公开(公告)号：US20120120619A1

公开(公告)日：2012-05-17

申请号：US13241690

申请日：2011-09-23

Applicant: Eiichi KODERA

Inventor： Eiichi KODERA

IPC: H05K1/14 ,  H05K1/00

CPC classification number: H05K1/147 ,  H05K1/0219 ,  H05K3/363 ,  H05K2201/09618 ,  H05K2201/1034 ,  H05K2203/167

Abstract: There is provided a communication device that includes a first circuit board which includes a first ground pattern (GND) and a first signal line formed on a substrate, a ground pin electrically coupled with the first GND, where the ground pin protrudes from an end of the substrate, and a signal pin formed in the substrate and electrically coupled with the first signal line, where the signal pin protrudes from the end. The communication device further includes a send circuit board which includes a second GND and a second signal line, wherein when an end of the circuit board is inserted into a space between the ground pin and the signal pin, the first signal line and the second signal line are electrically coupled with each other via the signal pin and the first GND and the second GND are electrically coupled with each other via the ground pin.

Abstract translation: 提供了一种通信装置，其包括第一电路板，其包括形成在基板上的第一接地图案​​（GND）和第一信号线，与第一GND电耦合的接地引脚，其中接地引脚从接地引脚的端部突出 衬底和形成在衬底中并与第一信号线电耦合的信号引脚，其中信号引脚从端部突出。 通信装置还包括发送电路板，其包括第二GND和第二信号线，其中当电路板的一端插入到接地引脚和信号引脚之间的空间中时，第一信号线和第二信号 线经由信号引脚彼此电耦合，并且第一GND和第二GND经由接地引脚彼此电耦合。

公开(公告)号：US20110256739A1

公开(公告)日：2011-10-20

申请号：US12991442

申请日：2010-04-08

Applicant: Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

Inventor： Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

IPC: H01R12/70 ,  H05K1/11

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: A receptacle includes a signal terminal, a ground terminal, and a signal terminal. A second portion of the ground terminal is distanced from a first portion of the signal terminal in an extension direction. A third portion of the signal terminal is distanced from the first portion of the signal terminal in the extension direction.

Abstract translation: 插座包括信号端子，接地端子和信号端子。 接地端子的第二部分在延伸方向上远离信号端子的第一部分。 信号端子的第三部分在延伸方向上远离信号端子的第一部分。

公开(公告)号：US20110124237A1

公开(公告)日：2011-05-26

申请号：US12624929

申请日：2009-11-24

Applicant: Hsuan-Ho CHUNG

Inventor： Hsuan-Ho CHUNG

IPC: H01R24/00

CPC classification number: H01R27/00 ,  H01R12/52 ,  H01R12/58 ,  H01R24/60 ,  H05K1/117 ,  H05K1/141 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/0949 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/1034 ,  Y02P70/611

Abstract: The present invention relates to a connector, which includes a printed circuit tongue, and one surface of the printed circuit tongue is defined with a plurality of first printed areas and second printed areas which are joined to terminals. Elastic terminal pieces extend from the first printed areas and assembled on the printed circuit tongue, and third printed areas similarly extend from the second printed areas and defined on the printed circuit tongue. Moreover, fourth printed areas are defined on another surface of the printed circuit tongue, and fifth printed areas extend from the fourth printed areas and defined on the printed circuit tongue. Accordingly, the present invention enables achieving a connector that is tough and strong, the manufacturing process of which is simple and fast, and the wire layout is simple.

Abstract translation: 本发明涉及一种连接器，其包括印刷电路舌片，并且印刷电路舌片的一个表面限定有多个第一印刷区域和与端子连接的第二印刷区域。 弹性端子件从第一印刷区域延伸并组装在印刷电路舌上，并且第三印刷区域类似地从第二印刷区域延伸并限定在印刷电路舌上。 此外，第四印刷区域被限定在印刷电路舌片的另一表面上，并且第五印刷区域从第四印刷区域延伸并限定在印刷电路舌片上。 因此，本发明能够实现坚固坚固的连接器，其制造过程简单快捷，线布局简单。

公开(公告)号：US20110122589A1

公开(公告)日：2011-05-26

申请号：US12951099

申请日：2010-11-22

Applicant: LI-CHUN WU ,  YONG-CHUN XU ,  CHAO-TUNG HUANG ,  CHIH-MIN LIN ,  JIAN-SHE HU ,  KUO-CHUAN HUANG

Inventor： LI-CHUN WU ,  YONG-CHUN XU ,  CHAO-TUNG HUANG ,  CHIH-MIN LIN ,  JIAN-SHE HU ,  KUO-CHUAN HUANG

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/165 ,  H01F27/28 ,  H01F27/2804 ,  H01R12/526 ,  H01R13/6633 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/1003 ,  H05K2201/1034 ,  Y10T29/4913

Abstract: A magnetic element (100) includes a board unit (2) including a paddle board (21) having a row of first conductive vias (251) and a row of second conductive vias (252) for insertion of terminals (3), a number of embedded magnetic components (22), and a number of SMDs (surface mount devices) (23) mounted on the paddle board by SMT (surface mount technology). Each embedded magnetic component includes a magnetic core (221) embedded in the paddle board, and a number of PCB (printed circuit board) layout traces (222) disposed in the paddle board. Each PCB layout trace includes a first PCB layout trace (222a) encircling around the magnetic core and connecting with the first conductive via, and a second PCB layout trace (222b) encircling around the magnetic core and connecting with the SMD.

Abstract translation: 磁性元件（100）包括板单元（2），其包括具有一列第一导电通孔（251）和用于插入端子（3）的一排第二导电通孔（252）的桨板（21） 的嵌入式磁性部件（22）和通过SMT（表面贴装技术）安装在桨板上的多个SMD（表面安装装置）（23）。 每个嵌入式磁性部件包括嵌入在该桨板中的磁芯（221）和布置在该桨板中的多个PCB（印刷电路板）布局轨迹（222）。 每个PCB布局迹线包括环绕磁芯并与第一导电通孔连接的第一PCB布局迹线（222a）和环绕磁芯并与SMD连接的第二PCB布局迹线（222b）。

公开(公告)号：US07937822B2

公开(公告)日：2011-05-10

申请号：US12454967

申请日：2009-05-27

Applicant: Eiji Misaizu ,  Makoto Hiramoto

Inventor： Eiji Misaizu ,  Makoto Hiramoto

IPC: G01R3/00

CPC classification number: H05K3/3405 ,  G01L1/2287 ,  H05K1/118 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10287 ,  H05K2201/1034 ,  Y10T29/49007 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method is for connecting a tab pattern formed on a base sheet and a lead wire, wherein the tab pattern includes: a tab main portion; and a connecting portion formed to continue from one edge line of the tab main portion and to extend from the tab main portion along an extension line that is substantially orthogonal to the edge line, and wherein the method includes: connecting the lead wire on the tab main portion by bonding the lead wire at a position being displaced from the extension line of the connecting portion for more than a given offset amount where the extension line is identical to a center line of the connecting portion, the position being within a given distance from the edge line of the tab main portion.

Abstract translation: 一种用于连接形成在基片和引线上的突片图案的方法，其中突片图案包括：突片主体部分; 以及连接部，其形成为从所述突片主体的一个边缘线延伸并且从所述突片主体部分沿着与所述边缘线大致正交的延伸线延伸，并且其中所述方法包括：将所述引线连接到所述突片 主要部分通过将引线接合在从连接部分的延伸线偏移超过给定偏移量的位置处，其中延伸线与连接部分的中心线相同，该位置在距离 突片主体部分的边缘线。

公开(公告)号：US07923907B2

公开(公告)日：2011-04-12

申请号：US12355881

申请日：2009-01-19

Applicant: Thomas Tessnow ,  Kim Albright ,  Michael Tucker

Inventor： Thomas Tessnow ,  Kim Albright ,  Michael Tucker

IPC: F21V29/00 ,  F21S4/00 ,  H01J1/62

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  F21S45/47 ,  F21S45/49 ,  F21S45/50 ,  F21V29/89 ,  F21W2103/00 ,  F21Y2107/90 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/1034 ,  H05K2201/10598 ,  H05K2203/1572 ,  Y10S362/80

Abstract: A robust LED lamp may be assembly by forming a heat sinking sandwich with two metal heat sinks positioned around the circuit board and pinned together a heat conductive element. The assembly is positioned by pressing it into a base providing electrical connections. The robust assembly is rapidly assembled, thermally effective in draining or spreading heat from the circuit board and is readily adaptable to a variety of applications lighting. The heat sink may be decorated, colored or otherwise esthetically enhanced for consumer appreciation.

Abstract translation: 强大的LED灯可以通过形成散热夹层而组装，其中两个金属散热器位于电路板周围并且将导热元件固定在一起。 组件通过将其压入提供电连接的基座来定位。 坚固的组件被快速组装，热效率地从电路板排出或散布热量，并且容易适用于各种应用照明。 散热器可以装饰，着色或以其他方式美观地加强，以便消费者欣赏。

公开(公告)号：US07911039B2

公开(公告)日：2011-03-22

申请号：US11860556

申请日：2007-09-25

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/495

CPC classification number: H05K3/284 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/142 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.

Abstract translation: 一种部件装置，包括载体，具有电触头的壳体中的部件和封装载体的模制化合物，壳体中的半导体部件和电触点，其中将部件施加在载体上，并且其中提供载体 具有孔，以及用于制造部件布置的方法，其中，所述载体设置有孔，所述部件位于所述载体上，所述部件连接到所述载体，所述部件与所述载体位于所述引线框架中，并且所述布置 被模塑料包围。

公开(公告)号：US20110013367A1

公开(公告)日：2011-01-20

申请号：US12684608

申请日：2010-01-08

Applicant: David Williams ,  Ware Bedell ,  William Dunn

Inventor： David Williams ,  Ware Bedell ,  William Dunn

IPC: H05K5/00

CPC classification number: G06F1/1601 ,  G06F1/181 ,  G06F2200/1612 ,  H01L23/3107 ,  H01L23/32 ,  H01R12/7076 ,  H01R12/73 ,  H01R23/70 ,  H01R23/7005 ,  H04N5/63 ,  H04N5/64 ,  H04N5/655 ,  H05K1/117 ,  H05K2201/044 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/1034

Abstract: An electronic display assembly where the components can be removed and serviced or replaced without having to remove the display from its position. A backplane may be in electrical communication with the image producing assembly and may contain a plurality of blind mate connectors. Various electronic assemblies may be connected to the blind mate connectors. An access panel may provide access to the electronic assemblies so that they can be removed from the housing. N+1 power supplies may be used so that if one fails the unit would continue to operate until the failed power supply could be replaced. The electronic assemblies may be removed from the left side, right side, top, or bottom surfaces of the display housing. Any flat panel electronic display may be used.

Abstract translation: 一种电子显示器组件，其中组件可以被移除和维修或更换，而不必从其位置移除显示器。 背板可以与图像产生组件电连通，并且可以包含多个盲配对连接器。 各种电子组件可以连接到盲配接头。 访问面板可以提供对电子组件的访问，使得它们可以从壳体移除。 可以使用N + 1个电源，以便如果发生故障，设备将继续运行，直到发生故障的电源被更换为止。 电子组件可以从显示器壳体的左侧，右侧，顶部或底部表面移除。 可以使用任何平板电子显示器。

公开(公告)号：US20100148910A1

公开(公告)日：2010-06-17

申请号：US12617002

申请日：2009-11-12

Applicant: Ryuji TAKADA

Inventor： Ryuji TAKADA

IPC: H01F5/00

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/2804 ,  H01F27/40 ,  H01F2027/2809 ,  H01F2027/2819 ,  H01L2924/0002 ,  H02M3/28 ,  H05K1/165 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/086 ,  H05K2201/09909 ,  H05K2201/1003 ,  H05K2201/1034 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

Abstract: An electronic circuit device 1 arranged with a first substrate 11, a core 33 (magnetic body) mounted on the first substrate 11, a resin sealing body 17 which covers the first substrate 11 and the core 33, and a curable type stress relieving material 35 which reduces stress applied to the core 33 by the resin sealing body 17 is arranged within the resin sealing body 33 from the side surface periphery of the core 33 across to the first substrate 11.

Abstract translation: 布置有第一基板11，安装在第一基板11上的芯33（磁体），覆盖第一基板11和芯33的树脂密封体17和可固化型应力释放材料35的电子电路装置1 通过树脂密封体17减少施加到芯33的应力，从树脂密封体33的芯部33的侧面周向配置到第一基板11。

公开(公告)号：US07595998B2

公开(公告)日：2009-09-29

申请号：US11568293

申请日：2005-11-08

Applicant: Shigetomi Tokunaga

Inventor： Shigetomi Tokunaga

IPC: H05K5/00

CPC classification number: H05K1/141 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/284 ,  H05K3/366 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00

Abstract: An electronic circuit device includes a sub-board disposed upright on a main board. The sub-board is electrically coupled to the main board via a board terminal) disposed at sub-board edge. A semiconductor element is mounted on the sub-board facing the sub-board in parallel. A temperature sensor is also mounted on the sub-board. A heat sink is formed so as to surround the sub-board and the semiconductor element. A resin material is injected inside a heat sink so as to cover the sub-board, the temperature sensor, and the semiconductor element.

Abstract translation: 电子电路装置包括直立设置在主板上的子板。 子板通过设置在子板边缘处的板端子电耦合到主板。 半导体元件平行地安装在面向子板的子板上。 温度传感器也安装在子板上。 形成散热器，以便围绕子板和半导体元件。 将树脂材料注入散热器内部以覆盖子板，温度传感器和半导体元件。