公开(公告)号：US11771325B2

公开(公告)日：2023-10-03

申请号：US17301997

申请日：2021-04-21

Applicant: SYNAPTIVE MEDICAL INC.

Inventor： Ze Shan Yao ,  Piotr Kuchnio ,  Michael Frank Gunter Wood ,  Tammy Kee-Wai Lee ,  Yanhui Bai ,  Michael Peter Bulk ,  Christopher Thomas Jamieson

IPC: A61B5/00 ,  A61B34/20 ,  A61B5/026 ,  G01J3/443 ,  A61B90/00 ,  A61B5/06 ,  G01J3/28 ,  G01J3/10 ,  G01J3/02 ,  A61B90/20 ,  A61B90/30 ,  A61B17/34

CPC classification number: A61B5/0075 ,  A61B5/0042 ,  A61B5/0071 ,  A61B5/0077 ,  A61B5/0082 ,  A61B5/0084 ,  A61B5/026 ,  A61B5/061 ,  A61B5/748 ,  A61B5/7425 ,  A61B34/20 ,  A61B90/361 ,  G01J3/0248 ,  G01J3/10 ,  G01J3/2803 ,  G01J3/2823 ,  G01J3/443 ,  A61B5/0261 ,  A61B5/725 ,  A61B17/34 ,  A61B90/20 ,  A61B2034/2055 ,  A61B2090/309 ,  A61B2562/0233 ,  A61B2562/0242 ,  G01J2003/106 ,  G01J2003/2826

Abstract: A multispectral synchronized imaging system is provided. A multispectral light source of the system comprises: blue, green and red LEDs, and one or more non-visible light sources, each being independently addressable and configured to emit, in a sequence: at least visible white light, and non-visible light in one or more given non-visible frequency ranges. The system further comprises a camera and an optical filter arranged to filter light received at the camera, by: transmitting visible light from the LEDs; filter out non-visible light from the non-visible light sources; and otherwise transmit excited light emitted by a tissue sample excited by non-visible light. Images acquired by the camera are output to a display device. A control unit synchronizes acquisition of respective images at the camera for each of blue light, green light, visible white light, and excited light received at the camera, as reflected by the tissue sample.

公开(公告)号：US20230204420A1

公开(公告)日：2023-06-29

申请号：US17870051

申请日：2022-07-21

Applicant: The Penn State Research Foundation

Inventor： Abdalla R. Nassar ,  Alexander J. Dunbar ,  Edward W. Reutzel

IPC: G01J3/36 ,  G01J3/02 ,  G01J3/443 ,  B33Y50/02 ,  B22F10/25 ,  B22F10/28 ,  B22F12/44 ,  B22F12/45 ,  B22F12/90 ,  B22F10/20

CPC classification number: G01J3/36 ,  G01J3/0208 ,  G01J3/443 ,  B33Y50/02 ,  B22F10/25 ,  B22F10/28 ,  B22F12/44 ,  B22F12/45 ,  B22F12/90 ,  B22F10/20 ,  B33Y10/00

Abstract: Embodiments of the systems can be configured to receive electromagnetic emissions of a substrate (e.g., a build material of a part being made via additive manufacturing) by a detector (e.g., a multi-spectral sensor) and generate a ratio of the electromagnetic emissions to perform spectral analysis with a reduced dependence on location and orientation of a surface of the substrate relative to the multi-spectral sensor. The additive manufacturing process can involve use of a laser to generate a laser beam for fusion of the build material into the part. The system can be configured to set the multi-spectral sensor off-axis with respect to the laser (e.g., an optical path of the multi-spectral sensor is at an angle that is different than the angle of incidence of the laser beam). This can allow the multi-spectral sensor to collect spectral data simultaneously as the laser is used to build the part.

公开(公告)号：US20190011370A1

公开(公告)日：2019-01-10

申请号：US16025482

申请日：2018-07-02

Applicant: ARKRAY, Inc.

Inventor： Kojiro Honma ,  Kentaro Kiriyama ,  Hirofumi Yamada

IPC: G01N21/73 ,  G01N1/28

CPC classification number: G01N21/73 ,  G01J3/28 ,  G01J3/443 ,  G01J2003/2866 ,  G01N1/28 ,  G01N21/67 ,  G01N21/69 ,  G01N2001/2893

Abstract: The disclosure provides plasma spectroscopy analysis methods using a preparatory process of adding a control metal species that is different from an analyte metal species to a sample so as to have a known concentration; a concentration process of introducing the sample to a measurement container, and applying an electric current across a pair of electrodes disposed in the measurement container to concentrate the analyte metal species and the control metal species in the sample in a vicinity of at least one of the electrodes; a detection process; a correction process; and a quantification process.

公开(公告)号：US20180259393A1

公开(公告)日：2018-09-13

申请号：US15913199

申请日：2018-03-06

Applicant: Hitachi High-Tech Analytical Science Limited

Inventor： Tuomas PYLKKANEN ,  Esa RAIKKONEN

IPC: G01J3/02 ,  G01N21/71 ,  G01J3/18

CPC classification number: G01J3/0208 ,  G01J3/0256 ,  G01J3/18 ,  G01J3/2803 ,  G01J3/36 ,  G01J3/443 ,  G01N21/718

Abstract: An optical spectrometer arrangement is provided. According to an example, the optical spectrometer arrangement includes a linear array detector for receiving light at a predefined range of wavelengths, a point detector for receiving light at a predefined wavelength that is outside said predefined range of wavelengths, and an arrangement of a collimating optical element, a diffracting optical element, and a focusing optical element that are arranged to provide at least a first optical path that guides incoming light at said predefined range of wavelengths to the linear array detector via the collimating optical element, the diffracting optical element and the focusing optical element, and a second optical path that guides incoming light at said predefined wavelength to the point detector via the collimating optical element, the diffracting optical element and one of the collimating optical element and the focusing optical element.

公开(公告)号：US20180252650A1

公开(公告)日：2018-09-06

申请号：US15448069

申请日：2017-03-02

Applicant: Tokyo Electron Limited

Inventor： Daniel Morvay ,  Taejoon Han ,  Mirko Vukovic

IPC: G01N21/73 ,  H01J37/32 ,  G06T11/00 ,  G01J3/443 ,  H01L21/3065 ,  H01L21/67

CPC classification number: G01N21/73 ,  G01J3/443 ,  G01N21/68 ,  G01N2021/1787 ,  G01N2201/1293 ,  G06T11/003 ,  H01J37/32422 ,  H01J37/32972 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/67069

Abstract: Described herein are technologies to facilitate computed tomographic techniques to help identifying chemical species during plasma processing of a substrate (e.g., semiconductor wafer) using optical emission spectroscopy (OES). More particularly, the technology described herein uses topographic techniques to spatially resolves emissions and absorptions in at least two-dimension space above the substrate during the plasma processing (e.g., etching) of the substrate. With some implementations utilize optical detectors positioned along multiple axes (e.g., two or more) to receive incident incoming optical spectra from the plasma chamber during the plasma processing (e.g., etching) of the substrate. Because of the multi-axes arrangement, the incident incoming optical spectra form an intersecting grid.

公开(公告)号：US20180230608A1

公开(公告)日：2018-08-16

申请号：US15896734

申请日：2018-02-14

Applicant: ARKRAY, Inc.

Inventor： Tokuo Kasai

IPC: C25B9/16 ,  C25B11/02

CPC classification number: C25B9/16 ,  C25B9/06 ,  C25B11/02 ,  C25B11/12 ,  G01J3/443 ,  G01N21/67 ,  G01N21/69

Abstract: An electrolysis device comprising a cell containing a solution, a pair of electrodes installed in the cell, and a voltage application device connected to the pair of electrodes. One electrode of the pair of electrodes is a small electrode, and another electrode of the pair of electroeds is a large electrode. An area of a liquid-contacting portion of the small electrode with the solution is smaller than an area of a liquid-contacting portion of the large electrode with the solution. In a state in which the solution is contained in the cell, only the solution is present between the liquid-contacting portion of the small electrode and a liquid surface of the solution vertically above the liquid-contacting portion of the small electrode.

公开(公告)号：US20180228012A1

公开(公告)日：2018-08-09

申请号：US15749430

申请日：2016-07-20

Applicant: Agilent Technologies, Inc.

Inventor： Michael Ron Hammer

IPC: H05H1/30 ,  H01J49/10 ,  G01J3/443

CPC classification number: H05H1/30 ,  G01J3/443 ,  H01J49/105 ,  H05H1/46 ,  H05H2001/4622

Abstract: A microwave chamber for plasma generation. The microwave chamber comprises a launch structure at a first end of the microwave chamber to accommodate a microwave source for producing microwave energy and a termination section at a second end of the microwave chamber opposite the first end. The termination section is configured to substantially block propagation of the microwave energy from the second end of the chamber. The microwave chamber further comprises an internal wall structure for guiding the microwave energy received within the microwave chamber at the first end toward the second end and defines a cavity. The internal wall structure comprises an impedance matching section intermediate the first end and the second end, and a capacitive loaded section intermediate the impedance matching section and the second end, wherein the capacitive loaded section comprises at least one ridge extending along a longitudinal axis of the chamber. The microwave chamber defines a first opening extending through a first wall of the capacitive loaded section and a second opening extending through a second wall of the capacitive loaded section. The second wall is opposite the first wall. The first opening and second opening are configured to cooperate with one another to receive a plasma torch in the capacitive loaded section along an axis extending through first opening and second opening and substantially perpendicular to the longitudinal axis of the chamber.

公开(公告)号：US20180220520A1

公开(公告)日：2018-08-02

申请号：US15882415

申请日：2018-01-29

Applicant: Sina Alavi ,  Javad Mostaghimi

Inventor： Sina Alavi ,  Javad Mostaghimi

IPC: H05H1/30 ,  H01J49/10 ,  G01N21/73 ,  G01J3/443

CPC classification number: H05H1/30 ,  G01J3/443 ,  G01N21/73 ,  H01J49/00 ,  H01J49/105 ,  H05H1/46

Abstract: A torch for use in inductively coupled plasma is described. In the torch, a torch tube has an angular accelerator where a flow of gas experiences an increase in angular velocity. The torch tube also has a conical end where the increased angular velocity of the gas is encouraged to accelerate into a cavity that can support the plasma. In various examples, the conical end of the torch tube comprising a conical gap that accelerates the axial velocity component of the gas flow.

公开(公告)号：US20180172593A1

公开(公告)日：2018-06-21

申请号：US15900044

申请日：2018-02-20

Applicant: SciAps, Inc.

Inventor： David R. Day

IPC: G01N21/71 ,  G01J3/443

CPC classification number: G01N21/718 ,  G01J3/0218 ,  G01J3/0264 ,  G01J3/0272 ,  G01J3/0291 ,  G01J3/443 ,  G01N2201/0221 ,  G01N2201/0833

Abstract: An analysis (e.g., LIBS) system includes a source of radiation, an optical emission path for the radiation from the source of radiation to a sample, and an optical detection path for photons emitted by the sample. A detector fiber bundle transmits photons to the spectrometer subsystem. At least one fiber of the fiber bundle is connected to an illumination source (e.g., an LED) for directing light via at least a portion of the detection path in a reverse direction to the sample for aligning, sample presence detection, localizing, and/or focusing based on analysis of the resulting illumination spot on the sample.

公开(公告)号：US20180158657A1

公开(公告)日：2018-06-07

申请号：US15832257

申请日：2017-12-05

Applicant: Tokyo Electron Limited

Inventor： Jun Shinagawa

IPC: H01J37/32 ,  G01N21/73

CPC classification number: H01L21/3065 ,  G01J3/443 ,  G01N21/68 ,  G01N21/73 ,  H01J37/32183 ,  H01J37/32935 ,  H01J37/32972 ,  H01J37/32981 ,  H01J37/3299 ,  H01J2237/24507 ,  H01J2237/24585 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/67248 ,  H01L21/67253 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: A method and a system for plasma etching are provided. The method includes measuring a first set of plasma etch processing parameters; determining an etch rate; altering the plasma etch processing chamber hardware configuration if the determined etch rate differs from a standard etch rate by more than a predetermined etch rate difference threshold, thereafter repeating the determining and altering until the determined etch rate differs from the standard etch rate by less than the predetermined etch rate difference threshold. The method further includes measuring a critical dimension of an etched feature and altering the etch processing parameters if the measured critical dimension differs from a standard critical dimension by more than a predetermined critical dimension difference threshold, thereafter repeating the determining and altering until the measured critical dimension differs from the standard critical dimension by less than the predetermined critical dimension difference threshold.