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    Connecting structure and connecting method for flexible flat cable
    141.
    发明授权
    Connecting structure and connecting method for flexible flat cable 有权
    柔性扁平电缆的连接结构和连接方法

    公开(公告)号：US08801457B2

    公开(公告)日：2014-08-12

    申请号：US13381113

    申请日：2010-06-18

    Applicant: Shoichi Nomura ,  Goro Nakamura

    Inventor： Shoichi Nomura ,  Goro Nakamura

    IPC: H01R12/00

    CPC classification number: H01R12/613 ,  H01R13/5208 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2203/0264 ,  Y10T29/49194

    Abstract: A flexible flat cable connecting structure for connecting a flexible flat cable in which a plurality of rectangular conductors are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member one end of which is coupled to the connector terminals and in which a plurality of branch conductors are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member is laid on the flexible flat cable so that the intermediate cable arranging member and the flexible flat cable are in the same plane and form an angle. The other ends of the branch conductors of the intermediate cable arranging member are connected to the respective rectangular conductors.

    Abstract translation: 一种柔性扁平电缆连接结构，用于连接其中平行设置多个矩形导体的柔性扁平电缆和以矩形导线不同的阵列间距排列的多个连接器端子，包括中间电缆排列构件 其连接到连接器端子，并且其中多个分支导体平行设置，根据阵列间距设置成具有相互不同的纵向尺寸。 中间电缆排列构件放置在柔性扁平电缆上，使得中间电缆排列构件和柔性扁平电缆处于同一平面并形成一个角度。 中间电缆排列构件的分支导体的另一端连接到相应的矩形导体。

    Touch pad with flexible substrate
    142.
    发明授权
    Touch pad with flexible substrate 有权
    触摸板带柔性基板

    公开(公告)号：US08797292B2

    公开(公告)日：2014-08-05

    申请号：US13675312

    申请日：2012-11-13

    Applicant: Synaptics Incorporated

    Inventor： Joseph Kurth Reynolds ,  Shawn P. Day

    IPC: G06F3/045

    CPC classification number: G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04107 ,  H03K17/962 ,  H03K2217/960765 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

    Abstract: A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

    Abstract translation: 提供一种触摸传感器装置，其使用柔性电路基板来提供改进的输入装置。 具体地说，本发明使用固定在柔性电路基板上的触摸传感器控制器，其耦合到传感器部件，以提供适用于各种应用的柔性，可靠和成本有效的触摸传感器。 在一个实施例中，触摸传感器使用提供相对高耐温性的柔性电路基板。 这允许使用可靠的技术来粘贴触摸传感器控制器，例如各种类型的焊接。 传感器组件可以包括相对低温的衬底，其可以提供成本有效的解决方案。 综合起来，触摸传感器的这个实施例以相对低的成本提供可靠性和灵活性。

    Wiring substrate unit and printer including the same
    143.
    发明授权
    Wiring substrate unit and printer including the same 有权
    接线基板单元和包括它的打印机

    公开(公告)号：US08690278B2

    公开(公告)日：2014-04-08

    申请号：US13048472

    申请日：2011-03-15

    Applicant: Toru Yamashita

    Inventor： Toru Yamashita

    IPC: B41J29/38 ,  B41J2/145

    CPC classification number: B41J2/14233 ,  B41J2002/14491 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/041

    Abstract: A wiring substrate unit is provided. The unit includes: first and second wiring substrates, first and second input portions respectively formed in marginal portions of the first and second wiring substrates, and first and second output contact points respectively formed on one surfaces of the first and second wiring substrates. A through hole is formed in the first wiring substrate to correspond to the second output contact point; a cutout is formed either at a position adjacent to the first input portion of the marginal portion of the first wiring substrate or at a position adjacent to the second input portion of the marginal portion of the second wiring substrate; and one of the first and second input portions is exposed from the cutout.

    Abstract translation: 提供了布线基板单元。 该单元包括：第一和第二布线基板，分别形成在第一和第二布线基板的边缘部分中的第一和第二输入部分以及分别形成在第一和第二布线基板的一个表面上的第一和第二输出接触点。 在第一布线基板上形成与第二输出接触点对应的通孔; 在与第一布线基板的边缘部分的第一输入部分相邻的位置或与第二布线基板的边缘部分的第二输入部分相邻的位置处形成切口， 并且第一和第二输入部分中的一个从切口露出。

    Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement
    147.
    发明申请
    Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement 审中-公开
    将部件安装到电路板，电路板和电路板布置的方法

    公开(公告)号：US20130044448A1

    公开(公告)日：2013-02-21

    申请号：US13556559

    申请日：2012-07-24

    Applicant: Anthony A. Primavera

    Inventor： Anthony A. Primavera

    IPC: H05K1/16 ,  H05K3/36 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K1/183 ,  H05K1/116 ,  H05K1/144 ,  H05K1/145 ,  H05K3/0044 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/09572 ,  H05K2201/09645 ,  H05K2201/10303 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2203/0228 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

    Abstract: A method for mounting a component to an electric circuit board (10), comprising: providing at least one cavity in the electric circuit board; arranging the component in the at least one cavity; and generating in the at least one cavity mechanical and/or electrical connections simultaneously to at least two locations of the component.A method for making an electric circuit board arrangement comprising at least one electric circuit board, comprising: providing at least one cavity and/or through-hole in the at least one electric circuit board; arranging the component in the at least one cavity and/or in a through-hole, the component being mechanically and/or electrically connectable by contact in the at least one cavity and/or through-hole; and stacking one or more electric circuit boards on top of the at least one electric circuit board and coupling the electric circuit boards by solderable terminal pads of the component.

    Abstract translation: 一种将部件安装到电路板（10）的方法，包括：在电路板中提供至少一个空腔; 将所述组件布置在所述至少一个空腔中; 以及在所述至少一个空腔中将所述部件的至少两个位置同时产生机械和/或电连接。 一种用于制造包括至少一个电路板的电路板布置的方法，包括：在所述至少一个电路板中提供至少一个空腔和/或通孔; 将所述部件布置在所述至少一个空腔中和/或在通孔中，所述部件通过所述至少一个空腔和/或通孔中的接触机械地和/或电连接; 并且在所述至少一个电路板的顶部堆叠一个或多个电路板，并且通过所述部件的可焊接的端子焊盘来耦合所述电路板。

    MEMORY SYSTEM, MEMORY MODULE, AND MODULE SOCKET
    148.
    发明申请
    MEMORY SYSTEM, MEMORY MODULE, AND MODULE SOCKET 审中-公开
    存储器系统，存储器模块和模块插座

    公开(公告)号：US20110317356A1

    公开(公告)日：2011-12-29

    申请号：US13165305

    申请日：2011-06-21

    Applicant: Takao ONO ,  Atsushi MORISHIMA

    Inventor： Takao ONO ,  Atsushi MORISHIMA

    IPC: G06F1/16 ,  H05K1/00

    CPC classification number: H05K1/141 ,  G06F1/185 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/044 ,  H05K2201/10159 ,  H05K2201/10318

    Abstract: The present invention is adapted to a memory system that includes: a motherboard and a module board, wherein: the motherboard comprises a module socket mounted on the motherboard; and a plurality of pins two-dimensionally arranged on the module socket, and vertically erected with respect to the motherboard: and the module board comprises a plurality of device chips installed on the module board; and a contact portion mounted on the module board, and including a plurality of through holes two-dimensionally arranged thereon, the contact portion being electrically connected to the device chips: wherein each of the pins is inserted into each of the through holes to connect electrically to the contact portion.

    Abstract translation: 本发明适用于包括：主板和模块板的存储器系统，其中：所述母板包括安装在所述母板上的模块插座; 以及二维地布置在模块插座上并相对于母板垂直竖立的多个销，并且模块板包括安装在模块板上的多个装置芯片; 以及安装在所述模块基板上的接触部分，并且包括二维地布置在其上的多个通孔，所述接触部分电连接到所述器件芯片：其中每个所述引脚插入到每个所述通孔中以电连接 到接触部分。

    Touch pad with flexible substrate
    149.
    发明授权
    Touch pad with flexible substrate 有权
    触摸板带柔性基板

    公开(公告)号：US08085250B2

    公开(公告)日：2011-12-27

    申请号：US12209762

    申请日：2008-09-12

    Applicant: Joseph Kurth Reynolds ,  Shawn P. Day

    Inventor： Joseph Kurth Reynolds ,  Shawn P. Day

    IPC: G06F3/041

    CPC classification number: G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04107 ,  H03K17/962 ,  H03K2217/960765 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

    Abstract: A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

    Abstract translation: 提供一种触摸传感器装置，其使用柔性电路基板来提供改进的输入装置。 具体地说，本发明使用固定在柔性电路基板上的触摸传感器控制器，其耦合到传感器部件，以提供适用于各种应用的柔性，可靠和成本有效的触摸传感器。 在一个实施例中，触摸传感器使用提供相对高耐温性的柔性电路基板。 这允许使用可靠的技术来粘贴触摸传感器控制器，例如各种类型的焊接。 传感器组件可以包括相对低温的衬底，其可以提供成本有效的解决方案。 综合起来，触摸传感器的这个实施例以相对低的成本提供可靠性和灵活性。

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