公开(公告)号：US20160252632A1

公开(公告)日：2016-09-01

申请号：US15147440

申请日：2016-05-05

Applicant: Arizona Board of Regents, a Body Corp. of the State of Arizona Acting for and on Behalf of Arizo

Inventor： Joseph Smith ,  Eric Forsythe ,  David Allee

IPC: G01T1/24

CPC classification number: G01T1/24 ,  G01J1/08 ,  G01J1/4228 ,  H04N5/3454 ,  H04N5/3572 ,  H04N17/002

Abstract: Some embodiments include a system having a detection sensor array, which includes multiple detection sensors with each detection sensor having an enabled state and a disabled state, and having a control module configured to operate the detection sensor array. Under the enabled state, each detection sensor is configured to detect and identify electromagnetic radiation, and under the disabled state, each detection sensor is configured not to detect and identify electromagnetic radiation. Further, the detection sensor array comprises a test state and an operational state. Other embodiments of related systems and methods are also disclosed.

Abstract translation: 一些实施例包括具有检测传感器阵列的系统，其包括多个检测传感器，每个检测传感器具有使能状态和禁用状态，并且具有被配置为操作检测传感器阵列的控制模块。 在启用状态下，每个检测传感器被配置为检测和识别电磁辐射，并且在禁用状态下，每个检测传感器被配置为不检测和识别电磁辐射。 此外，检测传感器阵列包括测试状态和操作状态。 还公开了相关系统和方法的其它实施例。

公开(公告)号：US20160238440A1

公开(公告)日：2016-08-18

申请号：US15006124

申请日：2016-01-26

Applicant: Taiwan Biophotonic Corporation

Inventor： Chang-Sheng Chu ,  Yu-Tang Li ,  Yeh-Wen Lee ,  Chih-Hsun Fan ,  Lung-Pin Chung ,  Jyh-Chern Chen ,  Shuang-Chao Chung

IPC: G01J1/04 ,  G01J1/44 ,  H04B10/071

CPC classification number: G01J1/0459 ,  A61B5/14552 ,  A61B5/681 ,  A61B2560/0443 ,  A61B2562/0233 ,  A61B2562/164 ,  A61B2562/227 ,  G01J1/0271 ,  G01J1/0437 ,  G01J1/08 ,  G01J1/4228 ,  G01J1/44 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/125 ,  H01L31/173 ,  H01L33/54 ,  H01L33/58 ,  H04B10/071

Abstract: The present disclosure relates to an optical sensor module, an optical sensing accessory, and an optical sensing device. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory and an optical sensing device comprise the optical sensor module and other electronic modules to have further applications.

Abstract translation: 本发明涉及光学传感器模块，光学感测附件和光学感测装置。 光学传感器模块包括光源，光电检测器和衬底。 光源被配置为将电力转换成辐射能并将光发射到物体表面。 光电检测器被配置为从物体表面接收光并将辐射能转换成电流或电压。 光学传感附件和光学感测装置包括光学传感器模块和其他电子模块以具有进一步的应用。

公开(公告)号：US20160223398A1

公开(公告)日：2016-08-04

申请号：US15083384

申请日：2016-03-29

Applicant: OMRON CORPORATION

Inventor： Kenji MURATA ,  Kenta YAMAKAWA ,  Kosuke UEMURA

IPC: G01J1/44 ,  G01J1/04 ,  G01J1/08

CPC classification number: G01J1/42 ,  G01B11/026 ,  G01J1/0407 ,  G01J1/08 ,  G01J1/44 ,  G01S7/4813 ,  G01S17/48

Abstract: An optical sensor includes a case and an integrated light projector entirely within the case including a light emitter, a light projecting lens, and a light projecting lens holder configured to hold the light projecting lens. A light receiver of the optical sensor is configured to receive reflected light of light projected from the light projector, and a light receiver lens is configured to form an image of the reflected light on the light receiver. The light projector, the light receiver, and the light receiver lens are each independently and directly fixed to the case.

Abstract translation: 光学传感器包括壳体和集成光投影器，其整体地在壳体内，包括发光体，投光透镜和配置为保持光投射透镜的光投射透镜保持器。 光传感器的光接收器被配置为接收从投光器投射的光的反射光，并且光接收透镜被配置为在光接收器上形成反射光的图像。 光投影仪，光接收器和光接收透镜各自独立且直接固定在外壳上。

公开(公告)号：US09322765B2

公开(公告)日：2016-04-26

申请号：US14303644

申请日：2014-06-13

Applicant: Roche Diagnostics Operations, Inc.

Inventor： Rik Harbers ,  Philipp Nicolas Zeller

IPC: G01N21/01 ,  G01J1/08 ,  G01J3/10 ,  G01J3/02 ,  G01N21/17 ,  H05B33/08

CPC classification number: G01N21/01 ,  G01J1/08 ,  G01J3/0286 ,  G01J3/10 ,  G01N21/17 ,  H05B33/0821

Abstract: An optical system comprising a light source comprising a plurality of light emitting elements (LEEs) is presented. The light source is mounted on the same substrate or chip board so that the LEEs are in thermal contact with each other such as to enable thermic conduction and heat transfer between the LEEs. The system is switchable between light source modes in which different light emitting elements or a different number of light emitting elements is switched in an on mode and in a down mode respectively. In all light source modes, one or more light emitting elements, such as those with longer expected lifetime, remain in the on mode, while one or more light emitting elements, such as those with shorter expected lifetime, may be switched in the down mode.

Abstract translation: 提出了一种包括包括多个发光元件（LEE）的光源的光学系统。 光源安装在相同的基板或芯片板上，使得LEE彼此热接触，以便能够在LEE之间进行热传导和热传递。 该系统可以在其中不同的发光元件或不同数量的发光元件分别在接通模式和下降模式下切换的光源模式之间切换。 在所有光源模式中，一个或多个发光元件，例如具有较长预期寿命的发光元件保持在导通模式，而一个或多个发光元件，例如具有较短预期寿命的发光元件可以在下模式 。

公开(公告)号：US20160061883A1

公开(公告)日：2016-03-03

申请号：US14838048

申请日：2015-08-27

Applicant: Seek Thermal, Inc.

Inventor： Andreas Engberg ,  William J. Parrish

IPC: G01R31/265 ,  G01J5/02

CPC classification number: G01R31/2656 ,  G01J1/08 ,  G01J5/02 ,  G01J5/20 ,  G01J5/522 ,  G01J2005/0048 ,  G01J2005/0077 ,  G01J2005/068 ,  G01R31/2832 ,  G01R31/318511 ,  G01R31/31937

Abstract: Disclosed herein are systems and methods for testing FPAs on a wafer prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.

Abstract translation: 本文公开了用于在将晶片切割成单个管芯之前在晶片上测试FPA的系统和方法。 焦平面阵列（FPA）可以包括在半导体衬底或裸片上的一组光电检测器，例如微电热计。 可以在晶片上制造FPA，以在单个晶片上制造多个FPA，后者可以被切割或分成单独的FPA。 在切割晶片之前，可以批量地对FPA进行电学和放射学测试，以表征各个FPA，以识别不良像素，识别不良芯片，校准各个FPA等。 这些测试结果可用于确定可接受的FPA，并可用于为具有测试和集成FPA的成像系统提供初始设置。

公开(公告)号：US09136301B2

公开(公告)日：2015-09-15

申请号：US14020908

申请日：2013-09-09

Applicant: Maxchip Electronics Corp.

Inventor： Jin-Wei Chang ,  Hung-Lung Wang ,  Jung-Kai Hung

IPC: H01L27/14 ,  H01L27/146 ,  G01J1/02 ,  G01J1/08 ,  G01J1/42 ,  H01L27/144 ,  G01J3/36 ,  G01J5/08

CPC classification number: H01L27/14649 ,  G01J1/02 ,  G01J1/029 ,  G01J1/08 ,  G01J1/4204 ,  G01J1/4228 ,  G01J3/36 ,  G01J5/0846 ,  H01L27/1443 ,  H01L27/14621 ,  H01L27/14652

Abstract: Provided is a multi-wave band light sensor combined with a function of infrared ray (IR) sensing including a substrate, an IR sensing structure, a dielectric layer, and a multi-wave band light sensing structure. The substrate includes a first region and a second region. The IR sensing structure is in the substrate for sensing IR. The dielectric layer is on the IR sensing structure. The multi-wave band light sensing structure includes a first wave band light sensor, a second wave band light sensor, and a third wave band light sensor. The second wave band light sensor and the first wave band light sensor are overlapped and disposed on the IR sensing structure on the first region of the substrate from the bottom up. The third wave band light sensor is in the dielectric layer of the second region.

Abstract translation: 提供了与包括基板，IR感测结构，电介质层和多波段光感测结构的红外线（IR）感测功能相结合的多波段光束传感器。 衬底包括第一区域和第二区域。 IR感测结构位于用于感测IR的基板中。 电介质层位于IR感测结构上。 多波段光束感测结构包括第一波段光传感器，第二波段光传感器和第三波段光传感器。 第二波段光传感器和第一波段光传感器从底部向上叠置并设置在基板的第一区域上的IR感测结构上。 第三波段光传感器位于第二区域的介质层中。

公开(公告)号：US09116038B2

公开(公告)日：2015-08-25

申请号：US13969824

申请日：2013-08-19

Applicant: International Business Machines Corporation

Inventor： Carlos Strocchia-Rivera

IPC: G01J1/08 ,  F21V13/04 ,  F21V5/00

CPC classification number: G01J1/08 ,  F21V5/00 ,  F21V13/04 ,  G01J1/0411 ,  G01J1/0414 ,  G01J1/1626 ,  G01J2001/1642 ,  G01J2003/2866 ,  G01N2021/8427

Abstract: An integrated illumination reference source for generating an illumination reference signal may include an optical element having a first outer surface and a second outer surface, such that the first and the second outer surface are substantially opposing. The optical element receives an incident optical signal at the first outer surface and projects the incident optical signal from the second outer surface onto a surface. A reflective device that is located on a region of the second outer surface is offset from an optical axis of the optical element. The reflective device includes a reflective surface that reflects a portion of the incident optical signal from the second outer surface back through the first outer surface, whereby the reflective surface of the reflective device is encapsulated between the first outer surface and the second outer surface of the optical element.

Abstract translation: 用于产生照明参考信号的集成照明参考源可以包括具有第一外表面和第二外表面的光学元件，使得第一外表面和第二外表面基本上相对。 光学元件在第一外表面处接收入射光信号，并将来自第二外表面的入射光信号投射到表面上。 位于第二外表面的区域上的反射装置偏离光学元件的光轴。 反射装置包括反射表面，反射表面将来自第二外表面的入射光信号的一部分反射回第一外表面，由此反射装置的反射表面被封装在第一外表面和第二外表面之间 光学元件。

公开(公告)号：US09024253B2

公开(公告)日：2015-05-05

申请号：US13590685

申请日：2012-08-21

Applicant: Howard M. De Ruyter ,  James Steven Blackmon

Inventor： Howard M. De Ruyter ,  James Steven Blackmon

IPC: G01D18/00 ,  G01J1/08 ,  G01J5/04 ,  G01J1/04 ,  G01J5/52 ,  G01J5/08

CPC classification number: G01J1/08 ,  G01J1/0414 ,  G01J5/047 ,  G01J5/0809 ,  G01J5/522

Abstract: A calibration system and method for calibrating a detector are disclosed. In one example, the calibration system comprises a plurality of radiation sources configured to emit electromagnetic radiation, a positioning mechanism disposed opposite the plurality of radiation sources, having a single degree of freedom with respect to the plurality of radiation sources, and an optical element coupled to the positioning mechanism, and configured to rotate to a plurality of calibration positions, the optical element in each of the plurality of calibration positions being configured to receive the electromagnetic radiation from a corresponding radiation source and to reflect the electromagnetic radiation to the detector.

Abstract translation: 公开了一种用于校准检测器的校准系统和方法。 在一个示例中，校准系统包括被配置为发射电磁辐射的多个辐射源，与多个辐射源相对设置的定位机构，其具有相对于多个辐射源的单个自由度，以及耦合到 并且被配置为旋转到多个校准位置，所述多个校准位置中的每一个中的所述光学元件被配置为从相应的辐射源接收电磁辐射并将所述电磁辐射反射到所述检测器。

公开(公告)号：US20150109785A1

公开(公告)日：2015-04-23

申请号：US14277263

申请日：2014-05-14

Applicant: Maxim Integrated Products, Inc.

Inventor： Nicole D. Kerness ,  Arkadii V. Samoilov ,  Jerome C. Bhat ,  Anand Chamakura ,  Kumar Nagarajan ,  Christopher F. Edwards

IPC: F21V23/00 ,  F21V33/00

CPC classification number: G01J1/0411 ,  G01J1/0271 ,  G01J1/08 ,  G01J1/4204

Abstract: A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.

Abstract translation: 描述了晶片级光学器件，系统和方法，其包括衬底，设置在衬底上的电子器件，设置在电子器件上的照明源，设置在衬底上的外壳，其中外壳包括至少一个光学表面 并且覆盖电子设备和照明源，以及设置在远离电子设备的基板侧的至少一个焊球。 在实现中，使用采用本公开技术的晶片级光学器件和透镜集成封装系统的方法包括接收衬底，将电子器件放置在衬底上，将照明源放置在电子器件上，以及放置 基板上的外壳，其中外壳覆盖电子设备和照明源，并且外壳和壁结构形成第一隔间和第二隔间。

公开(公告)号：US08986607B2

公开(公告)日：2015-03-24

申请号：US10547172

申请日：2004-02-27

Applicant: Heinz Anderle ,  Peter Matthiessen ,  Hans-Peter Schwarz ,  Peter Turecek ,  Thomas Kreil ,  Daniel R. Boggs

Inventor： Heinz Anderle ,  Peter Matthiessen ,  Hans-Peter Schwarz ,  Peter Turecek ,  Thomas Kreil ,  Daniel R. Boggs

IPC: A61L2/00 ,  C12N13/00 ,  G01J1/08 ,  A61L2/10 ,  A61L2/28 ,  G01J1/42 ,  G01J1/48 ,  A61M1/36 ,  C02F1/32

CPC classification number: G01J1/08 ,  A61L2/0011 ,  A61L2/0017 ,  A61L2/0052 ,  A61L2/10 ,  A61L2/28 ,  A61L2202/22 ,  A61M1/3681 ,  A61M1/3683 ,  A61M2205/053 ,  C02F1/32 ,  C02F2201/326 ,  G01J1/42 ,  G01J1/48

Abstract: A validatable method for determining a photochemically effective dose for inactivating pathogens in a fluid sample is described herein. In particular, the instant invention covers methods for determining a photochemically effective dose sufficient to inactivate pathogens in a biological sample while leaving biologically active substances of interest unaffected. A batch irradiation reactor effective for inactivating pathogens in biological samples is also described.

Abstract translation: 本文描述了用于确定用于灭活流体样品中病原体的光化学有效剂量的可验证方法。 特别地，本发明包括确定足以灭活生物样品中的病原体的光化学有效剂量同时使感兴趣的生物活性物质不受影响的方法。 还描述了有效用于灭活生物样品中的病原体的批量照射反应器。