公开(公告)号：US20070040245A1

公开(公告)日：2007-02-22

申请号：US10579342

申请日：2004-11-15

Applicant: Koji Seno ,  Yuichi Haruta

Inventor： Koji Seno ,  Yuichi Haruta

IPC: H01L23/495

CPC classification number: H05K3/0032 ,  H01L2924/0002 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/007 ,  H05K3/4069 ,  H05K2201/0133 ,  H05K2201/10378 ,  H05K2203/0557 ,  H01L2924/00

Abstract: An anisotropically conductive sheet that can surely achieve necessary electrical connection even to an object to be connected, the arrangement pitch of electrodes to be connected of which is extremely small, a production process thereof, and applied products equipped with the anisotropically conductive sheet. The anisotropically conductive sheet according to the present invention has an insulating sheet body formed of an elastic polymeric substance, in which a plurality of through-holes for forming conductive paths, each extending in a thickness-wise direction of the insulating sheet body, have been formed, and conductive path elements integrally provided in the respective through-holes for forming conductive paths of the insulating sheet body. The through-holes for forming conductive paths are formed by using a mask for exposure, in which a plurality of through-holes for beam transmission, the diameter of each of which becomes gradually small from one surface toward the other surface of the mask, have been formed in accordance with a pattern corresponding to a pattern of conductive path elements to be formed, and irradiating the insulating sheet body with a laser beam through the through-holes for beam transmission from the other surface side of the mask for exposure.

Abstract translation: 即使对于被连接物也可以确实地实现必要的电连接，其连接的电极的排列间距极小的各向异性导电片，其制造方法，以及配备有各向异性导电片的涂布物。 根据本发明的各向异性导电片具有由弹性聚合物形成的绝缘片体，其中，多个用于形成导电路径的通孔各自沿着绝缘片体的厚度方向延伸， 形成的导电路径元件，一体地设置在用于形成绝缘片体的导电路径的各个通孔中。 用于形成导电路径的通孔是通过使用用于曝光的掩模形成的，其中多个用于光束透射的通孔，其每个的直径从掩模的一个表面到另一个表面逐渐变小，具有 根据与要形成的导电路径元件的图案对应的图案形成，并且通过激光束从用于曝光的掩模的另一表面侧通过用于光束透射的通孔照射绝缘片体。

公开(公告)号：US20070037315A1

公开(公告)日：2007-02-15

申请号：US11586271

申请日：2006-10-24

Applicant: Mariam Maghribi ,  Peter Krulevitch ,  Julie Hamilton

Inventor： Mariam Maghribi ,  Peter Krulevitch ,  Julie Hamilton

IPC: H01L21/00

CPC classification number: H01L23/145 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0313 ,  H05K2201/0133 ,  H05K2201/0162 ,  H01L2924/00

Abstract: A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal features on the silicone body that provide an electronic device.

Abstract translation: 一种用于在硅树脂上提供金属特征的系统，包括在基体上提供硅树脂层，并在硅树脂层上提供金属层。 电子设备可以由系统生产。 电子设备包括硅树脂体和硅树脂体上提供电子设备的金属特征。

公开(公告)号：US07162796B2

公开(公告)日：2007-01-16

申请号：US10956804

申请日：2004-10-01

Applicant: James M. Wark ,  Salman Akram

Inventor： James M. Wark ,  Salman Akram

IPC: H01R43/00

CPC classification number: H01R12/57 ,  G01R1/0408 ,  G01R1/0466 ,  H01L2924/0002 ,  H01R43/205 ,  H05K1/119 ,  H05K3/325 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49123 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49222 ,  Y10T29/49453 ,  H01L2924/00

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

公开(公告)号：US20070004844A1

公开(公告)日：2007-01-04

申请号：US11170932

申请日：2005-06-30

Applicant: Robert Clough ,  Fuming Li ,  Mary Swierczek ,  Bradley Givot

Inventor： Robert Clough ,  Fuming Li ,  Mary Swierczek ,  Bradley Givot

IPC: C08K3/34

CPC classification number: H05K3/4676 ,  C08L9/02 ,  C08L15/005 ,  C08L33/20 ,  C08L79/04 ,  H05K3/4644 ,  H05K2201/0133 ,  H05K2201/0209 ,  C08L2666/04

Abstract: A composition comprising a mixture of about 9 to about 20 wt % poly(acrylonitrile-co-butadiene) and about 80 to about 91 wt % cyanate ester of the total weight of the poly(acrylonitrile-co-butadiene) and cyanate ester. Also, an article comprising a cured mixture having a continuous phase comprising poly(acrylonitrile-co-butadiene) and a discrete or co-continuous phase comprising cyanate ester.

Abstract translation: 包含聚（丙烯腈 - 共 - 丁二烯）和氰酸酯总重量的约9至约20重量％聚（丙烯腈 - 共 - 丁二烯）和约80至约91重量％氰酸酯的混合物的组合物。 另外，包含具有包含聚（丙烯腈 - 共 - 丁二烯）和包含氰酸酯的离散或共连续相的连续相的固化混合物的制品。

公开(公告)号：US07154211B2

公开(公告)日：2006-12-26

申请号：US11138255

申请日：2005-05-27

Applicant: Chin-Wen Chou

Inventor： Chin-Wen Chou

IPC: H01L41/08

CPC classification number: H05K3/325 ,  H01L41/053 ,  H05K1/145 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10083

Abstract: An electrically connecting structure of piezo-electric plates includes a circuit board and a plurality of piezo-electric plates disposed on and electrically connected to the circuit board. Anodes of power input of the piezo-electric plates of the present invention are individually electrically connected to the circuit board, the cathodes of power input of the plurality of piezo-electric plates are electrically connected together for forming a circuit of power input of electrical connection of the plurality of piezo-electric plate and the circuit board.

Abstract translation: 压电板的电连接结构包括电路板和布置在电路板上并与之电连接的多个压电板。 本发明的压电板的电力输入的阳极分别电连接到电路板，多个压电板的电力输入的阴极电连接在一起，以形成电连接的电力输入电路 的多个压电板和电路板。

公开(公告)号：US07122896B2

公开(公告)日：2006-10-17

申请号：US10914121

申请日：2004-08-10

Applicant: Atsushi Saito ,  Shuichi Tanaka

Inventor： Atsushi Saito ,  Shuichi Tanaka

IPC: H01L23/48 ,  H01L29/40 ,  B23K31/02

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/07811 ,  H01L2924/12044 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00

Abstract: To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

Abstract translation: 为了提供电子部件的低成本安装结构，并且增加突起电极和形成在基板上的端子之间的导电连接的可靠性，在电子部件的安装结构中，凸块电极包括由 内部树脂和覆盖芯的表面的导电膜。 凸起电极直接与端子导电接触，并且以平面方式弹性变形以与基板的表面接触。 密封树脂填充在凸起电极和端子之间的导电接触部分周围，以保持凸起电极和端子。

公开(公告)号：US07100275B2

公开(公告)日：2006-09-05

申请号：US10893938

申请日：2004-07-20

Applicant: Toshiyuki Toyoshima ,  Satoshi Yanaura ,  Yasuo Furuhashi ,  Hirofumi Fujioka

Inventor： Toshiyuki Toyoshima ,  Satoshi Yanaura ,  Yasuo Furuhashi ,  Hirofumi Fujioka

IPC: H05K3/36

CPC classification number: H05K3/4069 ,  H05K3/0023 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.

Abstract translation: 制造多层布线板的方法包括以下步骤：对感光树脂进行曝光和显影处理以形成具有预定尺寸和形状的孔; 在形成有孔的绝缘层上沉积和形成固化树脂，以便掩埋孔，进行热处理以在绝缘层的表面上形成固化树脂的固化薄膜; 从而除去固化树脂以留下固化的薄膜，以通过固化的薄膜获得具有减小的开口尺寸的通孔。

公开(公告)号：US20060187063A1

公开(公告)日：2006-08-24

申请号：US11374802

申请日：2006-03-14

Applicant: Manfred Rietzler ,  Francisco Martinez de Velasco Cortina

Inventor： Manfred Rietzler ,  Francisco Martinez de Velasco Cortina

IPC: G08B13/14 ,  G06K19/06

CPC classification number: C23F1/02 ,  G06K19/0723 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/0776 ,  G06K19/07771 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/16 ,  G06K19/18 ,  G06K2019/0629 ,  H01L2924/0002 ,  H01Q1/22 ,  H01Q9/27 ,  H01Q13/10 ,  H05K1/0393 ,  H05K3/067 ,  H05K3/068 ,  H05K2201/0133 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T29/49016 ,  H01L2924/00

Abstract: A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation of devices thereby are provided. The method involves selectively exposing the metallized surface to a demetallizing (i.e., an oxidizing) chemical solution. The metallized layer can be selectively exposed to the demetallizing solution using a flexographic printing process wherein printing rollers are used to transfer the demetallizing solution to the metallized surface. An identification device including, for example, a holographic, retro-reflective, or other metallized material and a radio-frequency transponder are also provided. The radio-frequency transponder includes an RF chip and an antenna in electrical communication with the chip. The identification device including the holographic image allows both electronic identification through the reading of identification data stored in the chip and optical identification via the holographic image.

Abstract translation: 提供了从金属化基板（例如，金属化聚合物膜）选择性地去除金属并由此形成器件的方法。 该方法包括将金属化表面选择性地暴露于脱金属（即氧化）化学溶液。 金属化层可以使用柔性版印刷方法选择性地暴露于脱金属溶液，其中使用印刷辊将去金属化溶液转移到金属化表面。 还提供了包括例如全息，回射或其它金属化材料和射频转发器的识别装置。 射频转发器包括RF芯片和与芯片电连通的天线。 包括全息图像的识别装置允许通过读取存储在芯片中的识别数据和通过全息图像进行光学识别来进行电子识别。

公开(公告)号：US07094822B2

公开(公告)日：2006-08-22

申请号：US10870629

申请日：2004-06-17

Applicant: E. Mikhail Sagal ,  Kevin A. McCullough ,  James D. Miller

Inventor： E. Mikhail Sagal ,  Kevin A. McCullough ,  James D. Miller

IPC: C08K3/00

CPC classification number: H05K1/0209 ,  B29C45/0013 ,  B29C70/58 ,  B29K2021/00 ,  B29K2995/0013 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0215 ,  Y10T428/12028 ,  Y10T428/12111 ,  Y10T428/12153 ,  Y10T428/2958

Abstract: The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Abstract translation: 本发明涉及导热弹性垫。 垫可以通过注塑成型包含约30至60体积％的弹性体聚合物基质和约25至60体积％的导热填料的导热组合物来制备。 所得到的垫片具有传热性能，并且可以用作热界面以保护发热电子器件。

公开(公告)号：US20060180341A1

公开(公告)日：2006-08-17

申请号：US11397802

申请日：2006-04-05

Applicant: Takashi Kariya ,  Toshiki Furutani

Inventor： Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/03

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/111 ,  H05K1/115 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/09881 ,  H05K2201/10674 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A multilayer printed wiring board 10 includes: a core substrate 20; a build-up layer 30 formed on the core substrate 20 and having a conductor pattern 32 on an upper surface; a low elastic modulus layer 40 formed on the build-up layer 30; lands 52 that are disposed on an upper surface of the low elastic modulus layer 40 and connected via solder bumps 66 to a semiconductor chip 70; and conductor posts 50 that are passing through the low elastic modulus layer 40 and electrically connecting lands 52 with conductor patterns 32. The conductor posts 50 are formed to have the diameters of an upper portion and a lower portion of 80 μm, the diameter of an intermediate portion of 35 μm, the height of 200 μm, and the aspect ratio Rasp (height/minimum diameter) of 5.7 and the maximum diameter/minimum diameter of 2.3.

Abstract translation: 多层印刷线路板10包括：芯基板20; 形成在芯基板20上并且在上表面上具有导体图案32的堆积层30; 形成在积层30上的低弹性模量层40; 焊盘52设置在低弹性模量层40的上表面上并通过焊锡凸块66连接到半导体芯片70; 以及导体柱50，其穿过低弹性模量层40和电连接焊盘52与导体图案32。 导体柱50形成为具有80μm的上部和下部的直径，35μm的中间部分的直径，200μm的高度以及纵横比Rasp（高度/最小直径） 5.7，最大直径/最小直径为2.3。