公开(公告)号：US07321099B2

公开(公告)日：2008-01-22

申请号：US10921196

申请日：2004-08-19

Applicant: Kinuko Mishiro

Inventor： Kinuko Mishiro

IPC: H05K1/16

CPC classification number: H01L24/32 ,  H01L23/04 ,  H01L23/13 ,  H01L23/562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/19106 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/10155 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.

Abstract translation: 为了提供吸收由冲击引起的应力的部件安装基板和部件安装结构，或者基板和部件之间的热延伸系数的差异，而不增加将基板和部件焊接在一起所需的精度。 要安装有具有一个或多个焊接点的部件的基板，部件连接到基板上，其部件形成在其部件侧上，其上设置有一个或多个电极以紧密连接 与焊点。 凹陷部分填充有与构成基体的材料的刚性不同的填充材料，使得填充材料与基材的部件侧的表面齐平或几乎齐平。

公开(公告)号：US20070298624A1

公开(公告)日：2007-12-27

申请号：US11365366

申请日：2006-03-01

Applicant: Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

Inventor： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

Abstract translation: 包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机 还提供了一种制造焊盘栅格阵列中介层结构的方法。

公开(公告)号：US20070264438A1

公开(公告)日：2007-11-15

申请号：US11564418

申请日：2006-11-29

Applicant: Kenji Kawai

Inventor： Kenji Kawai

IPC: C08L71/02 ,  B05C5/00

CPC classification number: H05K3/4688 ,  C08G59/621 ,  C08L21/00 ,  C08L63/00 ,  C08L71/00 ,  H05K3/381 ,  H05K3/4632 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0212 ,  C08L2666/14 ,  C08L61/04 ,  C08L2666/04

Abstract: Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0

Abstract translation: 环氧树脂组合物，其包含（A）在分子中具有两个或更多个环氧基的环氧树脂; （B）分子中的平均羟基含量（（羟基的总数）/（苯环的总数）的平均值）/（苯环的总数））的酚类固化剂满足式0

公开(公告)号：US07278207B2

公开(公告)日：2007-10-09

申请号：US11182167

申请日：2005-07-15

Applicant: Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC: H01K3/10 ,  H01R12/04 ,  H01L21/00

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

公开(公告)号：US20070194459A1

公开(公告)日：2007-08-23

申请号：US11676869

申请日：2007-02-20

Applicant: Michael Bauer ,  Rainer Steiner ,  Holger Woerner

Inventor： Michael Bauer ,  Rainer Steiner ,  Holger Woerner

IPC: H01L23/48

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/114 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/091 ,  H05K2203/0278 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.

Abstract translation: 半导体部件的布线基板包括：具有布线结构的下侧; 顶部有切口; 布置在所述切口中的橡胶弹性材料; 以及设置在橡胶弹性材料上并且被配置为联接到外部触点的外部接触垫。 制造这种布线基板的方法涉及在生产过程中将橡胶弹性材料垫压入聚合物塑料的前体中。

公开(公告)号：US07247381B1

公开(公告)日：2007-07-24

申请号：US09762823

申请日：1998-08-13

Applicant: Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

Inventor： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC: B32B27/38

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.

Abstract translation: 一种用于将半导体芯片接合并固定到电路板并将两个电极电连接并将100重量份粘合剂树脂组合物和10-200重量份粘合剂树脂组合物和10至200重量份的粘合剂粘合并固定的粘合剂 的无机填料，其中电路构件用粘合剂粘合在一起的电路板，以及制造电路板的方法。

公开(公告)号：US20070165075A1

公开(公告)日：2007-07-19

申请号：US11334892

申请日：2006-01-19

Applicant: Ronald Imken ,  Thach Truong

Inventor： Ronald Imken ,  Thach Truong

IPC: B41J2/05

CPC classification number: B41J2/14024 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/03 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0133

Abstract: A circuit article for use with an inkjet printer pen. The circuit article comprises a flexible circuit having a plurality of conductive traces disposed on a dielectric film, an adhesive film disposed adjacent the dielectric film of the flexible circuit, and a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit. The adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent.

Abstract translation: 用于喷墨打印机笔的电路制品。 电路制品包括柔性电路，其具有布置在电介质膜上的多个导电迹线，邻近柔性电路的介电膜设置的粘合膜以及与柔性电路相对设置在第一粘合膜附近的载体膜。 粘合膜衍生自包含环氧化芳族二烯嵌段共聚物和热固化剂的可交联前体。

公开(公告)号：US20070115644A1

公开(公告)日：2007-05-24

申请号：US11589740

申请日：2006-10-31

Applicant: Sung-Hyup Kim ,  Sang-Jae Lee ,  Sun-Soo Kim

Inventor： Sung-Hyup Kim ,  Sang-Jae Lee ,  Sun-Soo Kim

IPC: H05K7/20

CPC classification number: H05K5/0086 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/203 ,  H04M1/0277 ,  H05K1/0203 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y02A30/50

Abstract: A method of cooling an electronic device that includes a case, a printed circuit board, and internal components. The method includes disposing a heat conductive filler having elasticity on any one of or any combination of a top surface of the printed circuit board, a bottom surface of the printed circuit board, one or more of the internal components, and an inner surface of the case during assembly of the electronic device; wherein after the electronic device has been assembled, the printed circuit, the internal components, and the heat conductive filler are disposed inside the case, and the heat conductive filler is in close contact with at least one of the internal components.

Abstract translation: 一种冷却包括壳体，印刷电路板和内部部件的电子设备的方法。 该方法包括在印刷电路板的顶表面，印刷电路板的底表面，一个或多个内部部件和内部部件的内表面中的任一个或任意组合上布置具有弹性的导热填料 电子装置组装时的情况; 其中在组装电子装置之后，将印刷电路，内部部件和导热填料设置在壳体内部，并且导热填料与至少一个内部部件紧密接触。

公开(公告)号：US07186591B2

公开(公告)日：2007-03-06

申请号：US11165230

申请日：2005-06-24

Applicant: Lance T. Nehr ,  Leon L. Vail ,  Patricia C. Tarr ,  Daniel McAlister

Inventor： Lance T. Nehr ,  Leon L. Vail ,  Patricia C. Tarr ,  Daniel McAlister

IPC: H01L21/48

CPC classification number: H01L21/56 ,  H01L23/24 ,  H01L23/293 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2203/0783 ,  H05K2203/085 ,  H05K2203/095 ,  H05K2203/1316 ,  H05K2203/163 ,  H01L2924/00

Abstract: A method for encapsulating an assembly with a methyl phenyl silicone rubber compound is provided. In various embodiments, the method can include exposing the assembly to a solvent, plasma etching the assembly, and producing a potting mixture, wherein the potting mixture comprises a methyl phenyl room temperature vulcanization silicone and a curing agent. The method can further include pouring the potting mixture over the assembly while under a vacuum until the assembly is encapsulated, pouring at least two control samples of the potting mixture while under the vacuum, curing the encapsulated assembly and the control samples in a first environment and monitoring the one of the control samples for hardness, and determining whether additional cure time in the first environment is needed based upon the results of the control sample hardness tests.

Abstract translation: 提供了一种用甲基苯基硅橡胶化合物封装组合物的方法。 在各种实施例中，该方法可以包括将组件暴露于溶剂，等离子体蚀刻组件，以及产生灌封混合物，其中灌封混合物包含甲基苯基室温硫化硅氧烷和固化剂。 该方法还可以包括在真空下将灌封混合物浇注在组件上，直到组装被包封，在真空下倾倒灌封混合物的至少两个对照样品，在第一环境中固化封装的组件和对照样品， 监测对照样品的硬度，并根据对照样品硬度试验的结果确定是否需要在第一种环境中是否需要另外的固化时间。

公开(公告)号：US20070049987A1

公开(公告)日：2007-03-01

申请号：US11521281

申请日：2006-09-13

Applicant: Robert Greenberg ,  Mark Humayun

Inventor： Robert Greenberg ,  Mark Humayun

IPC: A61N1/36

CPC classification number: A61N1/36046 ,  A61F9/08 ,  A61N1/0543 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/28 ,  H05K2201/0133

Abstract: Applicant has proposed a combination of the subretinal and epiretinal methods by placing the electronics external to the eye, entering the eye through the pars plana and the piercing the retina (retinotomy) from inside the eye to stimulate subreintally. The present invention is an improved electrode array for subretinal stimulation. A hard polymer such as polyimide is biocompatible and strong for supporting an electrode array and supporting traces in a thin flex circuit array. In the present invention applicant takes advantage of the sharp nature of thin polyimide making a point on the end of the electrode array. This allows the flexible circuit electrode array to be both electrode array and surgical tool to cut the retinal and slide the array under the retina in a single action.

Abstract translation: 申请人提出了通过将眼睛外部电子放置在眼睛的外部并通过平面进入眼睛并从眼睛刺穿视网膜（视网膜切开术）以刺激眼底的方式来组合视网膜下和视网膜的方法。 本发明是用于视网膜下刺激的改进的电极阵列。 诸如聚酰亚胺之类的硬聚合物是生物相容性强的，用于支撑电极阵列和支撑在薄柔性电路阵列中的迹线。 在本发明中，申请人利用薄聚酰亚胺的尖锐特性，在电极阵列的末端形成点。 这使得柔性电路电极阵列既可以是电极阵列，也可以是手术工具，以切割视网膜，并在阵列下方以单一动作滑动阵列。