公开(公告)号：US07450398B2

公开(公告)日：2008-11-11

申请号：US11489900

申请日：2006-07-20

Applicant: Byoung-Ha Oh ,  Hwa-Jin Jung

Inventor： Byoung-Ha Oh ,  Hwa-Jin Jung

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/4691 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission path between the first and second substrates, the signal transmission part being extended out of a region having a size smaller than a maximum size of the first substrate within the first substrate, and being extended in the second substrate. In disposing two substrates in a spaced-apart structure of upper and lower positions, a length of flexible printed circuit (FPC) connecting the two substrates can be reduced, and an impedance mismatching caused in use of the FPC can be reduced.

Abstract translation: 一种改进的印刷电路板（PCB）包括第一和第二基板，其被布置为相互间隔或间隔开，并且其中安装有至少一个或多个半导体芯片;以及信号传输部分，用于在第一和第二基板之间提供信号传输路径 第二基板，信号传输部分从第一基板内的尺寸小于第一基板的最大尺寸的区域延伸出来，并在第二基板中延伸。 在将两个基板设置在上下位置的间隔开的结构中，可以减少连接两个基板的柔性印刷电路（FPC）的长度，并且可以减少在使用FPC时引起的阻抗失配。

公开(公告)号：US20080218010A1

公开(公告)日：2008-09-11

申请号：US12030272

申请日：2008-02-13

Applicant: Toshifumi Hino ,  Nobuhiko Sato

Inventor： Toshifumi Hino ,  Nobuhiko Sato

IPC: H02K11/00

CPC classification number: H05K3/445 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K3/0061 ,  H05K3/306 ,  H05K3/3421 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10287

Abstract: The present invention provides a motor that enables a lead of a coil to be appropriately led through holes, while allowing the lead of the coil to be fixed without contacting a wall surface of the hole in a base. Cuts 14b are formed in an insulating sheet or a printed circuit board 14; the cuts 14b extend substantially radially or spirally from a lead lead-out portion 14a as a center. Thus, even if an end of the lead 7a abuts against an area located outside the lead lead-out portion 14a, the abutting area and a nearby area located in the vicinity of the abutting area are pushed open along the cuts 14b extending from the lead lead-out portion 14a and guide the end of the lead 7a toward the lead lead-out portion 14a. The end of the lead 7a is thus appropriately guided into the lead lead-out portion 14a.

Abstract translation: 本发明提供一种电动机，其能够使线圈的引线适当地引导通孔，同时允许线圈的引线固定而不接触基座中的孔的壁表面。 切口14b形成在绝缘片或印刷电路板14中; 切口14b从作为中心的引线引出部分14a基本上径向或螺旋地延伸。 因此，即使引线7a的一端与位于引出引出部分14a外部的区域邻接，位于邻接区域附近的邻接区域和附近区域沿着延伸的切口14b被推开 从引出引出部分14a引导引线7a的端部朝向引出引出部分14a。 引线7a的端部被适当地引导到引出引出部分14a中。

公开(公告)号：US20070167041A1

公开(公告)日：2007-07-19

申请号：US11684074

申请日：2007-03-09

Applicant: Chih-Chung Chao ,  Che-Chih Chang

Inventor： Chih-Chung Chao ,  Che-Chih Chang

IPC: H01R12/00

CPC classification number: G02F1/13452 ,  H01R12/62 ,  H01R12/7076 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09081 ,  H05K2201/10393

Abstract: Modules for fixing flexible printed circuit boards. A module comprises a casing and a flexible printed circuit board. The casing has a recess on a lateral side. The flexible printed circuit board has a flexible portion disposed in the recess, wherein the thickness of the flexible portion is substantially equal to the thickness of the recess.

Abstract translation: 用于固定柔性印刷电路板的模块。 模块包括壳体和柔性印刷电路板。 壳体在侧面具有凹部。 柔性印刷电路板具有设置在凹部中的柔性部分，其中柔性部分的厚度基本上等于凹部的厚度。

公开(公告)号：US20070047144A1

公开(公告)日：2007-03-01

申请号：US11509972

申请日：2006-08-25

Applicant: Eiki Oosawa

Inventor： Eiki Oosawa

IPC: G11B5/60

CPC classification number: G11B5/60 ,  H05K3/3442 ,  H05K2201/09081 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/107 ,  Y02P70/613

Abstract: A head gimbal assembly for a hard disk drive includes a head slider having a head element part which performs reading and/or writing of data to/from a magnetic disc and a suspension on which the head slider is mounted. Bonding pads formed on the head slider are formed on a side surface of the head slider except for an air bearing surface (ABS) which faces the magnetic disc and a back surface on a side opposite to the ABS. End peripheries of the bonding pads are arranged to be in contact with an end periphery of the side surface of the head slider which abuts on the back surface of the head slider.

Abstract translation: 用于硬盘驱动器的头万向架组件包括具有头元件部分的磁头滑动器，磁头元件部件执行从磁盘读取和/或写入数据以及安装磁头滑块的悬架。 形成在磁头滑块上的接合焊盘形成在磁头滑块的侧表面上，除了面向磁盘的空气轴承表面（ABS）和与ABS相对的一侧的后表面。 接合焊盘的端部周边被布置成与头部滑块的侧表面的与端部滑块的后表面邻接的端部周边接触。

公开(公告)号：US07061076B2

公开(公告)日：2006-06-13

申请号：US10918679

申请日：2004-08-12

Applicant: Stephen R. Shiffer

Inventor： Stephen R. Shiffer

IPC: H01L23/58

CPC classification number: H05K1/184 ,  H05K1/182 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09981 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.

Abstract translation: 一种用于提供一个或多个电子部件的三维载体安装的装置和方法。 根据一个实施例，本发明的装置安装装置包括具有至少两个维度的部件安装表面的弹性弹性塑料基板。 至少一个按压配合部件插入腔设置在部件安装表面内，以在压配合到腔中时提供电子部件的压缩保持。 优选地，空腔具有这样的深度，使得当组件被压配合时，其不延伸到空腔的表面平面之上。 插入腔的特征还在于包括设置在所述插入腔的内表面上并定位在插入腔表面上的至少一个导电迹线，使得导电迹线接触保持在插入腔内的电子器件的至少一个引线。

公开(公告)号：US20060028222A1

公开(公告)日：2006-02-09

申请号：US11243702

申请日：2005-10-05

Applicant: Warren Farnworth ,  Salman Akram

Inventor： Warren Farnworth ,  Salman Akram

IPC: G01R31/02

CPC classification number: H05K3/326 ,  G01R1/0466 ,  G01R31/2853 ,  H05K1/118 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage a bumped contact. The leads are adapted to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the leads can include projections for penetrating the bumped contacts, a non-bonding outer layer for preventing bonding to the bumped contacts, and a curved shape which matches a topography of the bumped contacts. The leads can be formed by forming a patterned metal layer on the substrate, by attaching a polymer substrate with the leads thereon to the substrate, or be etching the substrate to form conductive beams.

Abstract translation: 用于测试半导体部件的互连件包括基板和基板上的触点，用于与部件上的凸起触点进行临时电连接。 每个接触件包括一个凹部和悬在该凹部上的引线图案，其构造成电接合凸起的触点。 引线适于在凹部内在z方向上移动以适应凸起接触件的高度和平面度的变化。 此外，引线可以包括用于穿透凸起的触点的突起，用于防止与凸起的触点接合的非结合外层以及与凸起的触点的形状相匹配的弯曲形状。 可以通过在基板上形成图案化的金属层，通过将聚合物基板与其上的引线附接到基板上，或者蚀刻基板以形成导电梁来形成引线。

公开(公告)号：US06991486B2

公开(公告)日：2006-01-31

申请号：US10457494

申请日：2003-06-09

Applicant: Tatsuya Takai ,  Katsumasa Matsuoka ,  Yoshiaki Kato ,  Shigeru Hayashi ,  Kazunori Nakane

Inventor： Tatsuya Takai ,  Katsumasa Matsuoka ,  Yoshiaki Kato ,  Shigeru Hayashi ,  Kazunori Nakane

IPC: H01R13/64

CPC classification number: H01R13/6315 ,  H01R12/7047 ,  H01R12/727 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A connector that can be mounted to a substrate in a stable manner and a mounting structure of the connector to the substrate are provided. A connector according to the present invention includes a housing, which has a base, bosses, and terminals. Gaps are formed on portions of the base between the terminals and the bosses. The gaps extend to surround the terminals. Another connector according to the present invention includes a housing, which has a base, arms, bosses, and terminals. The arms are flexible and extend from the housing. Each boss is located at the distal end of one of the arms.

Abstract translation: 提供可以以稳定的方式安装到基板的连接器和连接器到基板的安装结构。 根据本发明的连接器包括具有基座，凸台和端子的壳体。 在端子和凸台之间的基部的一部分上形成间隙。 间隙延伸到围绕端子。 根据本发明的另一连接器包括具有底座，臂，凸台和端子的壳体。 臂是柔性的并且从壳体延伸。 每个凸台位于其中一个臂的远端。

公开(公告)号：US06963438B2

公开(公告)日：2005-11-08

申请号：US10714330

申请日：2003-11-14

Applicant: Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

Inventor： Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

IPC: B60Q1/26 ,  B60R1/07 ,  B60R1/08 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  G02F1/15 ,  B60R1/12

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

Abstract translation: 反射镜组件包括壳体，角度可调节的电源组，用于供电和镜角控制的电线，包括加热器的电致变色镜子组件和转向信号装置。 这些组件包括插入电线束上的多插头连接器或彼此搭载的单独连接器。 可选地，加热器包括具有端部连接器的内部导线，用于将功率传递到加热器的相对侧，并且还包括用于漫射从转向信号装置通过扩散材料的光的透光/扩散材料层。 印刷电路板装配在面板形载体中的凹槽中，并且整体的保持器可释放地固定印刷电路板。 电源组通过一个弹性手指环连接到载体上，连续的环形凸缘可防止载体和反射镜组件中的玻璃元件的变形。

公开(公告)号：US20050055829A1

公开(公告)日：2005-03-17

申请号：US10968921

申请日：2004-10-21

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B21D53/76 ,  B41J2/04 ,  B41J2/045 ,  B41J2/14 ,  B41J2/16 ,  B41J2/165 ,  B41J2/175 ,  B41J3/42 ,  B41J3/44 ,  B41J11/00 ,  B41J11/70 ,  B41J15/04 ,  G01D15/00 ,  G06F1/16 ,  G06F21/00 ,  G06K1/12 ,  G06K7/14 ,  G06K19/06 ,  G06K19/073 ,  G07F7/08 ,  G07F7/12 ,  G11B5/127 ,  G11C11/56 ,  H04N1/00 ,  H04N1/21 ,  H04N1/32 ,  H04N5/225 ,  H04N5/262 ,  H05K3/20

CPC classification number: B41J2/1648 ,  B41J2/14 ,  B41J2/14314 ,  B41J2/14427 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2/16585 ,  B41J2/17513 ,  B41J2/17596 ,  B41J3/445 ,  B41J11/0005 ,  B41J11/70 ,  B41J15/04 ,  B41J2002/041 ,  B41J2002/14346 ,  B41J2002/14435 ,  B41J2002/14443 ,  B41J2202/21 ,  B42D2035/34 ,  G06F21/79 ,  G06F21/86 ,  G06F2221/2129 ,  G06K1/121 ,  G06K7/14 ,  G06K7/1417 ,  G06K19/06037 ,  G07F7/08 ,  G07F7/086 ,  G07F7/12 ,  G11C11/56 ,  H04N5/225 ,  H04N5/2628 ,  H05K1/0212 ,  H05K1/0272 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/2072 ,  H05K2203/308 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/49401

Abstract: A method of fabricating a micro-electromechanical fluid ejection device includes the step of forming a first layer of a sacrificial material on a substrate incorporating a drive circuitry layer. A first electrically conducting layer, a first structural layer and a second electrically conducting layer are formed on the sacrificial material with the first structural layer interposed between the electrically conducting layers. The sacrificial material is formed so that the first electrically conducting layer defines a heating circuit connected to the drive circuitry, and the electrically conducting layers and the first structural layer define a fluid ejecting member connected to an actuator arm that is displaceable on heating and subsequent expansion of the first electrically conducting layer. A second layer of sacrificial material is formed on the second conducting layer layer. A second structural layer is formed on the second layer of sacrificial material. The sacrificial material is formed so that the second structural layer defines a nozzle chamber structure with the fluid ejecting member positioned in the nozzle chamber structure. The sacrificial material is removed so that the nozzle chamber structure defines a nozzle chamber and a fluid ejection port in fluid communication with the nozzle chamber.

Abstract translation: 制造微机电流体喷射装置的方法包括在包含驱动电路层的基板上形成第一牺牲材料层的步骤。 在牺牲材料上形成第一导电层，第一结构层和第二导电层，其中第一结构层置于导电层之间。 牺牲材料形成为使得第一导电层限定连接到驱动电路的加热电路，并且导电层和第一结构层限定连接到致动器臂的流体喷射构件，其可在加热和随后膨胀时移位 的第一导电层。 在第二导电层层上形成第二层牺牲材料。 在第二层牺牲材料上形成第二结构层。 牺牲材料形成为使得第二结构层限定喷嘴室结构，其中流体喷射构件定位在喷嘴室结构中。 去除牺牲材料，使得喷嘴室结构限定喷嘴室和与喷嘴室流体连通的流体喷射口。

公开(公告)号：US06723584B2

公开(公告)日：2004-04-20

申请号：US10255297

申请日：2002-09-26

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC: H01L2148

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.

Abstract translation: 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将 将第一支撑结构拉伸成环结构。 提供与第一支撑结构的第二表面接合的压板。 第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。 第一可固化液体可以至少部分固化。