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    Laminating type molded coil
    141.
    发明授权
    Laminating type molded coil 失效
    层压型模制线圈

    公开(公告)号：US5652561A

    公开(公告)日：1997-07-29

    申请号：US261738

    申请日：1994-06-17

    Applicant: Kiyoharu Inoh ,  Hisanaga Takano ,  Eiji Sumiya ,  Akihiro Demura

    Inventor： Kiyoharu Inoh ,  Hisanaga Takano ,  Eiji Sumiya ,  Akihiro Demura

    IPC: H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H05K1/16 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01F5/00

    CPC classification number: H01F17/04 ,  H01F17/0006 ,  H01F41/041 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/09536 ,  H05K2201/10386 ,  H05K3/0052 ,  H05K3/281 ,  H05K3/3405 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4623

    Abstract: A laminating type molded coil and a method of fabricating the same comprising at least one coil substrate structure in which coils are formed on both sides of an insulating substrate by use of a printed wire technique, resin sheets disposed on both side of the coil substrate structure, and insulating covering sheets disposed on the outermost surfaces of the resin sheets, wherein when heated and subjected to pressure the spaces between the layers and between the coils are filled with resin from the resin sheets, and then hardened to produce an integral structure. Advantageously, because the coil pattern has a predetermined shape and is formed by printed wire techniques, the thickness of the coils may be thin and the gaps between the coils may be narrow. By using the invention method, the fabrication does not require use of a molding box as does the conventional method and the fabrication is done with simple steps.

    Abstract translation: 叠层型模制线圈及其制造方法包括至少一个线圈基板结构，其中通过印刷线技术在绝缘基板的两侧形成线圈，设置在线圈基板结构两侧的树脂片 以及设置在树脂片的最外表面上的绝缘覆盖片，其中当加热并承受压力时，层间空间和线圈之间的树脂被树脂填充，然后硬化以产生一体结构。 有利地，由于线圈图案具有预定形状并且通过印刷线技术形成，所以线圈的厚度可以较薄，并且线圈之间的间隙可能较窄。 通过使用本发明的方法，与传统方法一样，制造不需要使用模制盒，并且通过简单的步骤进行制造。

    Chip component providing rf suppression
    145.
    发明授权
    Chip component providing rf suppression 失效
    芯片组件提供rf抑制

    公开(公告)号：US4796079A

    公开(公告)日：1989-01-03

    申请号：US183301

    申请日：1988-04-11

    Applicant: James Hettiger

    Inventor： James Hettiger

    IPC: H01P1/22 ,  H05K1/02 ,  H05K9/00 ,  H01L23/54 ,  H01L23/12 ,  H01L23/14

    CPC classification number: H05K9/0039 ,  H01P1/227 ,  H05K1/0233 ,  H01L2924/0002 ,  H05K2201/086 ,  H05K2201/10363 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A ferrite shield component for suppressing high frequency signals in electrical circuits, such as tuners for television receivers, is formed by surrounding an electrical conductor with ferrite material. The shield component is formed in the shape of a leadless chip to permit placement on a circuit board by chip insertion machines. The conductor pattern and ferrite material may be selected to determine particular impedance-frequency characteristics.

    Abstract translation: 通过用铁氧体材料围绕电导体来形成用于抑制诸如电视接收机调谐器的电路中的高频信号的铁氧体屏蔽部件。 屏蔽部件形成为无引线芯片的形状，以允许通过芯片插入机器放置在电路板上。 可以选择导体图案和铁氧体材料以确定特定的阻抗 - 频率特性。

    EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    148.
    发明公开
    EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240314932A1

    公开(公告)日：2024-09-19

    申请号：US18136358

    申请日：2023-04-19

    Applicant: UNIMICRON TECHNOLOGY CORP.

    Inventor： Chen-An TSAI

    IPC: H05K1/16 ,  H01F17/00 ,  H01F41/04 ,  H05K1/11 ,  H05K3/46

    CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F41/041 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/086 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/1003

    Abstract: The present invention includes an aluminum board, an electromagnet core, and a coil. The aluminum board includes a first surface, a second surface opposite to the first surface, and multiple through vias in communication with the first surface and the second surface. The electromagnet core is mounted on the first surface, and the through vias are located on two opposite sides of the electromagnet core. The coil is mounted through the through vias to wrap around the electromagnet core. An inside wall of each of the through vias forms an anodic aluminum oxide (AAO) by an anodizing process. The present invention is able to decrease via size of a conductive through via of a vertically embedded inductor. This allows through vias to be more densely formed on a board, and thus increases an amount of the coil wrapped around the electromagnetic core and increases inductance of the inductor.

    High efficiency and high density GaN-based power converter
    149.
    发明授权
    High efficiency and high density GaN-based power converter 有权

    公开(公告)号：US11916488B2

    公开(公告)日：2024-02-27

    申请号：US17376102

    申请日：2021-07-14

    Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.

    Inventor： Yanbo Zou ,  Fada Du ,  Chao Tang ,  Wenjie Lin

    IPC: H02M3/335 ,  H02M1/00 ,  H01F27/28

    CPC classification number: H02M3/33576 ,  H01F27/2804 ,  H02M1/0064 ,  H01F2027/2809 ,  H01F2027/2819 ,  H05K2201/086

    Abstract: The present invention provides a high efficiency, high density GaN-based power converter comprising: a transformer; a magnetic coupler; a primary switch; a secondary switch; a primary controller; a secondary controller; a multi-layered print circuit board (PCB) comprising: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the transformer, the coupler, a primary switch, a secondary switch, a primary controller and a secondary controller. The power converter further comprises a pair of ferrite cores being fixed to a top surface and a bottom surface of the PCB respectively and commonly shared by the transformer and the coupler.

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