公开(公告)号：US20110318609A1

公开(公告)日：2011-12-29

申请号：US13171662

申请日：2011-06-29

Applicant: Yoichi MIURA ,  Tsuyoshi YAMAZAKI

Inventor： Yoichi MIURA ,  Tsuyoshi YAMAZAKI

IPC: G11B5/62 ,  H05K3/00

CPC classification number: H05K3/4644 ,  G11B5/48 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/49 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/05 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09781 ,  Y10T428/1171 ,  Y10T428/1179 ,  Y10T428/1193

Abstract: It is an object of the present invention to provide a substrate for suspension reduced in the generation of cracks in an insulating layer at the boundary region between a region where a metal supporting substrate exists and a region where no metal supporting substrate exist. The present invention solves the above object by providing a substrate for suspension comprising a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate, wherein a position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

Abstract translation: 本发明的一个目的是提供一种用于减少在存在金属支撑衬底的区域和不存在金属支撑衬底的区域之间的边界区域处的绝缘层中产生裂纹的悬浮衬底。 本发明通过提供一种用于悬架的基板来解决上述目的，包括：第一结构部件，包括金属支撑基板，绝缘层，布线层和覆盖层;以及第二结构部件，其形成为从 第一结构部分并且没有金属支撑基板，其中绝缘层的上表面的边缘的位置与覆盖层的下表面的边缘的位置或上表面的边缘的位置重合 在第一结构部分和第二结构部分之间的边界区域处，绝缘层位于比覆盖层的下表面的边缘的位置更靠近布线层的一侧。

公开(公告)号：US20110292125A1

公开(公告)日：2011-12-01

申请号：US13097503

申请日：2011-04-29

Applicant: Hiroshi Abe

Inventor： Hiroshi Abe

IPC: B41J2/135 ,  H01R43/00

CPC classification number: B41J2/14072 ,  B41J2002/14362 ,  B41J2202/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2224/8592 ,  H05K1/142 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/049 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2076

Abstract: Provided is a liquid discharge head including a recording element board provided with an energy generating element; an electrical wiring board to supply the energy generating element with an electrical signal; a supporting member to support the recording element board and the electrical wiring board; a plurality of wires to connect a plurality of terminals provided on the recording element board and a plurality of terminals provided on the electrical wiring board; and a sealing member; wherein the plurality of wires include a plurality of transmitting wires contributory to transmission of the electrical signal and a plurality of non-transmitting wires non-contributory to the transmission formed at a higher position than the transmitting wires from that surface of the supporting member which supports the recording element board, and the sealing member is arranged to cover the plurality of transmitting wires as well as to join the plurality of non-transmitting wires.

Abstract translation: 提供一种液体排出头，其包括设置有能量产生元件的记录元件板; 电接线板，用于向能量产生元件提供电信号; 支撑构件，用于支撑记录元件板和电气布线板; 用于连接设置在记录元件板上的多个端子的多根导线和设置在电气布线板上的多个端子; 和密封构件; 其中所述多根导线包括多个传输电线，所述多个传输线用于传输电信号;以及多个非传输电线，所述多个非传输电线与所述传输线形成在比所述支撑部件的所述表面的所述传输线更高的位置处， 记录元件板和密封构件被布置成覆盖多个发射线以及连接多个非透射线。

公开(公告)号：US20110290539A1

公开(公告)日：2011-12-01

申请号：US12788950

申请日：2010-05-27

Applicant: Andrew F. Willner ,  Lauren Snedecker ,  Brian Wilkie ,  Gifford Plume ,  Prasanth Ambady

Inventor： Andrew F. Willner ,  Lauren Snedecker ,  Brian Wilkie ,  Gifford Plume ,  Prasanth Ambady

IPC: H05K1/03

CPC classification number: H05K3/282 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2203/0568 ,  Y10T29/49002 ,  Y10T29/49401 ,  Y10T137/0318

Abstract: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.

公开(公告)号：US08059369B2

公开(公告)日：2011-11-15

申请号：US12693340

申请日：2010-01-25

Applicant: Takafumi Kikuchi ,  Yasutaka Sasaki

Inventor： Takafumi Kikuchi ,  Yasutaka Sasaki

IPC: G11B5/60

CPC classification number: G11B5/4846 ,  G11B5/486 ,  H05K1/0259 ,  H05K1/056 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: According to one embodiment, a head gimbal assembly of a disk drive includes an arm and a suspension extending from the arm, a head supported by the suspension, and a flexure on the arm and the suspension. One end portion of the flexure is electrically connected to the head, and the other end portion thereof includes a terminal area. The flexure includes a base insulating layer, a conductor pattern formed on the base insulating layer and having a plurality of connection terminals, and a cover insulating layer formed on the base insulating layer so as to cover the conductor pattern. The connection terminals are exposed to the inside of an opening in the base and cover insulating layers with a protective insulating layer and a thin metal plate overlaid on one surface of each of the connection terminals.

Abstract translation: 根据一个实施例，磁盘驱动器的磁头万向架组件包括臂和从臂延伸的悬架，由悬架支撑的磁头以及臂和悬架上的挠曲件。 挠曲件的一端部与头部电连接，另一端部包括端子区域。 该挠曲件包括基底绝缘层，形成在基底绝缘层上并具有多个连接端子的导体图案，以及形成在基底绝缘层上以覆盖导体图案的覆盖绝缘层。 连接端子通过保护绝缘层和覆盖在每个连接端子的一个表面上的薄金属板暴露于基部的开口的内部并覆盖绝缘层。

公开(公告)号：US20110249455A1

公开(公告)日：2011-10-13

申请号：US13080789

申请日：2011-04-06

Applicant: Hyunghwa PARK

Inventor： Hyunghwa PARK

IPC: F21V21/00 ,  H01L33/38

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2072 ,  H01L2924/00

Abstract: A light emitting device module is provided comprising a light emitting device package and a board including first and second dummy pads and an electrode pad arranged between the first and second dummy pads, on which the light emitting device package is disposed, wherein at least one of the first and second dummy pads has a dummy hole, and wherein the electrode pad adjacent to at least one of the first and second dummy pads has an electrode hole.

Abstract translation: 提供了一种发光器件模块，其包括发光器件封装和包括第一和第二虚拟焊盘的电路板和布置在第一和第二虚拟焊盘之间的电极焊盘，其上设置有发光器件封装，其中至少一个 第一和第二虚拟焊盘具有虚拟孔，并且其中与第一和第二虚拟焊盘中的至少一个相邻的电极焊盘具有电极孔。

公开(公告)号：US20110247208A1

公开(公告)日：2011-10-13

申请号：US13167305

申请日：2011-06-23

Applicant: Tomoyuki IKEDA ,  Naoaki Fujii ,  Seiji Izawa

Inventor： Tomoyuki IKEDA ,  Naoaki Fujii ,  Seiji Izawa

IPC: H05K3/40

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

Abstract translation: 一种制造多层印刷布线板的方法，包括形成包括绝缘层和通过绝缘层形成的一个或多个堆叠的通孔结构的多层芯基板，分别形成在绝缘层中的通孔的堆叠通孔结构分别包括在绝缘层中的绝缘层 所述多层芯基板包括至少三个绝缘层，所述多层芯基板中的每个所述绝缘层包括浸渍有树脂的芯材，并且在所述多层芯基板上形成堆积结构，并且包括层间绝缘层和导体电路， 每个层间绝缘层包括没有芯材的树脂材料。

公开(公告)号：US20110233907A1

公开(公告)日：2011-09-29

申请号：US13120294

申请日：2009-07-29

Applicant: Michael Struchholz ,  Tristan Jobert ,  Klaus Offterdinger ,  Thomas Klaus ,  Dirk Dittmann

Inventor： Michael Struchholz ,  Tristan Jobert ,  Klaus Offterdinger ,  Thomas Klaus ,  Dirk Dittmann

IPC: B60R21/16 ,  H05K5/00

CPC classification number: H01L23/495 ,  G01L19/0084 ,  H01L23/49558 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09781 ,  H05K2201/10151 ,  H05K2201/10689 ,  H05K2201/10893 ,  Y02P70/613 ,  H01L2924/00

Abstract: A housing for an electrical circuit, in particular for a sensor, pins projecting from the housing for the electrical contacting of the circuit, additional pins being provided which are not connected electrically to the circuit but instead are used as mechanical arrangement for fastening the housing to a printed circuit board in particular. The present invention further relates to a housing having an electrical circuit, in particular a sensor, pins projecting from the housing for the electrical contacting of the circuit, at least two pins being connected to one another mechanically via a connecting piece.

Abstract translation: 一种用于电路的壳体，特别是用于传感器的，用于电路接触的外壳突出的销，提供了未与电路电连接的另外的引脚，而是用作用于将壳体紧固到 特别是印刷电路板。 本发明还涉及一种具有电路的壳体，特别是传感器，用于电路的电接触从外壳突出的销，至少两个销通过连接件彼此机械连接。

公开(公告)号：US08026450B2

公开(公告)日：2011-09-27

申请号：US11978808

申请日：2007-10-30

Applicant: Joel R. Goergen

Inventor： Joel R. Goergen

IPC: H05K1/00

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A circuit board comprises a center segment distributing power and low-speed signaling, and outer segments for high-speed signaling. The segments use dielectric materials with different dielectric constants, with the outer segments supporting higher-speed signal transmission.

Abstract translation: 电路板包括分配功率和低速信号的中心段，以及用于高速信令的外部段。 这些段使用具有不同介电常数的介电材料，外部段支持更高速度的信号传输。

公开(公告)号：US08014154B2

公开(公告)日：2011-09-06

申请号：US11766523

申请日：2007-06-21

Applicant: Dae-Ho Lee

Inventor： Dae-Ho Lee

IPC: H05K1/00

CPC classification number: H05K1/0271 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K2201/09236 ,  H05K2201/09781 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: In one embodiment, a circuit substrate comprises a substrate; and a warpage preventing pattern disposed on the substrate. The warpage preventing pattern comprises a first pattern at a first corner of the substrate and a second pattern at a second corner of the substrate. The first corner and the second corner are disposed adjacent to each other. An overall orientation of the first pattern is different from an overall orientation of the second pattern with respect to the substrate. The warping of a semiconductor package can be significantly reduced by cutting off stress lines in the corners of the circuit substrate. Various configurations and orientations of the warpage preventing pattern are provided in order to effectively block stress concentration in the corners of the circuit substrate.

Abstract translation: 在一个实施例中，电路基板包括基板; 以及设置在基板上的翘曲防止图案。 防翘曲图案包括在基板的第一角处的第一图案和在基板的第二拐角处的第二图案。 第一角和第二角彼此相邻设置。 第一图案的整体取向与第二图案相对于基板的整体取向不同。 通过切断电路基板的拐角处的应力线，可以显着降低半导体封装的翘曲。 提供防翘曲图案的各种构造和取向，以有效地阻止电路基板的角部的应力集中。

公开(公告)号：US08003893B2

公开(公告)日：2011-08-23

申请号：US12145802

申请日：2008-06-25

Applicant: Hisao Miura ,  Shinji Murata

Inventor： Hisao Miura ,  Shinji Murata

IPC: H05K1/03

CPC classification number: H05K3/4007 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A multilayer ceramic circuit board includes ceramic wiring layers which are stacked together, one or two or more lifting layers which have a planar shape and which are disposed as an inner layer inside the stacked ceramic wiring layers or as a lower layer lower than a bottom ceramic wiring layer, and a protruding portion formed on a surface of a top ceramic wiring layer due to the disposition of the one or two or more lifting layers. The protruding portion smoothly protrudes and has a large area and high flatness. The multilayer ceramic circuit board is formed by disposing lifting layers as an inner layer of a plurality green sheets or as a lower layer lower than a bottom green sheet, and firing under pressure the resulting laminate in a state constrained by an elastic constraining sheet and a rigid constraining sheet.

Abstract translation: 多层陶瓷电路板包括堆叠在一起的陶瓷布线层，一个或两个以上的提升层，其具有平面形状，并且作为内层设置在堆叠的陶瓷布线层内部或作为比底部陶瓷 布线层和由于一个或两个或更多个提升层的布置而形成在顶部陶瓷布线层的表面上的突出部分。 突出部分平滑地突出并且具有大的面积和高的平坦度。 多层陶瓷电路板通过将提升层设置为多个生片的内层或低于底部生片的下层而形成，并且在受到弹性约束片约束的状态下在压力下烧结所得到的层压体， 刚性约束片。