公开(公告)号：US20100252304A1

公开(公告)日：2010-10-07

申请号：US12752692

申请日：2010-04-01

Applicant: Shigetsugu Muramatsu ,  Yasuhiko Kusama

Inventor： Shigetsugu Muramatsu ,  Yasuhiko Kusama

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15151 ,  H05K1/111 ,  H05K3/0044 ,  H05K3/243 ,  H05K3/305 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/025 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.

Abstract translation: 制造电子部件安装用布线基板的方法包括：在安装有电子部件的表面侧形成最外层布线层; 形成绝缘层以覆盖所述布线层; 以及在所述绝缘层中形成凹部。 通过使用通过图案化形成所需形状的掩模，以阶梯状形状除去绝缘层的露出部分，直到露出布线层的一部分的焊盘的表面来形成凹部。 凹部优选通过用喷砂除去绝缘层的一部分而形成。

公开(公告)号：US20100244243A1

公开(公告)日：2010-09-30

申请号：US12703936

申请日：2010-02-11

Applicant: Fumihiko Eya

Inventor： Fumihiko Eya

IPC: H01L23/49 ,  H01L23/34

CPC classification number: H01L23/49833 ,  G02F1/13452 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3677 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K1/0209 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/09045 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor device has a flexible substrate which can be folded U-shape, and an outer surface of the flexible substrate being provided concave-convex portions for heat radiation. The semiconductor device also has a semiconductor chip which is mounted on an inner surface of the flexible substrate, and the chip being electronically connected with the flexible substrate.

Abstract translation: 半导体器件具有能够折叠成U形的柔性基板，柔性基板的外表面设置有用于散热的凹凸部。 半导体器件还具有安装在柔性基板的内表面上的半导体芯片，并且芯片与柔性基板电连接。

公开(公告)号：US20100214727A1

公开(公告)日：2010-08-26

申请号：US12678511

申请日：2008-09-09

Applicant: Dieter Eissler

Inventor： Dieter Eissler

IPC: H05K7/00

CPC classification number: H01L25/167 ,  H01L24/73 ,  H01L25/0756 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/12041 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/10106 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  H01L2924/00

Abstract: An arrangement includes an optoelectronic component with two contacts; at least one further component part; at least one contact arranged between the optoelectronic component and the further component part; and at least one web arranged between the optoelectronic component and the further component part.

Abstract translation: 一种布置包括具有两个触点的光电子部件; 至少一个另外的部件; 布置在所述光电子部件和所述另外的部件之间的至少一个接触件; 以及布置在所述光电子部件和所述另外的部件之间的至少一个网。

公开(公告)号：US07743492B2

公开(公告)日：2010-06-29

申请号：US12028206

申请日：2008-02-08

Applicant: Roger Stanley Kerr ,  Timothy John Tredwell ,  Yongtaek Hong

Inventor： Roger Stanley Kerr ,  Timothy John Tredwell ,  Yongtaek Hong

IPC: H05K3/30

CPC classification number: H05K3/0014 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/007 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/016 ,  H05K2203/0759 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49158

Abstract: A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.

Abstract translation: 一种形成电子器件的方法提供一种具有铸造表面的铸造母模，并将基底材料沉积到铸造表面上以形成预定厚度的柔性基片，其中柔性基片具有电路侧表面， 铸造表面。 柔性基板从主机释放并固定在载体上，电路侧表面朝外。 然后在电路侧表面上形成电子器件。

公开(公告)号：US20100147574A1

公开(公告)日：2010-06-17

申请号：US12632112

申请日：2009-12-07

Applicant: Kentaro KANEKO ,  Hidemi Atobe

Inventor： Kentaro KANEKO ,  Hidemi Atobe

IPC: H01R12/06 ,  H01K3/10

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09436 ,  H05K2201/09527 ,  Y10T29/49162

Abstract: A wiring board (package) has a structure in which multiple wiring layers are stacked one on top of another with insulating layers each interposed between corresponding two of the wiring layers, and the wiring layers are connected to each other through vias formed in the insulating layers. In the peripheral region around the chip mounting area of the outermost insulating layer on one of both surfaces of the board, a pad is formed in a bump shape to cover a surface of a portion of the outermost insulating layer, the portion being formed to protrude, and a pad whose surface is exposed from the insulating layer is arranged in the chip mounting area. A chip is flip-chip bonded to the pad of the package, and another package is bonded to the bump shaped pad in a peripheral region around the chip (package-on-package bonding).

Abstract translation: 布线板（封装）具有多个布线层一层叠置的结构，绝缘层分别插入在相应的两个布线层之间，并且布线层通过形成在绝缘层中的通孔彼此连接 。 在板的两个表面之一的最外层绝缘层的芯片安装区域周围的周边区域中，形成凸起形状的焊盘以覆盖最外层绝缘层的一部分的表面，该部分形成为突出 并且其表面从绝缘层露出的焊盘被布置在芯片安装区域中。 将芯片倒装芯片贴合到封装的焊盘上，另一个封装在芯片周围的周边区域（封装在封装的封装上）结合到凸块形焊盘。

公开(公告)号：US20100075446A1

公开(公告)日：2010-03-25

申请号：US12237390

申请日：2008-09-25

Applicant: Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

Inventor： Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/20753 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2203/049 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.

公开(公告)号：US20100006327A1

公开(公告)日：2010-01-14

申请号：US12260096

申请日：2008-10-29

Applicant: Cheng-Po Yu ,  Han-Pei Huang

Inventor： Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K1/11 ,  H05K1/00 ,  B29C35/08 ,  C04B35/00

CPC classification number: H05K1/11 ,  H05K1/0284 ,  H05K1/142 ,  H05K3/185 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1327 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A circuit board structure including a circuit board main body and an injection molded three-dimensional circuit device encapsulating at least a portion of the circuit board main body is provided. The three-dimensional circuit device includes a molded plastic body having a non-plate type, stereo structure, on which a three-dimensional pattern is also fabricated. The three-dimensional pattern is interconnected with a contact pad on the circuit board main body through a conductive via.

Abstract translation: 提供一种包括电路板主体和封装有电路板主体的至少一部分的注射成型的三维电路装置的电路板结构。 三维电路装置包括具有非板型立体结构的模制塑料体，其上还制造三维图案。 三维图案通过导电通孔与电路板主体上的接触焊盘互连。

公开(公告)号：US20090314526A1

公开(公告)日：2009-12-24

申请号：US12162770

申请日：2007-01-29

Applicant: Tadashi Nagasawa ,  Masaharu Shirai ,  Kenji Kume ,  Yutaka Tsukada

Inventor： Tadashi Nagasawa ,  Masaharu Shirai ,  Kenji Kume ,  Yutaka Tsukada

IPC: H05K1/03 ,  H05K1/16 ,  H05K1/11 ,  B32B3/02

CPC classification number: H05K3/381 ,  B32B3/30 ,  B32B7/12 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/38 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  C09J7/22 ,  H05K1/0373 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/09045 ,  H05K2201/09563 ,  H05K2201/2072 ,  H05K2203/095 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).

Abstract translation: 本发明涉及一种与其他材料具有高粘合性的树脂膜，粘合片，电路板和电子设备，其中粘合剂层和树脂膜牢固地粘合。 树脂膜（1）包括在顶部（10a）中具有填充物（9）的多个突起部（10）和树脂材料。 突出部分（10）形成在片材部分（16）的至少一个表面上。

公开(公告)号：US20090156020A1

公开(公告)日：2009-06-18

申请号：US12315305

申请日：2008-12-02

Applicant: Naoya Kitajima ,  Seiya Takahashi ,  Katsumi Arai

Inventor： Naoya Kitajima ,  Seiya Takahashi ,  Katsumi Arai

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/716 ,  H01R13/2414 ,  H05K3/0058 ,  H05K3/027 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09172 ,  H05K2201/09663 ,  H05K2203/0369

Abstract: The present invention provides a connector configured to electrically connect two connection objects. The connector comprises an elastic member having a surface and a conductive film placed on the surface of the elastic member. The conductive film comprises two contact portions to be brought into contact with the connection objects, respectively, and a connect portion connecting the contact portions. Each of the contact portions comprises projections and a drainage arranged, at least in part, between the projections.

Abstract translation: 本发明提供一种被配置为电连接两个连接对象的连接器。 连接器包括具有放置在弹性构件的表面上的表面和导电膜的弹性构件。 导电膜包括分别与连接对象接触的两个接触部分和连接接触部分的连接部分。 每个接触部分包括至少部分地在突起之间布置的突起和排水。

公开(公告)号：US20090123702A1

公开(公告)日：2009-05-14

申请号：US11990950

申请日：2006-09-08

Applicant: Norio Yoshizawa ,  Hiroaki Watanabe

Inventor： Norio Yoshizawa ,  Hiroaki Watanabe

IPC: B05D5/12 ,  B32B3/10

CPC classification number: H05K3/184 ,  H05K1/0256 ,  H05K2201/0761 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0565 ,  Y10T428/24479

Abstract: The range of selection of the material for a primary substrate and the material for a resin mask in a secondary substrate can be broadened, and short circuiting of a circuit can be reliably prevented. The shape of a primary substrate (1) is such that a circuit forming face (11) is in a convex form and a circuit non-forming face (12) is in a concave form, the difference in level between the circuit forming face (11) and the circuit non-forming face (12) is 0.05 mm, and the angle of side walls (13, 14) connecting the circuit forming face to the circuit non-forming face is 90°. In order to apply a catalyst, a palladium catalyst solution was immersed in a bath having a water depth of 500 mm at a liquid temperature of 40° C. for 5 min. Thereafter, a resin mask (3) is dissolved and removed, followed by electroless plating. As a result, the catalyst solution penetrates up to a part in which the creeping distance could have been increased, that is, up to both side walls (13, 14). That is, the catalyst penetration can be prevented, and short circuiting between conductive layers (50), that is, between circuits, can be prevented.

Abstract translation: 可以扩大第一基板的材料的选择范围和二次基板中的树脂掩模用材料的范围，能够可靠地防止电路的短路。 主基板（1）的形状使得电路形成面（11）呈凸形，并且电路非成形面（12）为凹形，电路形成面（ 11），并且电路非成形面（12）为0.05mm，并且将电路形成面与电路非成形面连接的侧壁（13,14）的角度为90°。 为了施加催化剂，将钯催化剂溶液在40℃的液温下浸渍在水深500mm的浴中5分钟。 此后，将树脂掩模（3）溶解除去，然后进行无电镀。 结果，催化剂溶液渗透到爬行距离可能增加的部分，即直到两个侧壁（13,14）。 也就是说，可以防止催化剂渗透，并且可以防止导电层（50）之间，即在电路之间的短路。