公开(公告)号：US3399268A

公开(公告)日：1968-08-27

申请号：US55591866

申请日：1966-06-07

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE JR FREDERICK W ,  MCCORMACK JOHN F ,  ZEBLISKY RUDOLPH J ,  WILLIAMSON JOHN D ,  JOSEPH POLICHETTE

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  H01B1/00 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K3/422 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/405 ,  H01B1/00 ,  H05K1/0373 ,  H05K2201/0236

公开(公告)号：US11653453B2

公开(公告)日：2023-05-16

申请号：US17076342

申请日：2020-10-21

Applicant: CATLAM, LLC

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K3/02 ,  H05K3/00 ,  H05K3/06 ,  C08K3/34 ,  C08K3/36 ,  H05K3/42 ,  H05K3/18 ,  H05K3/10

CPC classification number: H05K3/022 ,  C08K3/34 ,  C08K3/346 ,  C08K3/36 ,  H05K3/0047 ,  H05K3/061 ,  H05K3/185 ,  H05K3/422 ,  H05K3/426 ,  C08K2201/005 ,  H05K3/002 ,  H05K3/0017 ,  H05K3/0026 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/107

Abstract: A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

公开(公告)号：US10059852B2

公开(公告)日：2018-08-28

申请号：US14242763

申请日：2014-04-01

Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Bifeng Mao ,  Weifeng Miao

IPC: C23C18/40 ,  H05K3/18 ,  C09D11/322 ,  C23C18/18 ,  C23C18/16 ,  C23C18/20 ,  C01G37/00 ,  C01G39/00 ,  C01G49/00 ,  C01G15/00 ,  C09D11/10 ,  B01J37/34 ,  B01J37/04 ,  B01J37/08 ,  B01J23/00 ,  B01J23/825 ,  B01J23/86 ,  B01J23/887 ,  B01J35/02 ,  B01J37/00 ,  B01J31/06

CPC classification number: C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

公开(公告)号：US09967981B2

公开(公告)日：2018-05-08

申请号：US15000432

申请日：2016-01-19

Applicant: Koito Manufacturing Co., Ltd.

Inventor： Yoshiaki Aiso ,  Koji Uchino ,  Hiromi Nakamura ,  Takayuki Otsubo

IPC: H01L33/62 ,  H05K3/10 ,  B60Q1/26 ,  H05K3/18 ,  F21S8/10 ,  B60Q1/34 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/105 ,  B60Q1/2696 ,  B60Q1/34 ,  F21S43/13 ,  F21S43/14 ,  F21S43/195 ,  F21S43/31 ,  F21S45/47 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin molded article, and a light emitting element mounted on the base unit and electrically connected to the first circuit pattern. The base unit includes a mounting surface portion directed in a prescribed direction such that the light emitting element is mounted thereon, and a sidewall surface portion connected to the mounting surface portion in a plane intersection state, and the sidewall surface portion is formed as an inclined surface intersecting with the mounting surface portion at an obtuse angle.

公开(公告)号：US09967974B2

公开(公告)日：2018-05-08

申请号：US14777670

申请日：2014-04-17

Applicant: LG CHEM, LTD.

Inventor： Chee-Sung Park ,  Cheol-Hee Park ,  Shin Hee Jun ,  Sang Yun Jung ,  Han Nah Jeong

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  C08J7/12 ,  H05K1/03 ,  H05K3/02 ,  H05K3/18 ,  H01B1/22

CPC classification number: H05K1/036 ,  C08J7/123 ,  C08J2300/22 ,  C08J2300/24 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0373 ,  H05K3/027 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08K3/22 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

公开(公告)号：US20170283588A1

公开(公告)日：2017-10-05

申请号：US15508179

申请日：2015-07-20

Applicant: DSM IP ASSETS B.V.

Inventor： Richard Jacques Theodoor FRISSEN ,  Siva Esakimuthu SUBRAMONIAN

IPC: C08K7/14 ,  H05K1/03 ,  F21S8/10 ,  C08K5/00 ,  B60Q1/18 ,  H01L33/62 ,  C08K3/00

CPC classification number: C08K7/14 ,  B60Q1/0483 ,  B60Q1/18 ,  C08K3/013 ,  C08K5/0008 ,  F21S41/141 ,  F21S43/14 ,  F21Y2115/10 ,  H01L33/62 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0145 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Light emitting diode (LED) based daylight running light (DRL) comprising a carrier, comprising a polymer composition comprising polyethylene terephthalate and glass fibers, the surface of the carrier comprises conductor tracks for mounting one or more LED's.

公开(公告)号：US20170256479A1

公开(公告)日：2017-09-07

申请号：US15600793

申请日：2017-05-22

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/495 ,  H01L23/60

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/053 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

公开(公告)号：US20170175270A1

公开(公告)日：2017-06-22

申请号：US15447522

申请日：2017-03-02

Applicant: BYD COMPANY LIMITED

Inventor： WEI ZHOU ,  BIFENG MAO

IPC: C23C18/16 ,  C23C18/40 ,  C23C18/18 ,  B01J37/08 ,  B01J35/00 ,  B01J35/02 ,  B01J37/00 ,  C23C18/20 ,  B01J23/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.

公开(公告)号：US09676927B2

公开(公告)日：2017-06-13

申请号：US14665260

申请日：2015-03-23

Applicant: The Shepherd Color Company ,  LPKF Laser & Electronics AG

Inventor： Michael D. Musick ,  David Ziemnik ,  James P. White ,  Robin Alexander Krüger ,  Bernd Rösener ,  Malte Sebastian Fengler

IPC: C08K9/10 ,  C08L69/00 ,  C08L55/02 ,  C09C3/06 ,  H05K3/18

CPC classification number: C08K9/10 ,  C01P2002/70 ,  C01P2004/04 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/84 ,  C08L55/02 ,  C08L69/00 ,  C09C3/063 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/107

Abstract: This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof). Applications may include, but are not limited to, coatings or plastic articles or materials for molded interconnect devices, durable goods, housings, assemblies, devices, and articles that are to be exposed to additional thermal processing. The resulting core-shell materials function in plastic and coatings formulations by minimizing or eliminating detrimental interactions with the resins and metal containing additives resulting in loss of mechanical properties.

公开(公告)号：US09668342B2

公开(公告)日：2017-05-30

申请号：US14895143

申请日：2014-09-22

Applicant: LG CHEM, LTD.

Inventor： Shin Hee Jun ,  Chee-Sung Park ,  Jae Hyun Kim ,  Sang Yun Jung ,  Cheol-Hee Park

IPC: H05K1/09 ,  H05K3/10 ,  H01B1/22 ,  H05K3/00 ,  H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  H05K1/03 ,  C23C18/40

CPC classification number: H05K1/092 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08K3/22 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern reducing deterioration of mechanical-physical properties and having excellent adhesion strength onto a variety of polymeric resin products or resin layers, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming a conductive pattern includes a polymer resin; and non-conductive metal compound particles including a first metal element and a second metal element, having a R3m or P63/mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm, wherein a metal nuclei including the first metal or the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation.