公开(公告)号：US08179685B2

公开(公告)日：2012-05-15

申请号：US12251552

申请日：2008-10-15

Applicant: Hyo-Hyun Park ,  Hyun-Woo Nam

Inventor： Hyo-Hyun Park ,  Hyun-Woo Nam

IPC: H05K7/00

CPC classification number: H01R12/57 ,  H01R12/79 ,  H05K1/0271 ,  H05K1/114 ,  H05K1/182 ,  H05K3/3421 ,  H05K3/429 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10969 ,  H05K2201/2072 ,  Y10T29/49158

Abstract: A printed circuit board on which a connector is mounted includes an insulating layer through which holes are formed and a supporting layer. An upper surface of the supporting layer is attached to the connector. The supporting layer is disposed on an upper surface of the insulating layer, is extended from the upper surface of the insulating layer to a lower surface of the insulating layer, and passes through the holes in order to support the connector. The holes are arranged in a plurality of columns each being parallel to a longitudinal direction of a lateral surface of the connector.

Abstract translation: 其上安装有连接器的印刷电路板包括形成有孔的绝缘层和支撑层。 支撑层的上表面附接到连接器。 支撑层设置在绝缘层的上表面上，从绝缘层的上表面延伸到绝缘层的下表面，并且穿过孔以便支撑连接器。 孔布置成多个列，每个列平行于连接器的侧表面的纵向方向。

公开(公告)号：US20120096711A1

公开(公告)日：2012-04-26

申请号：US13340979

申请日：2011-12-30

Applicant: Junichi NAKAMURA ,  Takaharu Miyamoto

Inventor： Junichi NAKAMURA ,  Takaharu Miyamoto

IPC: H05K3/10 ,  H05K3/42

CPC classification number: H01L23/49838 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09354 ,  H05K2201/09781 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

Abstract translation: 配线基板10具有：具有作为第一电介质层的电介质层25的布线基板主体21，具有与电子部件11连接的连接面24A的电子部件安装焊盘24，配置在电介质层25的内部 作为层叠在电介质层25上的第二电介质层的电介质层31和设置在电介质层25,31上并与电子部件安装焊盘24电连接的通孔27,33和布线图案28， 用于减小布线板主体21的翘曲的翘曲构件22设置在电介质层25的内部。

公开(公告)号：US20120092867A1

公开(公告)日：2012-04-19

申请号：US13266144

申请日：2010-04-24

Applicant: Alexander Kasper

Inventor： Alexander Kasper

IPC: F21V7/00 ,  H01L33/60

CPC classification number: H05K1/02 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/013 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a circuit board having a light source for illumination purposes, having at least one LED electrically conductively connected to conductors of the circuit board, and the light thereof being converted into directed light by means of at least one mirror disposed on the circuit board, characterized in that the mirror is designed as a reflective coating printed onto the circuit board.

Abstract translation: 本发明涉及一种具有用于照明目的的光源的电路板，具有至少一个LED导电连接到电路板的导体，并且其光被借助于设置在电路上的至少一个反射镜转换成定向光 其特征在于，所述镜被设计为印刷到所述电路板上的反射涂层。

公开(公告)号：US20120092833A1

公开(公告)日：2012-04-19

申请号：US12903710

申请日：2010-10-13

Applicant: Yi-Shun Chang ,  Syh-Yuh Cheng

Inventor： Yi-Shun Chang ,  Syh-Yuh Cheng

IPC: H05K7/20

CPC classification number: H01L33/642 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00

Abstract: An LED heat-conducting substrate and its thermal module wherein the composite heat-conducting substrate is incorporated by multiple heat-conducting wires or fibers and insulating material. Said wires or fibers are arranged at interval, and penetrate the front and rear faces. The wires or fibers are segregated by insulating material. An electrode pad is incorporated onto the front face of the composite heat-conducting substrate, and is electrically connected with the electrode pin of LED unit. A heat-conducting pad is incorporated and kept in contact with the heat sink of the LED component for heat conduction. An insulating layer is incorporated onto the rear face of the composite heat-conducting substrate, and located correspondingly to the electrode pad. The LED heat-conducting substrate and thermal module can be constructed easily for high heat conduction in the thickness direction and high electrical insulation in the direction of plane, enabling quick heat transfer to the heat-sinking component.

Abstract translation: LED导热基板及其热模块，其中复合导热基板由多根导热丝或纤维和绝缘材料结合。 所述电线或纤维间隔布置，并穿透前后面。 电线或纤维被绝缘材料隔离。 在复合导热基板的正面上并入电极焊盘，与LED单元的电极引脚电连接。 导热垫被并入并与LED部件的散热器保持接触以用于热传导。 绝缘层被结合到复合导热基板的后表面上，并且对应于电极焊盘。 LED导热基板和热模块可以容易地构造在厚度方向上的高热传导和在平面方向上的高电绝缘性，使得能够快速地传热到散热部件。

公开(公告)号：US08148644B2

公开(公告)日：2012-04-03

申请号：US12528167

申请日：2008-02-18

Applicant: Stephane Ortet ,  Vincent Rebeyrotte ,  David Rousset

Inventor： Stephane Ortet ,  Vincent Rebeyrotte ,  David Rousset

IPC: H05K1/03

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: An electronic card that includes at least two superimposed conducting layers with an insulation layer between the two conducting layers, the two conducting layers each including a utility conducting portion and a conducting portion at the periphery of the utility conducting portion with an insulating portion between the conducting portions, the insulating portion of a first of the two layers being offset relative to the insulating portion of the second of the layers. An aircraft includes a housing in which at least one such card is provided.

Abstract translation: 一种电子卡，其包括在两个导电层之间具有绝缘层的至少两个重叠的导电层，所述两个导电层各自包括公用导电部分和在所述公用设施导电部分的周围的导电部分，所述绝缘部分在所述导电层之间具有绝缘部分 两层中的第一层的绝缘部分相对于第二层的绝缘部分偏移。 飞机包括其中提供至少一个这样的卡的壳体。

公开(公告)号：US08138426B2

公开(公告)日：2012-03-20

申请号：US12261368

申请日：2008-10-30

Applicant: Koso Matsuno ,  Hidenori Miyakawa ,  Shigeaki Sakatani

Inventor： Koso Matsuno ,  Hidenori Miyakawa ,  Shigeaki Sakatani

IPC: H05K1/11

CPC classification number: H05K3/3436 ,  H01L24/16 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/30105 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613

Abstract: A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and a plurality of lands provided on the undersurface of the electronic component and a plurality of terminals provided on the mounting surface of the circuit board so as to correspond to the plurality of lands are bonded with solder. The circuit board includes a means for holding flux separated from the solder in the proximity of at least one of the plurality of terminals.

Abstract translation: 提供了一种可以抑制磁通扩散的安装结构，通过底部填充确保电路板和电子部件之间的连接强度，并实现焊盘和端子之间的稳定的电连接。 安装结构具有扁平的电子部件和电路板，以及设置在电子部件的下表面上的多个焊盘以及设置在电路基板的安装面上的多个端子，以对应于多个 焊盘用焊料粘合。 电路板包括用于保持在焊料分离的焊剂在至少一个端子附近的装置。

公开(公告)号：US08119930B2

公开(公告)日：2012-02-21

申请号：US12270143

申请日：2008-11-13

Applicant: Junichi Nakamura ,  Takaharu Miyamoto

Inventor： Junichi Nakamura ,  Takaharu Miyamoto

IPC: H05K1/11

CPC classification number: H01L23/49838 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09354 ,  H05K2201/09781 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

Abstract translation: 配线基板10具有：具有作为第一电介质层的电介质层25的布线基板主体21，具有与电子部件11连接的连接面24A的电子部件安装焊盘24，配置在电介质层25的内部 作为层叠在电介质层25上的第二电介质层的电介质层31和设置在电介质层25,31上并与电子部件安装焊盘24电连接的通孔27,33和布线图案28， 用于减小布线板主体21的翘曲的翘曲构件22设置在电介质层25的内部。

公开(公告)号：US20120033395A1

公开(公告)日：2012-02-09

申请号：US13189612

申请日：2011-07-25

Applicant: Jun ISHII ,  Terukazu IHARA ,  Naohiro TERADA

Inventor： Jun ISHII ,  Terukazu IHARA ,  Naohiro TERADA

IPC: H05K1/14 ,  H05K3/00

CPC classification number: H05K3/4644 ,  G11B5/486 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09781 ,  Y10T29/49124

Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Abstract translation: 在至少一个具有一端侧的电路的悬架板和具有电路的悬挂板组装片的支撑框架之间的区域中设置虚拟轨迹部分。 在虚拟轨迹部分的支撑基板上形成基底绝缘层。 在基底绝缘层上形成多个导体迹线，在基底绝缘层上形成盖绝缘层，以覆盖每个导体迹线。 虚拟轨迹部分中的基底绝缘层和覆盖绝缘层中的至少一个具有凹槽。

公开(公告)号：US08097814B2

公开(公告)日：2012-01-17

申请号：US12356099

申请日：2009-01-20

Applicant: Yasuto Ishimaru ,  Hirofumi Ebe

Inventor： Yasuto Ishimaru ,  Hirofumi Ebe

IPC: H05K1/16

CPC classification number: H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/49162

Abstract: A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.

Abstract translation: 安装区域设置在绝缘层的一个表面的大致中心处。 导电迹线形成为从安装区域的内部向外延伸。 在安装区域的周围形成覆盖绝缘层以覆盖导电迹线。 导电迹线的端子布置在安装区域中，并且电子部件的凸块接合到端子。 例如，在绝缘层的另一个表面上设置由铜构成的金属层。 在金属层中形成狭缝，以跨越与电子部件相对的区域并分割金属层。

公开(公告)号：US08093502B2

公开(公告)日：2012-01-10

申请号：US11629099

申请日：2005-06-09

Applicant: Yukinobu Mikado ,  Katsumi Sagisaka ,  Katsuo Kawaguchi ,  Tetsuya Muraki

Inventor： Yukinobu Mikado ,  Katsumi Sagisaka ,  Katsuo Kawaguchi ,  Tetsuya Muraki

IPC: H05K1/03

CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4691 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/2009 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/31663

Abstract: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent. Thus, the proposed flex-rigid printed wiring board is excellent in connection reliability, permitting to prevent the base material from being easily deformed near the bending portion, conductor circuit from being broken and the flexible substrate from being waved. The similar effect can also be attained with the wiring patterns of the conductor circuit on the flexible substrate being formed wide or curved in the width direction at the bending portion.

Abstract translation: 提出了一种柔性刚性印刷线路板，其包括由绝缘基材和设置在绝缘基材上的导体电路形成的刚性基板，以及由绝缘基材形成的可弯曲柔性基板，设置在绝缘基底上的导体电路 材料和盖子覆盖导体电路，刚性和柔性基板彼此连接。 作为柔性基板的绝缘基材，采用通过用树脂浸渍玻璃布并干燥而形成的可弯曲基材。 导体电路形成在柔性基板的一侧，而虚拟图案形成在柔性基板弯曲部分附近的另一侧。 因此，所提出的柔性刚性印刷电路板的连接可靠性优异，可以防止基体在弯曲部附近容易变形，导体电路不被破坏，柔性基板不会挥动。 柔性基板上的导体电路的布线图案也可以在弯曲部分沿宽度方向形成宽或弯曲形成同样的效果。