公开(公告)号：US07180752B2

公开(公告)日：2007-02-20

申请号：US10857743

申请日：2004-05-28

Applicant: Bruce John Chamberlin ,  Erica Elizabeth Jasper Gant ,  Roger Scott Krabbenhoft

Inventor： Bruce John Chamberlin ,  Erica Elizabeth Jasper Gant ,  Roger Scott Krabbenhoft

IPC: H01R12/16

CPC classification number: H05K1/0263 ,  H05K1/0271 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2201/10492 ,  H05K2201/10719 ,  H05K2201/2009

Abstract: A method and structures are provided for implementing enhanced reliability for printed circuit board high power dissipation applications. An external return current member provides a return current path outside of the printed circuit board, thereby minimizing power dissipation within the printed circuit board. The external return current member can be implemented with an associated stiffener formed of electrically conductive material. Alternatively, the external return current member can be implemented with a sheet of electrically conductive material with an insulator provided between the sheet and the associated stiffener.

Abstract translation: 提供了一种用于实现印刷电路板高功率耗散应用的增强的可靠性的方法和结构。 外部返回电流构件在印刷电路板外提供返回电流路径，从而最小化印刷电路板内的功率耗散。 外部返回电流元件可以用由导电材料形成的相关联的加强件来实现。 或者，外部返回电流元件可以用一片导电材料来实现，其中绝缘体设置在片材和相关联的加强件之间。

公开(公告)号：US07167373B1

公开(公告)日：2007-01-23

申请号：US10796540

申请日：2004-03-08

Applicant: Phan Hoang ,  Chinh Nguyen ,  Frank Hoang ,  Andy Le

Inventor： Phan Hoang ,  Chinh Nguyen ,  Frank Hoang ,  Andy Le

IPC: H05K7/06

CPC classification number: H05K1/189 ,  H01L23/3128 ,  H01L23/5387 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/1627 ,  H05K3/0058 ,  H05K2201/042 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/2009 ,  Y10T29/49144

Abstract: One embodiment of the invention includes a flexible circuit and a stiffener. The flexible circuit has first, second, and third portions. The first portion is folded on an upper surface of the third portion and has first contact elements attached to a first device. The second portion is folded on the first device and has second contact elements attached to a second device. The stiffener is attached to the upper surface of the third portion and located between the upper surface of the third portion and the first portion.

Abstract translation: 本发明的一个实施例包括柔性电路和加强件。 柔性电路具有第一，第二和第三部分。 第一部分折叠在第三部分的上表面上，并且具有附接到第一装置的第一接触元件。 第二部分折叠在第一装置上，并且具有附接到第二装置的第二接触元件。 加强件附接到第三部分的上表面并且位于第三部分的上表面和第一部分之间。

公开(公告)号：US07161238B2

公开(公告)日：2007-01-09

申请号：US10335092

申请日：2002-12-31

Applicant: George Hsieh ,  David Shia ,  Tom E. Pearson

Inventor： George Hsieh ,  David Shia ,  Tom E. Pearson

IPC: H01L23/12

CPC classification number: H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H05K1/0271 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2224/0401

Abstract: Embodiments of stiffening members in accordance with the present invention provide a mechanical support that is wave soldered to the frontside of the system substrate simultaneously with other wave soldered components. The stiffening member comprises a flat plate with a plurality of mounting pins. The number of mounting pins are predetermined to provide the plate with sufficient support to resist expected loading conditions when wave soldered in plated through holes on a system substrate. The mounting pins are adapted for insertion into plated through holes on the system substrate. The length of the mounting pins are predetermined to account for the height of the SMT component upon which it is attached, the thickness of the system substrate, and the desired amount of mounting pin protrusion from the backside of the system substrate. The stiffening members consume very little system substrate space while retaining a platform for heat dissipation.

Abstract translation: 根据本发明的加强构件的实施例提供了与其它波形焊接部件同时波纹焊接到系统基板的前侧的机械支撑。 加强构件包括具有多个安装销的平板。 安装销的数量是预定的，以便在波形焊接在系统基板上的通孔中时，为板提供足够的支撑以抵抗预期的负载状况。 安装销适于插入系统基板上的电镀通孔中。 安装销的长度是预先确定的，以考虑其附接的SMT部件的高度，系统基板的厚度以及从系统基板的背面的期望的安装销突出量。 加强构件消耗非常小的系统基板空间，同时保留用于散热的平台。

公开(公告)号：US20070003744A1

公开(公告)日：2007-01-04

申请号：US11426399

申请日：2006-06-26

Applicant: Tomoyuki Kubo

Inventor： Tomoyuki Kubo

IPC: B32B3/00

CPC classification number: B41J2/14072 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/245 ,  H05K3/3457 ,  H05K2201/035 ,  H05K2201/09781 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/2009 ,  Y10T428/24917

Abstract: In order to prevent stress caused by bending a flexible wiring board from being applied to the connection section between the flexible wiring board and a driving IC, solder is deposited as a reinforcement member, on both sides of the driving IC connected onto the flexible wiring board.

Abstract translation: 为了防止弯曲柔性布线板施加到柔性布线板和驱动IC之间的连接部分上的应力引起的焊料作为加强部件沉积，连接到柔性布线板上的驱动IC的两侧 。

公开(公告)号：US20070000689A1

公开(公告)日：2007-01-04

申请号：US11427448

申请日：2006-06-29

Applicant: Yasuto ISHIMARU ,  Kei NAKAMURA

Inventor： Yasuto ISHIMARU ,  Kei NAKAMURA

IPC: H05K1/03

CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/118 ,  H05K3/0061 ,  H05K2201/09663 ,  H05K2201/2009 ,  H01L2924/00

Abstract: In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer on which the slits are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.

Abstract translation: 在外部引线部分中，外部引线布线设置在基底绝缘层的一个表面上，并且在其相对表面上设置多个金属基板。 多个金属基板之间具有预定间隔。 外引线配线不设置在与在金属基板之间设置狭缝的基极绝缘层的另一面的区域相对的面上的区域。 金属如不锈钢，铜或铜合金可用于金属基板。 每个金属基底的线性膨胀系数优选等于基底绝缘层的线膨胀系数。

公开(公告)号：US20060291094A1

公开(公告)日：2006-12-28

申请号：US11262497

申请日：2005-10-27

Applicant: Masanori Ueda ,  Haruyuki Matsunaga

Inventor： Masanori Ueda ,  Haruyuki Matsunaga

IPC: G11B17/00

CPC classification number: G11B25/043 ,  G11B33/08 ,  H05K1/0281 ,  H05K3/0058 ,  H05K2201/055 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A head actuator member supports a head slider at the tip end. A first fixing member is integrated with the enclosure at a position spaced from the head actuator member by a predetermined distance. A second fixing member firmly hold the folded section of a flexible printed circuit board against the first fixing member. The flexible printed circuit board is thus reliably prevented from lifting from the first or second fixing member. The first fixing member is firmly secured to the enclosure. The first fixing member is reliably prevented from shifting and shaking. Even if the head actuator member changes its attitude, the flexible printed circuit board can reliably be prevented from vibration. The head slider can thus be positioned right above a target recording track on the magnetic recording disk with a higher accuracy. Reading and writing of magnetic bit data can be realized with a high accuracy.

Abstract translation: 头致动器构件在尖端处支撑头滑块。 第一固定构件在与头致动器构件隔开预定距离的位置处与外壳一体化。 第二固定构件将柔性印刷电路板的折叠部牢固地保持在第一固定构件上。 因此可靠地防止柔性印刷电路板从第一或第二固定构件提升。 第一固定构件牢固地固定在外壳上。 可靠地防止第一固定构件的移动和摇动。 即使头致动器构件改变其姿态，也可以可靠地防止柔性印刷电路板振动。 因此，磁头滑动器可以更精确地定位在磁记录盘上的目标记录轨道的正上方。 可以高精度地实现磁位数据的读写。

公开(公告)号：US20060215377A1

公开(公告)日：2006-09-28

申请号：US11386585

申请日：2006-03-22

Applicant: Tomohiro Nomura ,  Kazunori Abe ,  Shozo Yamamuro

Inventor： Tomohiro Nomura ,  Kazunori Abe ,  Shozo Yamamuro

IPC: H05K7/00

CPC classification number: H05K1/0281 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/243 ,  H05K2201/2009 ,  H01L2224/0401

Abstract: A wiring layer forming wirings containing inner leads and outer leads are formed on a flexible substrate. Then, inner lead reinforcing electrodes to which a semiconductor chip is connected are formed on the inner leads, outer lead reinforcing electrodes are formed on the outer leads, and wiring reinforcing portions are formed between the inner leads and the outer leads on the wiring layers. The flexible substrate is mounted onto an electronic device by folding a portion to which the wiring reinforcing portions are provided between the inner leads and the outer leads.

Abstract translation: 形成有内引线和外引线的配线的布线层形成在柔性基板上。 然后，在内引线上形成有连接有半导体芯片的内引线加强电极，在外引线上形成外引线加强电极，在布线层的内引线和外引线之间形成配线加强部。 柔性基板通过折叠在内引线和外引线之间设置布线加强部分的部分而安装在电子设备上。

公开(公告)号：US20060207088A1

公开(公告)日：2006-09-21

申请号：US11373610

申请日：2006-03-10

Applicant: Takaharu Yamano

Inventor： Takaharu Yamano

IPC: H05K3/36

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/82039 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/007 ,  H05K2201/2009 ,  H05K2203/016 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least one semiconductor chip on the first insulating layer; forming a second insulating layer on the reinforcing member and the semiconductor chip; and forming a wiring on the second insulating layer, the wiring being connected to the semiconductor chip.

Abstract translation: 制造布线板的方法包括：在支撑板上形成第一绝缘层; 在所述第一绝缘层上安装至少一个加强构件; 在所述第一绝缘层上安装至少一个半导体芯片; 在所述加强构件和所述半导体芯片上形成第二绝缘层; 以及在所述第二绝缘层上形成布线，所述布线连接到所述半导体芯片。

公开(公告)号：US20060172588A1

公开(公告)日：2006-08-03

申请号：US11345441

申请日：2006-02-01

Applicant: Shu Peng

Inventor： Shu Peng

IPC: H01R12/24

CPC classification number: H05K1/0281 ,  H01R12/52 ,  H01R12/59 ,  H05K3/0058 ,  H05K2201/0116 ,  H05K2201/056 ,  H05K2201/2009

Abstract: An electronic device including a panel, an interface board, a flexible flat cable, and a pad. The panel includes a first connector. The interface board includes a second connector that does not oppositely face the first connector. The flexible flat cable connects the first connector and the second connector, and includes a bend portion. The pad is disposed in the bend portion.

Abstract translation: 一种电子设备，包括面板，接口板，柔性扁平电缆和垫。 面板包括第一连接器。 接口板包括不与第一连接器相对的第二连接器。 柔性扁平电缆连接第一连接器和第二连接器，并且包括弯曲部分。 衬垫设置在弯曲部分中。

公开(公告)号：US07075794B2

公开(公告)日：2006-07-11

申请号：US10659884

申请日：2003-09-11

Applicant: Thomas P. Gall ,  Kevin D. Moore ,  Timothy J. Trento

Inventor： Thomas P. Gall ,  Kevin D. Moore ,  Timothy J. Trento

IPC: H05K1/00

CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: An electronic control unit having a flexible circuit board assembly is disclosed. The electronic control unit comprises a flexible circuit board with at least one layer having first and second portions separated by a bendable region. The electronic control unit further comprises a substantially rigid substrate having first and second portions separated by a bend region and inside and outside surfaces. The first and second portions of the circuit board are affixed to respective first and second portions of the substrate. The bend region has one of the group of a recess and aperture extending outwardly from the inside surface of the substrate with the one of the group of the recess and aperture sized to accept the bendable region of the circuit board.

Abstract translation: 公开了一种具有柔性电路板组件的电子控制单元。 电子控制单元包括具有至少一个层的柔性电路板，该层具有由可弯曲区域分开的第一和第二部分。 电子控制单元还包括具有由弯曲区域和内表面和外表面分开的第一和第二部分的基本上刚性的基板。 电路板的第一和第二部分固定到基板的相应的第一和第二部分。 弯曲区域具有从基板的内表面向外延伸的一组凹部和孔中的一个，其中一组凹部和孔的尺寸被设计成接纳电路板的可弯曲区域。