公开(公告)号：US11655970B2

公开(公告)日：2023-05-23

申请号：US17469037

申请日：2021-09-08

Applicant: ABL IP Holding LLC

Inventor： Benjamin M. Suttles ,  Patrick M. Tweel ,  Nicholas A. Ratliff ,  Elías Aurelio Romero Saldívar ,  Theodore R. Blumstein

IPC: F21V23/00 ,  F21V23/06 ,  H05B47/10 ,  H05K1/14 ,  H05K1/18 ,  F21S8/06 ,  F21Y103/10 ,  F21V21/005 ,  F21Y115/10

CPC classification number: F21V23/008 ,  F21S8/06 ,  F21V23/06 ,  H05B47/10 ,  H05K1/142 ,  H05K1/181 ,  F21V21/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2201/209

Abstract: A lighting fixture, including a bus printed circuit board that receives power from an external source, may be configured with programmable drivers. The bus printed circuit board has mechanical features for receiving the programmable drivers to mechanically mount the programmable driver to the bus printed circuit board. Each programmable driver may have a set of spring contacts positioned to engage exposed pads of the bus printed circuit board when the programmable driver is mounted to the bus printed circuit board, to supply power to the programmable driver. The lighting fixture further includes one or more light sources driven by the programmable drivers.

公开(公告)号：US20180077795A1

公开(公告)日：2018-03-15

申请号：US15819857

申请日：2017-11-21

Applicant: SMR Patents S.à.r.l.

Inventor： Andreas Herrmann

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/36 ,  H05K3/00 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0292 ,  B60R1/12 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/14 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/341 ,  H05K3/361 ,  H05K2201/0187 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/10386 ,  H05K2201/209 ,  H05K2203/107 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K2203/168 ,  Y10T29/49126

Abstract: A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

公开(公告)号：US09799973B2

公开(公告)日：2017-10-24

申请号：US15259144

申请日：2016-09-08

Applicant: Ross Video Limited

Inventor： Donald Mark Sizemore ,  Curtis Rylee Keim ,  Nicholas Daniel Parry ,  Mark Justin Sonderegger ,  Thomas Curtis Brown

IPC: H01R12/00 ,  H01R12/73 ,  H01R12/70 ,  H05K1/11 ,  H05K3/36

CPC classification number: H01R12/737 ,  H01R12/7011 ,  H01R12/7047 ,  H01R12/722 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10409 ,  H05K2201/209 ,  H05K2203/167

Abstract: Printed circuit board pad layouts and mechanical retainers are disclosed herein. For example, a printed circuit board is disclosed having a row of electrically conductive pads, the row of pads including pairs of signal pads with exactly one reference pad interposed between each pair of the signal pads. As another example, a mechanical retainer is disclosed that may assist in interconnecting two printed circuit boards and that has a longitudinal body with a threaded end, a head at an end opposite the threaded end, and a shank connecting the head to the threaded end.

公开(公告)号：US09480172B2

公开(公告)日：2016-10-25

申请号：US14368623

申请日：2012-12-28

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Volodymyr Karpovych ,  Johannes Stahr

IPC: H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H05K3/40 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K3/4611 ,  H05K1/11 ,  H05K1/142 ,  H05K1/18 ,  H05K3/368 ,  H05K3/403 ,  H05K3/4694 ,  H05K2201/09045 ,  H05K2201/0919 ,  H05K2201/09572 ,  H05K2201/1059 ,  H05K2201/209 ,  Y10T29/49126

Abstract: A printed circuit board and a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. At least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface.

Abstract translation: 一种印刷电路板和由至少两个印刷电路板区域组成的印刷电路板的制造方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 在彼此连接的情况下，在每种情况下，至少一个彼此直接相邻的侧面的区域通过机械联接彼此连接。 导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧表面处彼此导电耦合。

公开(公告)号：US20160192492A1

公开(公告)日：2016-06-30

申请号：US14583145

申请日：2014-12-25

Applicant: EZEK LAB COMPANY LIMITED

Inventor： Sheng-Che Huang ,  Yu-Tse Liu ,  Wei-Han Hu ,  Chien-Hung Lee

IPC: H05K1/14 ,  H01R12/71

CPC classification number: H05K1/144 ,  H01R9/2408 ,  H01R9/2458 ,  H01R12/718 ,  H01R12/732 ,  H05K1/142 ,  H05K1/184 ,  H05K2201/10189 ,  H05K2201/2072 ,  H05K2201/209

Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.

Abstract translation: 电路模块系统包括第一和第二电路模块，第一电路模块包括第一电路板和第一连接壳体，第一连接壳体包括连接到第一电路板一侧的第一基座和至少一个第一电路板 导体。 第一基座的顶表面形成连接到外部的填充器，第一导体夹在第一基座上并将第一电路板电连接到外部。 第二电路模块包括第二电路板和第二连接壳体，第二连接壳体包括连接到第二电路板侧面的第二基座和至少一个第二导体。 突出部分从第二基座的外侧突出，第二导体被夹紧在第二基座上并将第二电路板电连接到外部。

公开(公告)号：US09347621B2

公开(公告)日：2016-05-24

申请号：US13905977

申请日：2013-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Ho Shin ,  Seok Chan Hong ,  Sung Oh Ahn

IPC: H01L33/60 ,  F21K99/00 ,  H05K3/00

CPC classification number: F21V13/04 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/133611 ,  H01L33/60 ,  H05K3/0052 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/209

Abstract: A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

Abstract translation: 发光模块包括电路板，其具有沿一个方向布置的多个反射部分和连接多个反射部分的连接部分，安装在多个反射部分上的发光器件以及设置成覆盖发光器件内部的透镜单元 在其上安装有发光装置的多个反射部分中的表面的边界。 每个连接部分在垂直于其一个方向的另一个方向上的宽度小于每个透镜单元的直径，从而减少了暗部分的产生。

公开(公告)号：US08981869B2

公开(公告)日：2015-03-17

申请号：US12694450

申请日：2010-01-27

Applicant: Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

Inventor： Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

IPC: H03H7/38 ,  H01Q21/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01Q21/0087 ,  H03H7/38 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09145 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/209 ,  H05K2203/061 ,  Y10T29/49165

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。

公开(公告)号：US20140264393A1

公开(公告)日：2014-09-18

申请号：US13802982

申请日：2013-03-14

Applicant: ABL IP HOLDING LLC

Inventor： Forrest Starnes McCanless

IPC: H01L33/64

CPC classification number: H05K1/021 ,  F21V19/004 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K2201/10106 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/302 ,  H01L2924/00

Abstract: A light engine with a heat sink having a curved recessed cavity that receives a flexed or cupped PCB bearing a plurality of LEDs. Once situated within the cavity and released, the PCB has a tendency to return to its flat state, but flanges or other suitable mechanisms at the ends of the cavity restrain the edges of the PCB and prevent the PCB from returning to its flat state. In this way, the PCB is securely retained within and biased against the cavity by its own forces. As the PCB heats, the PCB expands, further biasing the PCB against the cavity of the heat sink and increasing the thermal conductivity between the two components.

Abstract translation: 具有散热器的光引擎具有弯曲的凹腔，其接收带有多个LED的弯曲或杯形PCB。 一旦位于腔内并被释放，PCB就有回到其平坦状态的趋势，但在腔的端部处的凸缘或其它合适的机构限制了PCB的边缘并防止PCB回到其平坦状态。 以这种方式，PCB通过其自身的力被牢固地保持在腔内并且被偏压。 当PCB加热时，PCB膨胀，进一步将PCB偏压抵靠散热器的腔体并增加两个部件之间的导热性。

公开(公告)号：US20140231793A1

公开(公告)日：2014-08-21

申请号：US14347908

申请日：2011-09-29

Applicant: Kamala Rajan ,  Emory Krall ,  Prashant Mandlik ,  Ruiqing Ma ,  Peter Levermore ,  Huiqing Pang ,  Jeffrey Silvernail

Inventor： Kamala Rajan ,  Emory Krall ,  Prashant Mandlik ,  Ruiqing Ma ,  Peter Levermore ,  Huiqing Pang ,  Jeffrey Silvernail

IPC: H01L51/00 ,  H01L51/52

CPC classification number: H01L51/0097 ,  F21S6/003 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L27/3202 ,  H01L27/3204 ,  H01L51/52 ,  H01L2251/5361 ,  H01R12/61 ,  H01R13/7175 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/2072 ,  H05K2201/209 ,  Y02E10/549

Abstract: Devices comprising multiple flexible substrates bearing OLEDs are provided. The flexible substrates are interconnected, and the properties of the substrates and the interconnections provide the shape of the device.

Abstract translation: 提供了包括多个柔性基板的装置，该柔性基板带有OLED。 柔性基板互连，并且基板和互连件的特性提供了该装置的形状。

公开(公告)号：US20140192502A1

公开(公告)日：2014-07-10

申请号：US13736086

申请日：2013-01-08

Applicant: Shuang Xu

Inventor： Shuang Xu

IPC: H05K3/00 ,  H05K1/14

CPC classification number: H05K1/142 ,  H05K3/36 ,  H05K3/42 ,  H05K2201/09145 ,  H05K2201/09618 ,  H05K2201/209 ,  H05K2203/044 ,  Y10T29/49126

Abstract: Disclosed are a method and system to reduce impedance of printed circuit boards through an interconnecting of printed circuit boards using a square wave pattern of plated-through holes. A method of connecting a first printed circuit board to a second printed circuit board comprises forming a square wave pattern of the first printed circuit board and the second printed circuit board and adjoining the first printed circuit board and the second printed circuit board. The method also involves producing plated-through holes along the square wave pattern, a top section, and/or a bottom section of the adjoined first printed circuit board and second printed circuit board. The method further involves securing the top section and the bottom section using a first metal clip and a second metal clip, respectively, and connecting the first printed circuit board to the second printed circuit board by a wave soldering process.

Abstract translation: 公开了通过使用电镀通孔的方波图案的印刷电路板的互连来减少印刷电路板的阻抗的方法和系统。 将第一印刷电路板连接到第二印刷电路板的方法包括形成第一印刷电路板和第二印刷电路板的方波图案，并且邻接第一印刷电路板和第二印刷电路板。 该方法还涉及沿邻接的第一印刷电路板和第二印刷电路板的方波图形，顶部部分和/或底部部分产生电镀通孔。 该方法还包括分别使用第一金属夹和第二金属夹固定顶部部分和底部部分，并通过波峰焊接工艺将第一印刷电路板连接到第二印刷电路板。