接起来，使得它们的区域的剩余部分保持未粘合，从而形成分叉结构。 电触点设置在柔性片的未粘合或分叉部分上。 柔性件可以附接到刚性框架并设置有保护性散热盖。 折叠的柔性设计特别适用于卷对卷制造。

    Tunable high impedance surface device
    125.
    发明授权
    Tunable high impedance surface device 失效
    可调高阻抗表面装置

    公开(公告)号：US07518465B2

    公开(公告)日：2009-04-14

    申请号：US11616061

    申请日：2006-12-26

    Applicant: Jovica Savic ,  Gregory J. Dunn ,  John A. Svigelj

    Inventor： Jovica Savic ,  Gregory J. Dunn ,  John A. Svigelj

    IPC: H01P1/06 ,  H01P5/04 ,  H01Q1/38

    CPC classification number: H05K1/162 ,  H01G5/18 ,  H01Q15/0066 ,  H01Q15/147 ,  H05K1/116 ,  H05K3/0023 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/09109 ,  H05K2201/09436 ,  H05K2201/096 ,  Y10T29/49117

    Abstract: A tunable high impedance surface device (100) includes a conductive ground plane (105) and a plurality of conductive elements (110-114) electrically connected to the conductive ground plane (105). The device (100) also includes a plurality of capacitive elements (120-124) operable to vary a predetermined electromagnetic characteristic of the apparatus and standoffs (130, 132) between the plurality of capacitive elements (120-124) and the plurality of conductive elements (110-114). In one form, laser-drilled and electrically conductive micro-vias (136, 138) extend through the standoffs (130, 132) thereby electrically connecting the plurality of capacitive elements (120-124) to a data bus (140). The capacitive elements (120-124) may be integral with a circuit board (144) that supports the plurality conductive elements (110-114). Either the capacitive elements (120-124) or the conductive elements (110-114) are mechanically flexible and selectively movable to controllably adjust the distance (142) between the capacitive and conductive elements.

    Abstract translation: 可调谐高阻抗表面器件（100）包括导电接地平面（105）和电连接到导电接地平面（105）的多个导电元件（110-114）。 设备（100）还包括多个电容元件（120-124），可操作以改变设备的预定电磁特性和多个电容元件（120-124）与多个导电（120-124）之间的支座（130,132） 元素（110-114）。 在一种形式中，激光钻孔和导电微通孔（136,138）延伸穿过支座（130,132），从而将多个电容元件（120-124）电连接到数据总线（140）。 电容元件（120-124）可以与支撑多个导电元件（110-114）的电路板（144）成一体。 电容元件（120-124）或导电元件（110-114）中的任何一个都是机械地柔性的并且选择性地可移动以可控地调节电容元件和导电元件之间的距离（142）。

    Flexible circuit board with reinforcing board
    128.
    发明申请
    Flexible circuit board with reinforcing board 审中-公开
    带加强板的柔性电路板

    公开(公告)号：US20070095562A1

    公开(公告)日：2007-05-03

    申请号：US11476850

    申请日：2006-06-29

    Applicant: Ching-Cheng Tsai

    Inventor： Ching-Cheng Tsai

    IPC: H05K1/00

    CPC classification number: H05K1/118 ,  H05K1/0281 ,  H05K3/0058 ,  H05K2201/09109 ,  H05K2201/2009

    Abstract: A flexible circuit board with a reinforcing board is provided, comprising: a flexible substrate, having an upper surface and a lower surface; and a reinforcing board disposed at a front end of the upper surface of the flexible substrate, wherein a part of the reinforcing board is combined with the upper surface of the flexible substrate.

    Abstract translation: 提供一种具有加强板的柔性电路板，包括：柔性基板，具有上表面和下表面; 以及加强板，其设置在所述柔性基板的上表面的前端，其中，所述加强板的一部分与所述柔性基板的上表面组合。

    Hinge board and method for producing the same
    129.
    发明申请
    Hinge board and method for producing the same 失效
    铰链板及其制造方法

    公开(公告)号：US20070062722A1

    公开(公告)日：2007-03-22

    申请号：US11252626

    申请日：2005-10-19

    Applicant: Takashi Tanaka ,  Hidenori Nakajima ,  Yuichi Tokuda

    Inventor： Takashi Tanaka ,  Hidenori Nakajima ,  Yuichi Tokuda

    IPC: H05K1/00

    CPC classification number: H05K1/028 ,  H05K1/144 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/09109

    Abstract: A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.

    Abstract translation: 具有铰链弯曲部分和刚性部分的铰链板包括：不少于两个柔性布线板，包括聚酰亚胺片层，具有形成在聚酰亚胺片层的两侧或一侧上的电路的导体层和覆盖膜 覆盖导体层的层; 以及用于接合柔性布线板的接合材料。 柔性布线板中的至少一个是包含聚酰亚胺片层两侧的导体层的柔性双面布线板。 此外，柔性布线板通过使用接合材料在刚性部分中彼此结合，使得在铰链弯曲部分中的柔性布线板之间形成空间部分。

    Membrane switch
    130.
    发明申请
    Membrane switch 审中-公开
    膜开关

    公开(公告)号：US20070012555A1

    公开(公告)日：2007-01-18

    申请号：US11446199

    申请日：2006-06-05

    Applicant: Hiroshi Fuchigami ,  Osamu Yairo

    Inventor： Hiroshi Fuchigami ,  Osamu Yairo

    IPC: H01H1/10

    CPC classification number: H05K1/144 ,  H01H13/703 ,  H01H2221/004 ,  H01H2229/028 ,  H01H2229/056 ,  H05K1/0393 ,  H05K2201/09109 ,  H05K2201/09909 ,  H05K2201/2036

    Abstract: A membrane switch is formed by laminating a pair of flexible printed circuit (FPC) boards with two types of resist between them. An oil-resistant thermally adhesive resist is used in the peripheral area between the laminated FPC boards, and a resist that is not thermally adhesive is used in the central area. The thickness of these resists forms a spacer between the FPC boards

    Abstract translation: 薄膜开关通过层叠一对柔性印刷电路板（FPC）与它们之间的两种抗蚀剂形成。 在层叠的FPC基板之间的周边区域中使用耐油热粘合剂，在中心区域使用不具有热粘合性的抗蚀剂。 这些抗蚀剂的厚度在FPC基板之间形成间隔物

Patent Agency Ranking