公开(公告)号：US07348679B2

公开(公告)日：2008-03-25

申请号：US11247610

申请日：2005-10-10

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/118 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/0058 ,  H05K2201/09236 ,  H05K2201/09727 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.

Abstract translation: 一种电子部件的制造方法，其特征在于，包括：切断包含基底基板的布线基板，设置在所述基板的第一面上的布线图案，以及沿着所述基板的第二面设置的加强部件 与所述加强构件的外周相交的线; 其特征在于，构成所述布线图案的多根配线最靠近所述加强部件的外周的交叉点布线的线最宽。

公开(公告)号：US07290580B2

公开(公告)日：2007-11-06

申请号：US10793873

申请日：2004-03-08

Applicant: Katsuyuki Naitoh ,  Kazuhiko Fukuta

Inventor： Katsuyuki Naitoh ,  Kazuhiko Fukuta

IPC: B32B37/00

CPC classification number: H05K3/0058 ,  B29C70/72 ,  B29C70/885 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/2009 ,  H05K2203/068

Abstract: The reinforcement combining apparatus includes: a stage having a pressing surface; and a tool having a pressing surface opposite to the pressing surface of the stage, wherein the stage and the tool sandwich and press a flexible wiring substrate and a reinforcement, thereby combining the reinforcement with the flexible wiring substrate. A heat conduction rubber having elasticity which allows the heat conduction rubber to transform at an arbitrary area is provided as a part of the pressing surface of the tool, and the tool exerts pressure to the flexible wiring substrate via the heat conduction rubber. Thus, it is possible to bond the reinforcement to the flexible wiring with them uniformly appressed to each other.

Abstract translation: 加强组合装置包括：具有按压面的台架; 以及具有与所述台的按压面相反的按压面的工具，其中所述工作台和所述工具夹持并压制柔性布线基板和加强件，由此将所述加强件与所述柔性布线基板结合。 作为工具的按压面的一部分，设置有允许热传导橡胶在任意区域变形的具有弹性的导热橡胶，该工具通过导热橡胶对柔性布线基板施加压力。 因此，可以将加强件与柔性布线彼此均匀地贴合。

公开(公告)号：US20070193771A1

公开(公告)日：2007-08-23

申请号：US11637788

申请日：2006-12-13

Applicant: Hui-Ping Chen ,  Chien-Chung Chen ,  Yu-Ching Chen

Inventor： Hui-Ping Chen ,  Chien-Chung Chen ,  Yu-Ching Chen

IPC: H01B7/08

CPC classification number: H05K1/118 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/2009 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/162 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49732

Abstract: A method for preventing broken circuits of an FPC is provided, which is to attach a film to a surface of the FPC so as to enhance the strength of the FPC.

Abstract translation: 提供了一种防止FPC断路的方法，其将FPC附着到FPC的表面以提高FPC的强度。

公开(公告)号：US20070188692A1

公开(公告)日：2007-08-16

申请号：US10598903

申请日：2005-03-11

Applicant: Hiroyuki Fukusako ,  Kazunori Seno

Inventor： Hiroyuki Fukusako ,  Kazunori Seno

IPC: G02F1/1345

CPC classification number: H01L23/50 ,  G02F1/13452 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/552 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0393 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A driver module structure includes a flexible circuit board (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible circuit board (2), and an electrically conductive heat-radiating member (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8). The flexible circuit board (2) has a cavity (9) that exposes a portion of the ground wiring pattern (8). The exposed portion of the ground wiring pattern (8) and the heat-radiating member (4) are connected to establish electrical continuity via a member (11) that is fitted into the cavity (9).

Abstract translation: 驱动器模块结构包括设置有布线图案（7）的柔性电路板（2），安装在柔性电路板（2）上的半导体器件）和接合到半导体器件的导电散热构件 。 布线图案（7）包括接地布线图案（8）。 柔性电路板（2）具有露出接地布线图形（8）的一部分的空腔（9）。 接地布线图案（8）和散热构件（4）的暴露部分被连接以经由装配到空腔（9）中的构件（11）建立电连续性。

公开(公告)号：US20070177093A1

公开(公告)日：2007-08-02

申请号：US11698102

申请日：2007-01-26

Applicant: Eiji Oohira

Inventor： Eiji Oohira

IPC: G02F1/1345

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/2009

Abstract: The invention provides a display device which can suppress a bending repulsive force of a flexible printed circuit board having a folded portion thus reducing a manufacturing cost thereof. In a display device which includes a display panel, and a flexible printed circuit board which has one end thereof connected to a terminal portion of the display panel, the flexible printed circuit board includes a base member, a line layer which is formed on the base member using a metal layer, a surface protective cover which covers the line layer, and a folded portion, the line layer includes a signal line which supplies control signals or display data to the display panel and a dummy line, the signal line is covered with the surface protective cover at the folded portion, and the folded portion includes at least one exposed portion in which the dummy line is exposed from the surface protective cover ranging from a folding start point to a folding finish point.

Abstract translation: 本发明提供了一种能够抑制具有折叠部分的柔性印刷电路板的弯曲斥力的显示装置，从而降低了其制造成本。 在包括显示面板的显示装置和将其一端连接到显示面板的端子部分的柔性印刷电路板的情况下，柔性印刷电路板包括基底构件，形成在基底上的线层 使用金属层的构件，覆盖线层的表面保护盖和折叠部，线层包括向显示面板提供控制信号或显示数据的信号线和虚拟线，信号线被覆盖 折叠部分的表面保护罩，折叠部分包括至少一个暴露部分，虚线从折叠起点到折叠完成点从表面保护罩露出。

公开(公告)号：US07234965B2

公开(公告)日：2007-06-26

申请号：US11219800

申请日：2005-09-07

Applicant: Hirotoshi Hidaka

Inventor： Hirotoshi Hidaka

IPC: H01R12/24

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K2201/096 ,  H05K2201/10121 ,  H05K2201/2009

Abstract: The present invention prevents the wiring pattern formed on the FPC board with the support board from being damaged or broken by the edge of the support board when the FPC board is bent at the edge portion of the support board. According to the invention, the FPC board, provides the wiring pattern on at least one surface and is stuck with the support board on the surface where the wiring pattern is formed. The support board of the invention has a clipped portion in the edge along which the FPC board is bent and the wiring pattern on the FPC board passes this clipped portion.

Abstract translation: 本发明在FPC板在支撑板的边缘部分弯曲的同时，防止在FPC板上形成有支撑板的布线图案被支撑板的边缘损坏或损坏。 根据本发明，FPC基板在至少一个表面上提供布线图案，并且在形成有布线图案的表面上与支撑板卡住。 本发明的支撑板在FPC板弯曲的边缘上具有夹持部，FPC基板上的布线图案经过该夹持部。

公开(公告)号：US20070096271A1

公开(公告)日：2007-05-03

申请号：US11642583

申请日：2006-12-21

Applicant: Norio Takahashi

Inventor： Norio Takahashi

IPC: H01L23/495

CPC classification number: H05K3/0052 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T428/24314 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A substrate frame includes an insulative board (10a) having a pair of ear portions (13) extending along its longitudinal edges; a plurality of wiring substrate regions (11) arranged on the insulative board (10a) between the ear portions (13) at predetermined intervals; and a plurality of grooves (18) provided around said wiring substrate regions (11) from which wiring patterns are removed.

Abstract translation: 衬底框架包括具有沿其纵向边缘延伸的一对耳部（13）的绝缘板（10a）; 多个布置基板区域（11），其以预定间隔布置在所述耳部（13）之间的绝缘板（10a）上; 以及设置在所述布线基板区域（11）周围的多个凹槽（18），布线图案从该沟槽去除。

公开(公告)号：US20070095563A1

公开(公告)日：2007-05-03

申请号：US11640656

申请日：2006-12-18

Applicant: Takanori Sekido

Inventor： Takanori Sekido

IPC: H05K1/09 ,  H05K1/03

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K3/3436 ,  H05K3/4061 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: The invention provides a circuit board that includes a flat core plate, a buildup layer having insulation layers and conductor layers alternately stacked on each other, and surface conductor layers provided on the buildup layer. The circuit board further includes deformation-interrupting sections extending through the insulation layers between the conductor layers as electric wires. The deformation-interrupting sections adjust the thermal expansion coefficient of the whole circuit board, and enhance the rigidity of the circuit board. The invention also provides a method for forming the circuit board.

Abstract translation: 本发明提供一种电路板，其包括平坦的芯板，具有绝缘层的堆积层和彼此交替堆叠的导体层，以及设置在积聚层上的表面导体层。 电路板还包括延伸穿过导体层之间的绝缘层作为电线的变形中断部分。 变形中断部调整整个电路板的热膨胀系数，提高电路板的刚性。 本发明还提供了一种形成电路板的方法。

公开(公告)号：US20070081309A1

公开(公告)日：2007-04-12

申请号：US11508939

申请日：2006-08-24

Applicant: Toshichika Urushibara ,  Koji Shiozawa ,  Masakazu Okabe ,  Yukiko Hyodo ,  Yusuke Masuda ,  Tadayuki Miyamoto

Inventor： Toshichika Urushibara ,  Koji Shiozawa ,  Masakazu Okabe ,  Yukiko Hyodo ,  Yusuke Masuda ,  Tadayuki Miyamoto

IPC: H05K7/00 ,  H05K1/18 ,  H05K1/00

CPC classification number: H05K1/147 ,  H05K1/141 ,  H05K1/189 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/09063 ,  H05K2201/2009 ,  H05K2203/1572 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T156/1075 ,  Y10T156/137

Abstract: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.

Abstract translation: 电路基板包括：第一刚性基板，具有在一个表面上以预定间隔设置的多个焊盘部分;第二刚性基板，具有在一个表面上以预定间隔设置的多个第二焊盘部分和由 第一刚性基板和第二刚性基板，并且在一个表面上具有对应于第一焊盘部分的多个第三焊盘部分和与另一个表面上的第二焊盘部分对应的多个第四焊盘部分。 在该电路基板中，第二和第四接地部分相对于第一和第三接地部分以及第一和第三接地部分的至少一部分彼此位移，并且第二和第四接地部分的至少一部分电连接到 彼此分别。

公开(公告)号：US20070055336A1

公开(公告)日：2007-03-08

申请号：US11523965

申请日：2006-09-19

Applicant: Robert Greenberg ,  Matthew McMahon ,  James Little ,  Kelly McClure ,  Brian Mech ,  Neil Talbot ,  Jordan Neysmith

Inventor： Robert Greenberg ,  Matthew McMahon ,  James Little ,  Kelly McClure ,  Brian Mech ,  Neil Talbot ,  Jordan Neysmith

IPC: A61N1/04

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。