公开(公告)号：US08300198B2

公开(公告)日：2012-10-30

申请号：US12387982

申请日：2009-05-11

Applicant: De-Ching Shie

Inventor： De-Ching Shie

IPC: G02F1/133

CPC classification number: G02F1/1345 ,  G02F1/13452 ,  G02F2001/13456 ,  H05K1/0259 ,  H05K3/361 ,  H05K2201/09354

Abstract: A liquid crystal panel includes a signal transmission section and a flexible printed circuit (FPC). The signal transmission section includes electrical conductive terminals. The FPC includes an insulating film and conductive lines disposed on a first surface of the insulating film. The conductive lines are electrically connected to the electrical conductive terminals. The insulating film substantially covers the electrical conductive terminals.

Abstract translation: 液晶面板包括信号传输部分和柔性印刷电路（FPC）。 信号传输部分包括导电端子。 FPC包括绝缘膜和布置在绝缘膜的第一表面上的导电线。 导线与导电端子电连接。 绝缘膜基本上覆盖导电端子。

公开(公告)号：US20110297432A1

公开(公告)日：2011-12-08

申请号：US12840748

申请日：2010-07-21

Applicant: ZE-LIANG XIE

Inventor： ZE-LIANG XIE

IPC: H05K1/11

CPC classification number: H05K1/0218 ,  H05K2201/09354 ,  H05K2201/09618

Abstract: A printed circuit board includes signal layers, ground layers, and a power layer, which are superposed. A closed trace is set along edges of each of the signal layers and the power layers. A number of vias are defined in each trace at intervals. Each via extends through the signal layers, the ground layers, and the power layer. Each via is electrically connected to the traces of the signal layers and the power layer, and electrically connected to the ground layers.

Abstract translation: 印刷电路板包括重叠的信号层，接地层和功率层。 沿着每个信号层和功率层的边缘设置闭合迹线。 每个轨迹间隔定义多个通孔。 每个通孔延伸通过信号层，接地层和功率层。 每个通孔电连接到信号层和功率层的迹线，并电连接到接地层。

公开(公告)号：US20110013369A1

公开(公告)日：2011-01-20

申请号：US12607200

申请日：2009-10-28

Applicant: Wen-Cheng Lin

Inventor： Wen-Cheng Lin

IPC: H05K1/00 ,  H02H9/00

CPC classification number: H05K1/0259 ,  H05K1/18 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: An audio circuit board includes a main body, an audio connector, a digital ground loop, an analog ground portion and a moat. The main body includes an edge and a surface. The audio connector is disposed on one side of the main body and includes a fixing portion. The digital ground loop completely surrounds the edge of the main body. The audio connector is connected with the digital ground loop via the fixing portion. The analog ground portion is disposed on the surface of the main body and is disposed adjacent to the digital ground loop. The analog ground portion is separated from the main body via the moat.

Abstract translation: 音频电路板包括主体，音频连接器，数字接地回路，模拟接地部分和护城河。 主体包括边缘和表面。 音频连接器设置在主体的一侧并且包括固定部分。 数字接地回路完全围绕主体的边缘。 音频连接器通过固定部分与数字接地回路连接。 模拟接地部分设置在主体的表面上并与数字接地回路相邻设置。 模拟接地部分经由护城河与主体分离。

公开(公告)号：US07639510B2

公开(公告)日：2009-12-29

申请号：US12013492

申请日：2008-01-14

Applicant: Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

Inventor： Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：US20090296362A1

公开(公告)日：2009-12-03

申请号：US12350117

申请日：2009-01-07

Applicant: Motochika Okano

Inventor： Motochika Okano

IPC: H05K1/11

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K3/0005 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/10022 ,  H05K2201/10446

Abstract: According to one embodiment, a multilayer printed circuit board having a plurality of wiring layers and an electronic component mounted thereon, includes a spiral wire including a path in a substantial spiral shape configured with a printed wire section of a substantial loop shape provided on each of at least two wiring layers of the plurality of wiring layers, and a plug provided on each wiring layer arranged between a top wiring layer which is a wiring layer on a top on which the printed wire section of a substantial loop shape is provided and a bottom wiring layer which is a wiring layer on a bottom on which the printed wire section of a substantial loop shape is provided.

Abstract translation: 根据一个实施例，具有多个布线层和安装在其上的电子部件的多层印刷电路板包括螺旋线，其包括大致螺旋形状的路径，其构造为具有基本上环形的印刷线段， 所述多个布线层中的至少两个布线层以及布置在布置在顶部布线层之间的布线层上的插塞，所述顶部布线层是设置有实质环形的印刷线路部分的顶部上的布线层和底部 布线层，其是设置有实质环状的印刷线路部分的底部上的布线层。

公开(公告)号：US07606034B2

公开(公告)日：2009-10-20

申请号：US11757977

申请日：2007-06-04

Applicant: Andy Paul ,  Dan Solvin ,  Don Lieberman ,  John S. Beekley ,  Martin E. Mueller ,  Robert Pearce

Inventor： Andy Paul ,  Dan Solvin ,  Don Lieberman ,  John S. Beekley ,  Martin E. Mueller ,  Robert Pearce

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/066 ,  H05K2201/09309 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.

Abstract translation: 要求保护热增强型存储器模块。 存储器模块包括第一扩展电平面，以及在其基板的表面和第一延伸电平面之间的热连接。 诸如散热器的第一热管理耦合到衬底的表面平面和热连接。

公开(公告)号：US20090250258A1

公开(公告)日：2009-10-08

申请号：US12486676

申请日：2009-06-17

Applicant: Ryo Warigaya ,  Kenji Hisamatsu ,  Isao Kato

Inventor： Ryo Warigaya ,  Kenji Hisamatsu ,  Isao Kato

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K3/3452 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/0989

Abstract: One embodiment of the invention is a wiring substrate including an insulating base material layer, a metal layer on the insulating base material layer, and a solder resist laminated to the most superficial surface of the wiring substrate above the insulating base material layer, wherein the metal layer has a loop shaped pattern formed along the edge of the insulating base material layer, and the solder resist is formed in such a way that one portion of the pattern is exposed from, and one portion covered with, an extremity of the solder resist on the edge side, along the pattern.

Abstract translation: 本发明的一个实施方案是一种布线基板，其包括绝缘基材层，绝缘基材层上的金属层和层压到绝缘基材层上方的布线基板的最表面的阻焊剂，其中金属 层具有沿着绝缘基材层的边缘形成的环形图案，并且阻焊剂以这样的方式形成，使得图案的一部分从阻焊剂的末端露出，并且一部分被阻焊剂的末端覆盖 边缘沿着图案。

公开(公告)号：US07557302B2

公开(公告)日：2009-07-07

申请号：US11295949

申请日：2005-12-06

Applicant: Yu-Xiang Wang

Inventor： Yu-Xiang Wang

IPC: H01K1/03

CPC classification number: H05K1/026 ,  H05K1/116 ,  H05K3/42 ,  H05K2201/09354 ,  H05K2201/09718

Abstract: A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The printed circuit board includes a signal layer. The signal layer defines a first copper foil and second copper foil thereon. The first copper foils are disposed around the corresponding through holes and connect with the through holes. The second copper foils are disposed around the first copper foils and extend to two adjacent edges of the printed circuit board. The first copper foil and the second copper foil have a number of saw teeth. A gap between the first copper foil and the second foil is in the range from 0.1-0.125 mm.

Abstract translation: 用于防止静电放电损坏的印刷电路板包括其上的几个电子部件。 印刷电路板在其中限定了多个通孔。 印刷电路板包括信号层。 信号层在其上限定第一铜箔和第二铜箔。 第一铜箔围绕相应的通孔设置并与通孔连接。 第二铜箔设置在第一铜箔周围并延伸到印刷电路板的两个相邻边缘。 第一铜箔和第二铜箔具有多个锯齿。 第一铜箔和第二箔之间的间隙在0.1-0.125mm的范围内。

公开(公告)号：US07554643B2

公开(公告)日：2009-06-30

申请号：US11515929

申请日：2006-09-06

Applicant: Kazuyuki Yamada

Inventor： Kazuyuki Yamada

IPC: G02F1/1345

CPC classification number: G02F1/1345 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K3/242 ,  H05K3/361 ,  H05K2201/0397 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2203/175

Abstract: An electro-optical device includes an electro-optical panel, and an interface board through which an image display signal is supplied to the electro-optical panel. The interface board includes a flexible film board, a plurality of terminals that are disposed on the film board, a plurality of wiring lines that are disposed on one surface of the film board and that are electrically connected to the terminals, respectively, and a first conductive member that is formed on the other surface of the film board and that is grounded. The first conductive member overlaps at least one of the wiring lines when the film board is seen in plan view, and the first conductive member is formed along the one wiring line.

Abstract translation: 电光装置包括电光面板和将图像显示信号通过其提供给电光面板的接口板。 接口板包括柔性薄膜板，设置在薄膜基板上的多个端子，分别设置在薄膜基板的一个表面上且与端子电连接的多个布线，第一 导电构件，其形成在薄膜基板的另一个表面上并且接地。 当在平面图中看到薄膜板时，第一导电构件与至少一个布线重叠，并且第一导电构件沿着一条布线形成。

公开(公告)号：US20080204995A1

公开(公告)日：2008-08-28

申请号：US12013492

申请日：2008-01-14

Applicant: Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

Inventor： Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

IPC: H05K7/00 ,  H05K7/20

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。