公开(公告)号：US5320894A

公开(公告)日：1994-06-14

申请号：US702326

申请日：1991-05-20

Applicant: Shinichi Hasegawa

Inventor： Shinichi Hasegawa

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  B32B9/00

CPC classification number: H01L23/538 ,  H01L23/5384 ,  H05K1/115 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09509 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A multilayer interconnection substrate having, e.g., first to third power interconnections provided with first to third interconnection layers. A first insulating layer is provided between the first and second interconnection layers, and a second insulating layer is provided between the second and third interconnection layers. A plurality of first via holes are provided at said first insulating layer and connect the first and second power interconnections and a plurality of second via holes are provided at said second insulating layer with their position being shifted from that of the first via holes and connect the second and third power interconnection.

Abstract translation: 具有例如设置有第一至第三互连层的第一至第三电源互连的多层互连衬底。 第一绝缘层设置在第一和第二互连层之间，第二绝缘层设置在第二和第三互连层之间。 多个第一通孔设置在所述第一绝缘层处并且连接第一和第二电源互连，并且多个第二通孔设置在所述第二绝缘层处，其位置与第一通孔的位置相连， 第二和第三电力互连。

公开(公告)号：US5288974A

公开(公告)日：1994-02-22

申请号：US634879

申请日：1991-01-09

Applicant: Dirk Hanzic

Inventor： Dirk Hanzic

IPC: A47C7/74 ,  G05D23/24 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05B1/02 ,  H05B3/34

CPC classification number: B60N2/5685 ,  A47C7/748 ,  G05D23/1919 ,  G05D23/24 ,  H05B1/0238 ,  H05K1/111 ,  H05B2203/003 ,  H05B2203/016 ,  H05B2203/029 ,  H05K1/189 ,  H05K2201/09254 ,  H05K2201/0979 ,  H05K3/3421 ,  Y02P70/611

Abstract: A heating arrangement for heating a seat has a temperature responsive element and a control circuit for controlling the supply of electrical current to the heating element which is embedded in the seat. The control circuits formed of components mounted on a flexible printed circuit board.

Abstract translation: PCT No.PCT / SE90 / 00160 Sec。 371日期1991年1月9日 102（e）日期1991年1月9日PCT 1990年3月12日PCT PCT。 WO90 / 10999 PCT公开号 日本1990年9月20日。用于加热座椅的加热装置具有温度响应元件和控制电路，用于控制向嵌入在座椅中的加热元件的电流供应。 由安装在柔性印刷电路板上的部件形成的控制电路。

公开(公告)号：US5110654A

公开(公告)日：1992-05-05

申请号：US552535

申请日：1990-07-16

Applicant: Sakae Yokokawa

Inventor： Sakae Yokokawa

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31678

Abstract: A ceramic multilayer wiring substrate having a stack of a plurality of ceramic sheets each being formed with through holes which are connected to one another by a conductive paste buried in said through holes. Among the ceramic sheets, those which constitute an intermediate layer portion each is formed with a plurality of parallel through holes which are spaced apart in the direction perpendicular to the direction of thickness of the ceramic sheet. With such through holes, the substrate reduces the resistance in the intermediate layer portion and, therefore, the conduction resistance of the entire through holes.

Abstract translation: 一种陶瓷多层布线基板，其具有多个陶瓷片的叠层，每个陶瓷片均形成有通过埋入所述通孔中的导电膏彼此连接的通孔。 在陶瓷片中，构成中间层部分的那些陶瓷片各自形成有沿与陶瓷片的厚度方向垂直的方向间隔开的多个平行的通孔。 通过这样的通孔，衬底降低了中间层部分的电阻，并因此降低了整个通孔的导通电阻。

公开(公告)号：US5072289A

公开(公告)日：1991-12-10

申请号：US433108

申请日：1989-11-08

Applicant: Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

Inventor： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K1/113 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K3/363 ,  H05K3/423

Abstract: A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

公开(公告)号：US4951124A

公开(公告)日：1990-08-21

申请号：US346353

申请日：1989-04-28

Applicant: Hiromichi Sawaya

Inventor： Hiromichi Sawaya

IPC: H01L23/50 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L23/49548 ,  H01L23/4334 ,  H05K3/308 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/066 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/10696 ,  H05K2201/10787 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K3/3447

Abstract: A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.

Abstract translation: 公开了一种在线型半导体器件，其具有从封装延伸的多个引入线。 在该半导体器件中，散热器嵌入在封装的一个表面中，并且适当数量的引入线在封装的另一个表面侧弯曲，以提供布置在两个中的引入线的偏移阵列 行。 在包装的一个表面侧的上述合适数量的引入线上形成突起，使得其沿与引入线延伸的方向垂直的方向延伸。 在这种半导体器件中，当外部引入线插入印刷电路板并通过焊接连接到印刷电路板时，通过外部引线装置的突出部防止封装向散热器侧倾斜， 在线中，使得其可以相对于印刷电路板竖立。

公开(公告)号：US4933812A

公开(公告)日：1990-06-12

申请号：US420080

申请日：1989-10-11

Applicant: James D. Becker

Inventor： James D. Becker

IPC: H01G9/00 ,  H01L23/04 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H01G9/00 ,  H01L23/04 ,  H05K1/111 ,  H01L2924/0002 ,  H05K2201/0979 ,  H05K2203/168 ,  Y02P70/611 ,  Y02P70/613

Abstract: A package and circuit arrangement having rotational symmetry wherein positive and negative terminals are connected on both opposite ends of the package and also connected to an electrical component within the package. The positive terminals are diagonally aligned with respect to an axis of symmetry for the package, and the negative terminals are also diagonally aligned with respect to this axis of symmetry. Thus, the component within the package is always properly biased when the package is inserted into a circuit board receptacle having positive and negative terminals which are matched in position and polarity with those of package regardless of planar orientation of the package on the receiving surface of the circuit board.

Abstract translation: 具有旋转对称性的封装和电路装置，其中正端子和负端子连接在封装的两个相对端上，并且还连接到封装内的电气部件。 正端子相对于封装的对称轴线对角排列，并且负端子也相对于该对称轴线对角排列。 因此，当封装被插入具有正极和负极端子的电路板插座中时，封装内的部件总是被适当地偏置，该正极和负极端子的位置和极性与封装的位置和极性匹配，而与封装在接收表面上的平面取向无关 电路板。

公开(公告)号：US4851614A

公开(公告)日：1989-07-25

申请号：US238983

申请日：1988-08-24

Applicant: Wayne P. Duncan, Jr.

Inventor： Wayne P. Duncan, Jr.

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/0094 ,  H05K1/0215 ,  H05K1/116 ,  H05K3/3468 ,  H05K1/115 ,  H05K2201/09463 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/10409 ,  H05K2203/044 ,  H05K2203/045 ,  H05K3/325 ,  H05K3/429 ,  Y10T29/49149 ,  Y10T29/49169

Abstract: A novel solder pad configuration for printed circuit boards is disclosed which is resistant to solder occlusion upon wave soldering. On the solder side of the circuit board the solder pad is substantially C-shaped and partially surrounds a non-plated through-hole. Via holes prvide electrical connection between the pad on the solder side of the board and the corresponding pad on the component side of the circuit boards. The invention is particularly applicable to the chassis ground mounting holes of PCB's.

Abstract translation: 公开了一种用于印刷电路板的新型焊盘配置，其在波峰焊时耐焊接阻塞。 在电路板的焊料侧，焊盘基本上是C形的，并且部分地围绕着未镀覆的通孔。 通孔在电路板的焊料侧的焊盘和电路板的组件侧的相应焊盘之间提供电连接。 本发明特别适用于PCB的底盘接地安装孔。

公开(公告)号：US20240224424A1

公开(公告)日：2024-07-04

申请号：US18603603

申请日：2024-03-13

Applicant: Inventus Power, Inc.

Inventor： Paul John Kudrna ,  John Lundeen ,  Timothy James Vallaro ,  Daniel Paul Rose ,  Elijah Brett Goldin ,  Stewart George Reed

IPC: H05K1/11 ,  H01M50/209 ,  H01M50/502 ,  H01M50/519 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/118 ,  H01M50/209 ,  H01M50/502 ,  H01M50/519 ,  H05K1/117 ,  H05K1/181 ,  H05K3/303 ,  H01M2220/30 ,  H05K2201/09072 ,  H05K2201/0979 ,  H05K2201/10037 ,  H05K2203/107

Abstract: A housing of a conformal wearable battery (CWB) encloses a plurality of battery cells arranged in a grid-like pattern and electrically connected to a printed circuit board (PCB). The PCB includes an electrical connection pad that is electrically coupled to a positive terminal of a battery cell of the plurality of battery cells and a positive conductive region receiving electrical energy from one or more of the plurality of battery cells. A redundant trace fuse circuit is formed on the PCB. The battery cells may be a lithium-ion pouch cell that includes a body portion, a porch section and a battery cell terminal connected to the porch section. A plurality of compressible support members may be located on the flexible PCB at specific locations such that a support member is located between a battery cell terminal of each battery cell and the flexible PCB.

公开(公告)号：US20190098855A1

公开(公告)日：2019-04-04

申请号：US16192673

申请日：2018-11-15

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Atsushi Morishima

IPC: A01H5/10 ,  C12N15/82 ,  A01H6/54 ,  A01H1/02

CPC classification number: A01H5/10 ,  A01H1/02 ,  A01H6/542 ,  C12N15/8245 ,  C12N15/8247 ,  C12N15/8251 ,  C12N15/8271 ,  C12N15/8274 ,  C12N15/8275 ,  C12N15/8278 ,  C12N15/8279 ,  C12N15/8286 ,  C12N15/8289 ,  H05K1/025 ,  H05K1/114 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/0776 ,  H05K2201/09227 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/0979

Abstract: Apparatuses and methods including conductive vias of a printed circuit board are described. An example apparatus includes a first layer including a first conductive plate; a component on the first layer, a second layer including a second conductive plate that may be coupled to an external power source; a third layer between the first layer and the second layer, the third layer including a third conductive plate; a first via coupling the first conductive plate to the second conductive plate; and a second via coupled to the first conductive plate. The first conductive plate includes a first portion coupled to the first via and the first conductive plate further includes a second portion coupled to the second via between the first portion and the component. The second via is coupled to either the second conductive plate or the third conductive plate.

公开(公告)号：US20180218669A1

公开(公告)日：2018-08-02

申请号：US15937581

申请日：2018-03-27

Applicant: LightnTec GmbH & Co. KG

Inventor： Manuel Huebner ,  Florian Kall

IPC: G09G3/32 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: G09G3/32 ,  G09G2320/0626 ,  G09G2380/02 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: An illuminated display includes a plurality of illumination means, in particular a plurality of LEDs, which are arranged on a transparent base member. The transparent base member reduces visible light on average by a maximum of 40%. Preferably, the transparent base member is constructed in the form of a film, or in a further preferred manner in the form of a plastics material film. The illumination means are supplied with voltage by means of strip conductors. The strip conductors are electrically connected at one end preferably to a control unit and at the other end to at least one illumination means.