公开(公告)号：US06220093B1

公开(公告)日：2001-04-24

申请号：US09250745

申请日：1999-02-16

Applicant: Nobuyuki Hirosawa

Inventor： Nobuyuki Hirosawa

IPC: G01P904

CPC classification number: G01C19/5607 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09727

Abstract: An efficiently produced vibratory gyroscope having secure connections is provided. The vibratory gyroscope comprises a vibrator in which driving electrodes, grounding electrodes, and land sections electrically connected to the driving and grounding electrodes are formed. A holding member holds the vibrator, allowing it to vibrate. The vibratory gyroscope also comprises wiring patterns, vibrator-side end sections, a substrate-side end section and a wiring section positioned between the vibrator-side end sections and the substrate-side end section. The vibrator-side end sections are connected to a flexible wiring board comprising land sections electrically connected to the wiring sections and also electrically connected to the land sections of the vibrator and to the substrate-connection end section formed in the circuit-substrate-side end section of the flexible wiring board. A circuit substrate is electrically connected to the wiring patterns.

Abstract translation: 提供了具有安全连接的有效产生的振动陀螺仪。 振动陀螺仪包括振动器，其中形成驱动电极，接地电极和电连接到驱动接地电极的接地部分。 保持构件保持振动器，使其振动。 振动陀螺仪还包括布线图案，振动器侧端部，基板侧端部和位于振动器侧端部与基板侧端部之间的布线部。 振动器侧端部连接到柔性布线板，该柔性布线板包括电连接到布线部分的陆部区域，并且还电连接到振动器的接地部分以及形成在电路基板侧端部中的基板连接端部 柔性线路板部分。 电路基板电连接到布线图案。

公开(公告)号：US06175086B1

公开(公告)日：2001-01-16

申请号：US09180979

申请日：1998-11-18

Applicant: Satoshi Nakamura

Inventor： Satoshi Nakamura

IPC: H01R1204

CPC classification number: H05K3/3405 ,  H05K1/111 ,  H05K3/0097 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/403 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0545 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: The method for installing terminals comprises a coating step for coating solder paste (3) onto a desired circuit board (1), a superimposing step for superimposing the connecting end (4a) of a terminal (4) having a connecting end (4a) and non-connecting end (4b), and a step for heating and melting the solder paste in order that the connecting end (4a) is soldered to the circuit board (1). In the aforementioned coating step, a plurality of mutually separate solder paste coated regions (3a-3d) are provided on the circuit board (1). In the aforementioned superimposing step, the connecting end (4a) is superimposed such that it extends over the aforementioned plurality of solder paste coated regions (3a-3d).

Abstract translation: 安装端子的方法包括将焊膏（3）涂覆到期望的电路板（1）上的涂覆步骤，用于将具有连接端（4a）的端子（4）的连接端（4a）和 非连接端（4b）和用于加热和熔化焊膏的步骤，以使连接端（4a）焊接到电路板（1）。 在上述涂布步骤中，在电路板（1）上设置多个相互分开的焊膏涂覆区域（3a-3d）。 在上述重叠步骤中，连接端（4a）叠合在上述多个焊膏涂覆区域（3a-3d）上。

公开(公告)号：US6111205A

公开(公告)日：2000-08-29

申请号：US959244

申请日：1997-10-28

Applicant: Michael Leddige ,  John Sprietsma

Inventor： Michael Leddige ,  John Sprietsma

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K1/14

CPC classification number: H05K1/116 ,  H05K1/0219 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K3/429

Abstract: A connector for coupling high frequency signals between devices includes a substrate having an array of vias for coupling a reference voltage to reference voltage traces that extend along the substrate surface between the devices. Signal traces including device pads for coupling signals to and from the devices alternate with the reference voltage traces. The widths of the reference voltage traces are varied to maintain a substantially constant separation between the reference voltage trace and an adjacent signal trace.

Abstract translation: 用于在器件之间耦合高频信号的连接器包括具有通孔阵列的衬底，用于将参考电压耦合到沿器件之间的衬底表面延伸的参考电压迹线。 包括用于将信号耦合到器件的器件焊盘的信号迹线与参考电压迹线交替。 改变参考电压迹线的宽度以保持参考电压迹线和相邻信号迹线之间的基本上恒定的间隔。

公开(公告)号：US6091155A

公开(公告)日：2000-07-18

申请号：US606291

申请日：1996-02-23

Applicant: Siamak Jonaidi

Inventor： Siamak Jonaidi

IPC: H01L23/498 ,  H05K1/11 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/114 ,  H01L23/49816 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/09381 ,  H05K2201/10734

Abstract: A ball grid array (BGA) land pattern. In the present invention, a capture pad is disposed on a substrate. The capture pad is electrically coupled to a via which is formed into the substrate. A substantially rectangularly-shaped landing pad is also disposed on the substrate proximate to the capture pad. The substantially rectangularly-shaped landing pad is electrically coupled to the capture pad. In one embodiment, an electrically conductive connecting region electrically connects the substantially rectangularly-shaped landing pad to the capture pad. More specifically, the electrically conductive connecting region has a first end coupled to the capture pad and a second end coupled to the substantially rectangularly-shaped landing pad.

Abstract translation: 球栅阵列（BGA）地形图。 在本发明中，将捕获垫设置在基板上。 捕获垫电连接到形成衬底的通路。 基本上矩形的着陆垫还设置在靠近捕获垫的衬底上。 大致矩形的着陆垫电耦合到捕获垫。 在一个实施例中，导电连接区域将大致矩形的着陆垫电连接到捕获垫。 更具体地，导电连接区域具有联接到捕获垫的第一端和联接到大致矩形的着陆垫的第二端。

公开(公告)号：US6069323A

公开(公告)日：2000-05-30

申请号：US786159

申请日：1997-01-21

Applicant: Darrell J. Slupek ,  Becky J. Clowers

Inventor： Darrell J. Slupek ,  Becky J. Clowers

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/16

CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mount pad and a component to be soldered onto the pad includes a main portion and two extension portions coupled to the main portion. The surface mount pad has an indentation which is defined by the extension portions. The portions extend from the main portion on opposing sides of the indentation. The extension portions are positioned to extend from underneath the component lead. The indentation extends underneath the component lead.

Abstract translation: 要焊接到焊盘上的表面安装焊盘和部件包括主部分和耦合到主要部分的两个延伸部分。 表面安装垫具有由延伸部分限定的凹陷。 这些部分从压痕的相对侧上的主要部分延伸。 延伸部分定位成从部件导线下方延伸。 缩进位于组件引导线的下方。

公开(公告)号：US6060780A

公开(公告)日：2000-05-09

申请号：US804718

申请日：1997-02-21

Applicant: Tameharu Ohta ,  Tomohito Kunda

Inventor： Tameharu Ohta ,  Tomohito Kunda

IPC: G01P1/02 ,  H01L25/16 ,  H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H01L23/12

CPC classification number: G01P1/023 ,  H01L25/165 ,  H05K3/3436 ,  H05K3/3442 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K1/111 ,  H05K2201/09045 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/306 ,  H05K3/303 ,  Y02P70/613

Abstract: A surface mount type semiconductor package is mounted on a printed board by bonding, by means of solder bumps signal electrodes, electrically connected to respective terminals of a semiconductor chip incorporated in the package, with lands provided on the printed board. On a mount surface of the package, there are provided auxiliary electrodes formed as electrodes which are not electrically connected to the respective terminals of the semiconductor chip and have a thickness greater than that of the signal electrodes. As a result, solder thickness is secured for the solder bumps between each signal electrode and corresponding land by the difference in thickness between the auxiliary electrode and the signal electrode.

Abstract translation: 表面安装型半导体封装通过焊接凸起信号电极，通过与设置在封装中的半导体芯片的各个端子电连接到印刷电路板上的焊盘而结合而安装在印刷电路板上。 在封装的安装表面上，提供了形成为不与半导体芯片的各个端子电连接并且具有大于信号电极的厚度的电极的辅助电极。 结果，通过辅助电极和信号电极之间的厚度差，确保每个信号电极和相应焊盘之间的焊料凸块的焊料厚度。

公开(公告)号：US6040529A

公开(公告)日：2000-03-21

申请号：US025598

申请日：1998-02-18

Applicant: Naoki Takeshita ,  Manabu Kusano ,  Fumihiko Sagawa ,  Taizo Nakagawa

Inventor： Naoki Takeshita ,  Manabu Kusano ,  Fumihiko Sagawa ,  Taizo Nakagawa

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K3/363 ,  H05K1/118 ,  H05K2201/09181 ,  H05K2201/09381

Abstract: Disclosed is a flexible substrate whose conductor patterns can be firmly connected to conductor patterns of a printed circuit board.Conductor patterns for connection (4) are formed on one side of a flexible substrate so as to be opposed to conductor patterns (2) provided on a printed circuit board (1), wherein recesses (4b) or/and protrusions (4c) are provided on either side end of each conductor pattern for connection (4).

Abstract translation: 公开了一种柔性基板，其导体图案可以牢固地连接到印刷电路板的导体图案。 用于连接（4）的导体图案形成在柔性基板的一侧上，以与设置在印刷电路板（1）上的导体图案（2）相对，其中凹部（4b）或突起（4c）为 设置在用于连接（4）的每个导体图案的任一侧。

公开(公告)号：US5972231A

公开(公告)日：1999-10-26

申请号：US962065

申请日：1997-10-31

Applicant: Joseph T. DiBene, II

Inventor： Joseph T. DiBene, II

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  B44C1/22

CPC classification number: H05K1/162 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/0298 ,  H05K2201/09381 ,  H05K2201/09672

Abstract: A method and apparatus for coupling high speed data components using imbedded PCB AC coupling capacitors is disclosed. The capacitor comprises a first and a second conductive plate of polygonal shape coupled to surrounding circuitry at the polygonal vertices of the polygonal plates. This configuration results in improved capacitor performance, particularly with respect to capacitive impedance and reflected waves for high bandwidth signals at the frequency ranges of interest.

Abstract translation: 公开了一种使用嵌入式PCB AC耦合电容器耦合高速数据组件的方法和装置。 电容器包括多边形形状的第一和第二导电板，其耦合到多边形板的多边形顶点处的周围电路。 该配置导致改善的电容器性能，特别是关于在感兴趣的频率范围上的高带宽信号的电容阻抗和反射波。

公开(公告)号：US5926731A

公开(公告)日：1999-07-20

申请号：US887064

申请日：1997-07-02

Applicant: Christine Redder Coapman ,  Christine Ann Paszkiet ,  Ralph Edward Cornell

Inventor： Christine Redder Coapman ,  Christine Ann Paszkiet ,  Ralph Edward Cornell

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H05K1/111 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/092 ,  H05K2201/09381 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613

Abstract: A conductor (112) and method for attaching a surface mount device to the conductor (112), in which solder bumps (16) formed by the method are characterized as being accurately located on the conductor (112) and having a bump height and shape that provides stress relief during thermal cycles, minimizes bridging between adjacent bumps (16), allows penetration of cleaning solutions for removing undesirable residues, and enables the penetration of mechanical bonding and encapsulation materials between the chip and its substrate (10). Such benefits are achieved by forming the conductor (112) of a nonsolderable material, on which a solderable pillar (114) is formed. The pillar (114) is selectively formed to have a shape that determines the distribution and height of the solder bump (16) on the conductor (112).

Abstract translation: 导体（112）和用于将表面安装器件连接到导体（112）的方法，其中通过该方法形成的焊料凸点（16）的特征在于精确地位于导体（112）上并具有凸起高度和形状 在热循环期间提供应力消除，使相邻凸块（16）之间的桥接最小化，允许穿透清洁溶液以除去不需要的残留物，并且使得机械粘合和封装材料在芯片和其衬底（10）之间穿透。 通过形成其上形成有可焊接柱（114）的不可焊材料的导体（112）来实现这样的益处。 该柱（114）选择性地形成为具有确定导体（112）上的焊料凸块（16）的分布和高度的形状。

公开(公告)号：US5920462A

公开(公告)日：1999-07-06

申请号：US58128

申请日：1998-04-10

Applicant: Andrew Zachary Glovatsky ,  Jay DeAvis Baker ,  Peter Joseph Sinkunas

Inventor： Andrew Zachary Glovatsky ,  Jay DeAvis Baker ,  Peter Joseph Sinkunas

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H05K7/20 ,  H05K7/02

CPC classification number: H05K7/20509 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K2203/1178 ,  H05K3/3494 ,  H05K3/42 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.

Abstract translation: 这里公开了一种印刷电路板，其上可以通过激光焊接将电子部件散热器焊接在该印刷电路板上，其一个实施例包括：具有顶表面11的电介质基板10，在该顶表面上限定了部件散热器的覆盖区周边P 以及布置在基板顶表面12上的两个或更多个散热器安装焊盘20.每个安装垫20包括布置在基板表面12上的第一部分21，其位于覆盖区周边P的外部，第二部分22布置在基板表面上 12在与第一部分21相邻的足迹周边P内。