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公开(公告)号：US10010019B2
公开(公告)日：2018-06-26
申请号：US14622954
申请日：2015-02-16
Applicant: Risto Tuominen
Inventor： Risto Tuominen
CPC classification number: H05K9/0081 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/92144 , H01L2924/01002 , H01L2924/01003 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0218 , H05K1/185 , H05K2201/0723 , H05K2201/09318 , H05K2201/10674 , H01L2924/00
Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.
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公开(公告)号：US20180049312A1
公开(公告)日：2018-02-15
申请号：US15792953
申请日：2017-10-25
Applicant: Amphenol Corporation
Inventor： Mark W. Gailus , Marc B. Cartier, JR. , Vysakh Sivarajan , David Levine
CPC classification number: H05K1/0222 , H01R43/205 , H05K1/0216 , H05K1/0219 , H05K1/025 , H05K1/0251 , H05K1/0253 , H05K1/0298 , H05K1/115 , H05K3/0047 , H05K3/4038 , H05K3/429 , H05K2201/07 , H05K2201/09063 , H05K2201/09318 , H05K2201/09545 , H05K2201/096 , H05K2201/097 , H05K2201/09718 , H05K2201/09845 , H05K2201/09854 , H05K2201/10189
Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
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公开(公告)号：US09807869B2
公开(公告)日：2017-10-31
申请号：US14947166
申请日：2015-11-20
Applicant: Amphenol Corporation
Inventor： Mark W. Gailus , Marc B. Cartier, Jr. , Vysakh Sivarajan , David Levine
CPC classification number: H05K1/0222 , H01R43/205 , H05K1/0216 , H05K1/0219 , H05K1/025 , H05K1/0251 , H05K1/0253 , H05K1/0298 , H05K1/115 , H05K3/0047 , H05K3/4038 , H05K3/429 , H05K2201/07 , H05K2201/09063 , H05K2201/09318 , H05K2201/09545 , H05K2201/096 , H05K2201/097 , H05K2201/09718 , H05K2201/09845 , H05K2201/09854 , H05K2201/10189
Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
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公开(公告)号：US09801268B2
公开(公告)日：2017-10-24
申请号：US14413431
申请日：2013-06-07
Applicant: Endress + Hauser GmbH + Co. KG
Inventor： Thomas Blodt
CPC classification number: H05K1/024 , H01P1/2016 , H01P3/023 , H05K1/0227 , H05K1/0231 , H05K1/0234 , H05K1/0243 , H05K2201/0187 , H05K2201/09318
Abstract: A circuit board comprising a circuit board ply, on which are provided a high-frequency component emitting electromagnetic interference waves during operation and at least one other component, especially another high-frequency component, wherein during operation an as low as possible degrading of the other component by interference waves is achieved. There is provided between the high-frequency component and the other component at least one dielectric barrier, which blocks propagation of high-frequency electromagnetic waves between the high-frequency component and the other component.
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公开(公告)号：US09565749B2
公开(公告)日：2017-02-07
申请号：US13453814
申请日：2012-04-23
Applicant: Robert Tilman Worl
Inventor： Robert Tilman Worl
CPC classification number: H05K1/024 , H01P1/00 , H05K1/0275 , H05K1/0306 , H05K3/10 , H05K2201/0187 , H05K2201/09318 , H05K2201/09727 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49155
Abstract: An obfuscated radio frequency circuit may be manufactured to include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having different dielectric constants to obfuscate functions of the circuit.
Abstract translation: 可以制造模糊的射频电路以包括金属化层和在金属化层下面的介电层。 电介质层可以由具有不同介电常数的多个电介质基底构成，以模糊电路的功能。
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Patent Agency Ranking
公开(公告)号：US09491854B2
公开(公告)日：2016-11-08
申请号：US13865730
申请日：2013-04-18
Applicant: RAYTHEON COMPANY
Inventor： Clifton Quan , Hee Kyung Kim , Fangchou Yang , Kevin C. Rolston , Edward Marsh Jackson
CPC classification number: H05K1/028 , H05K1/024 , H05K1/144 , H05K1/147 , H05K3/361 , H05K3/4069 , H05K3/4614 , H05K3/4635 , H05K2201/055 , H05K2201/058 , H05K2201/09109 , H05K2201/09318 , H05K2201/10378 , H05K2203/063 , Y10T29/49126 , Y10T29/49155
Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.
Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。
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公开(公告)号：US20160150645A1
公开(公告)日：2016-05-26
申请号：US14947166
申请日：2015-11-20
Applicant: Amphenol Corporation
Inventor： Mark W. Gailus , Marc B. Cartier, JR. , Vysakh Sivarajan , David Levine
IPC: H05K1/11
CPC classification number: H05K1/0222 , H01R43/205 , H05K1/0216 , H05K1/0219 , H05K1/025 , H05K1/0251 , H05K1/0253 , H05K1/0298 , H05K1/115 , H05K3/0047 , H05K3/4038 , H05K3/429 , H05K2201/07 , H05K2201/09063 , H05K2201/09318 , H05K2201/09545 , H05K2201/096 , H05K2201/097 , H05K2201/09718 , H05K2201/09845 , H05K2201/09854 , H05K2201/10189
Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
Abstract translation: 印刷电路板包括多个层，包括附着层和布线层; 以及通过多层形成的通路图案，每个通孔图案包括形成差分信号对的第一和第二信号通孔，第一和第二信号通孔至少延伸穿过附着层; 至少延伸穿过附着层的接地通孔，包括接地导体的接地通孔; 以及位于与第一和第二信号通孔中的每一个相邻的阴影通孔，其中阴影通孔在附着层中不含导电材料。 印刷电路板还可以包括延伸通过附着层并且位于通孔图案之间的槽孔。
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公开(公告)号：US20150163966A1
公开(公告)日：2015-06-11
申请号：US14622954
申请日：2015-02-16
Applicant: Risto Tuominen
Inventor： Risto Tuominen
IPC: H05K9/00
CPC classification number: H05K9/0081 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/92144 , H01L2924/01002 , H01L2924/01003 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0218 , H05K1/185 , H05K2201/0723 , H05K2201/09318 , H05K2201/10674 , H01L2924/00
Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.
Abstract translation: 公开了一种具有EMI保护的电子模块。 电子模块包括在第一布线层中具有接触端子和导线的部件。 在部件和第一布线层之间还存在电介质，使得部件嵌入在电介质中。 接触元件在至少一些接触端子和至少一些导电线之间提供电连接。 电子模块还包括电介质内部的第二布线层。 第二布线层包括至少部分地位于部件和第一布线层之间的导电图案，并且在部件和导线之间提供EMI保护。
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公开(公告)号：US08964409B2
公开(公告)日：2015-02-24
申请号：US12700812
申请日：2010-02-05
Applicant: Risto Tuominen
Inventor： Risto Tuominen
CPC classification number: H05K9/0081 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/20 , H01L2224/2518 , H01L2224/32225 , H01L2224/32245 , H01L2224/92144 , H01L2924/01002 , H01L2924/01003 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01061 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0218 , H05K1/185 , H05K2201/0723 , H05K2201/09318 , H05K2201/10674 , H01L2924/00
Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is also a dielectric (5) between the component (1) and the first wiring layer (3) such that the component (1) is embedded in the dielectric (5). Contact elements (6) provide electrical connection between at least some of the contact terminals (2) and at least some of the conducting lines (4). The electronic module also comprises a second wiring layer (7) inside the dielectric (5). The second wiring layer (7) comprises a conducting pattern (8) that is at least partly located between the component (1) and the first wiring layer (3) and provides EMI protection between the component (1) and the conducting lines (4).
Abstract translation: 公开了一种具有EMI保护的电子模块。 电子模块包括在第一布线层（3）中具有接触端子（2）和导线（4）的部件（1）。 在组件（1）和第一布线层（3）之间还存在电介质（5），使得组件（1）嵌入电介质（5）中。 接触元件（6）在至少一些接触端子（2）和至少一些导电线（4）之间提供电连接。 电子模块还包括在电介质（5）内部的第二布线层（7）。 第二布线层（7）包括至少部分地位于部件（1）和第一布线层（3）之间的导电图案（8），并且在部件（1）和导线（4）之间提供EMI保护 ）。
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公开(公告)号：US20130319732A1
公开(公告)日：2013-12-05
申请号：US13865730
申请日：2013-04-18
Applicant: RAYTHEON COMPANY
Inventor： Clifton Quan , Hee Kyung Kim , Fangchou Yang , Kevin C. Rolston , Edward Marsh Jackson
IPC: H05K1/02
CPC classification number: H05K1/028 , H05K1/024 , H05K1/144 , H05K1/147 , H05K3/361 , H05K3/4069 , H05K3/4614 , H05K3/4635 , H05K2201/055 , H05K2201/058 , H05K2201/09109 , H05K2201/09318 , H05K2201/10378 , H05K2203/063 , Y10T29/49126 , Y10T29/49155
Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.
Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。
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