公开(公告)号：US20110284271A1

公开(公告)日：2011-11-24

申请号：US12782267

申请日：2010-05-18

Applicant: Sun-Ki KIM

Inventor： Sun-Ki KIM

IPC: H05K1/00 ,  H01L23/36

CPC classification number: H01L23/427 ,  H01L23/36 ,  H01L23/3677 ,  H01L33/642 ,  H01L33/648 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K2201/066 ,  H01L2924/00

Abstract: A heat sink capable of being surface-mounted, the heat sink having a 3D shape and comprising a body made of metal, having a rear side which is horizontal and a front side which is at least partially horizontal, such that the front side is partially surface-mounted on a conductive pattern of a printed circuit board (PCB) by pick-and-place and the rear side is attached to the conductive pattern by reflow-soldering.

Abstract translation: 一种能够被表面安装的散热器，散热器具有3D形状并且包括由金属制成的主体，其具有水平的后侧和至少部分水平的前侧，使得前侧部分地 通过拾取放置在表面安装在印刷电路板（PCB）的导电图案上，并且后侧通过回流焊接附接到导电图案。

公开(公告)号：US08039952B2

公开(公告)日：2011-10-18

申请号：US12472340

申请日：2009-05-26

Applicant: Donald R. Mullen ,  Ming Li

Inventor： Donald R. Mullen ,  Ming Li

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2224/32225 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2203/1572

Abstract: The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

Abstract translation: 该系统包括电路板，半导体模块，散热器和至少一个热通孔。 电路板具有基本平坦的相对的第一和第二侧面。 半导体模块包括多个半导体器件。 半导体模块在第一侧附近基本上平行于电路板取向，而散热器设置在第二侧附近。 热通孔延伸穿过电路板，以将半导体模块热耦合到散热器，散热器可以是散热器，散热器，冷却风扇或热管。

公开(公告)号：US20110247861A1

公开(公告)日：2011-10-13

申请号：US12775499

申请日：2010-05-07

Applicant: CHING-BAI HWANG ,  HUNG-NIEN CHIU ,  SHU-CHENG YANG

Inventor： CHING-BAI HWANG ,  HUNG-NIEN CHIU ,  SHU-CHENG YANG

IPC: H05K1/00

CPC classification number: H05K1/0203 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/10598 ,  H01L2924/00

Abstract: An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm.

Abstract translation: 示例性电子设备包括限定其中的孔的电路板，布置在电路板上并被孔包围的电子部件，布置在电子部件上的散热器以及将散热器固定到电子部件的闭锁机构。 闭锁机构包括从散热器和弹性杆向外延伸的闩锁臂。 每个锁定臂限定与电路板的一个孔对准的锁定孔。 杆分别依次延伸穿过孔和锁孔。 每个杆包括接合在相应的闩锁孔中的主体和弹性地抵靠闩锁臂的头部。

公开(公告)号：US20110149519A1

公开(公告)日：2011-06-23

申请号：US12642315

申请日：2009-12-18

Applicant: Dobabani CHOUDHURY ,  Prasad ALLURI

Inventor： Dobabani CHOUDHURY ,  Prasad ALLURI

IPC: H05K1/18 ,  H05K7/20 ,  H05K3/30

CPC classification number: H05K1/024 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0236 ,  H05K1/185 ,  H05K2201/066 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/10416 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer having a first conformable material; a second layer having a second conformable material; one or more electronic components embedded within the stack of layers; and a vertical filtering structure arranged periodically between the one or more electronic components, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract translation: 根据本公开的各个方面，公开了一种装置，其包括包括系统级封装体系结构的小尺寸移动平台，所述系统级封装体系结构布置为层叠层，所述层包括第一层，所述第一层具有第一层 适应材料; 具有第二适形材料的第二层; 嵌入层叠层内的一个或多个电子部件; 以及在所述一个或多个电子部件之间周期性地布置的垂直滤波结构，其中所述第一适形材料，所述第二适形材料或两者被配置为允许高频信号路由。

公开(公告)号：US20110062579A1

公开(公告)日：2011-03-17

申请号：US12951372

申请日：2010-11-22

Applicant: UMESH MISHRA ,  Primit Parikh ,  Yifeng Wu

Inventor： UMESH MISHRA ,  Primit Parikh ,  Yifeng Wu

IPC: H01L23/538 ,  H01L23/34 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L21/8252 ,  H01L23/147 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/66 ,  H01L27/0605 ,  H01L29/2003 ,  H01L29/7787 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/73253 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/181 ,  H05K2201/066 ,  Y10T29/4913 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.

Abstract translation: 电路基板在第一表面上具有一个或多个有源部件和多个无源电路元件。 有源半导体器件具有材料层和多个端子的衬底。 有源半导体器件被倒装芯片安装在电路基板上，并且器件的至少一个端子与电路基板上的有源元件电连接。 基板上的有源元件和安装有倒装芯片的有源半导体器件与无源电路元件组合形成前置放大器和输出放大器。 在电源开关配置中，电路基板在第一表面上具有逻辑控制电路。 安装在电路基板上的半导体晶体管倒装芯片电连接到第一表面上的控制电路，从而控制倒装芯片安装器件的接通和断开。

公开(公告)号：US20090316366A1

公开(公告)日：2009-12-24

申请号：US12472340

申请日：2009-05-26

Applicant: Donald R. Mullen ,  Ming Li

Inventor： Donald R. Mullen ,  Ming Li

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2224/32225 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2203/1572

Abstract: The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

Abstract translation: 该系统包括电路板，半导体模块，散热器和至少一个热通孔。 电路板具有基本平坦的相对的第一和第二侧面。 半导体模块包括多个半导体器件。 半导体模块在第一侧附近基本上平行于电路板取向，而散热器设置在第二侧附近。 热通孔延伸穿过电路板，以将半导体模块热耦合到散热器，散热器可以是散热器，散热器，冷却风扇或热管。

公开(公告)号：US07616445B2

公开(公告)日：2009-11-10

申请号：US11858748

申请日：2007-09-20

Applicant: Yao-Nan Lin ,  Hsin-Yu Cheng

Inventor： Yao-Nan Lin ,  Hsin-Yu Cheng

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/14 ,  H05K7/205 ,  H05K2201/066

Abstract: One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.

Abstract translation: 本发明的一个实施例提出了一种电子组件，其包括具有至少一个开口的印刷电路板，安装在印刷电路板的第一侧上的电子部件，以及包括至少一个散热器的散热结构， 第一表面和第二表面。 第一表面包括与电子部件的表面耦合的第一区域和设置有至少散热构件的一个或多个第二区域，该散热构件通过印刷电路板的第二侧上的开口露出。

公开(公告)号：US20080150125A1

公开(公告)日：2008-06-26

申请号：US11613523

申请日：2006-12-20

Applicant: Henning Braunisch ,  Chuan Hu ,  Gloria Alejandra Camacho Bragado

Inventor： Henning Braunisch ,  Chuan Hu ,  Gloria Alejandra Camacho Bragado

IPC: H01L23/36 ,  H01L21/58

CPC classification number: H05K1/0204 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/10303 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An apparatus including a first die mounted on a primary side of an electronic package and a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board. The apparatus further comprising a thermal component thermally connected to the second die and mounted on the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board. A method including positioning a set of thermal connectors through a printed circuit board, the thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side. The method further including thermally connecting the thermal connectors to a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.

Abstract translation: 一种装置，包括安装在电子封装的初级侧上的第一裸片和安装在电子封装与印刷电路板之间的电子封装的次级侧上的第二裸片。 所述装置还包括热连接到所述第二管芯并安装在所述印刷电路板上的热部件，所述热部件包括从散热器延伸穿过所述印刷电路板中的一组通孔的一组销。 一种方法，包括通过印刷电路板定位一组热连接器，所述热连接器从印刷电路板的初级侧延伸到与初级侧相对的印刷电路板的次级侧。 该方法还包括将热连接器热连接到位于电子封装和印刷电路板的初级侧之间的管芯，以将热量从管芯传递到印刷电路板的次级侧。

公开(公告)号：US20080073116A1

公开(公告)日：2008-03-27

申请号：US11984176

申请日：2007-11-14

Applicant: Yuji Sakai

Inventor： Yuji Sakai

IPC: H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC classification number: G06F1/185 ,  G06F1/20 ,  H01L23/3735 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/14 ,  H05K7/205 ,  H05K2201/044 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A semiconductor device includes a module board mounting thereon an electric component and including a plug at an edge of the module board, and a mount board including thereon a socket adapted to said plug on a surface portion of the mount board for mounting thereon the module board via said plug, wherein the mount board includes therein a heat radiation layer in contact with a bottom surface of the socket, wherein the socket comprises a heat radiation guide plate in contact with a side surface of the socket.

Abstract translation: 半导体器件包括：模块板，其安装在电气部件上，并且在模块板的边缘处包括插头;以及安装板，其上安装有用于在所述安装板的表面部分上安装所述模块板的所述插头的插座 通过所述插头，其中所述安装板包括与所述插座的底表面接触的散热层，其中所述插座包括与所述插座的侧表面接触的散热导板。

公开(公告)号：US20080068804A1

公开(公告)日：2008-03-20

申请号：US11978860

申请日：2007-10-29

Applicant: Ping Liu ,  Min Li

Inventor： Ping Liu ,  Min Li

IPC: H05K7/20

CPC classification number: H05K1/0209 ,  G06F1/203 ,  H05K2201/066 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/10446

Abstract: A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.