公开(公告)号：US09521749B2

公开(公告)日：2016-12-13

申请号：US14453146

申请日：2014-08-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Koichi Odagaki ,  Shuichi Kato

IPC: H01L23/48 ,  H05K1/11 ,  H01L23/49

CPC classification number: H05K1/111 ,  H01L2924/15313 ,  H05K2201/09381 ,  H05K2201/099 ,  Y02P70/611

Abstract: A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a solder void even when a mounting terminal has a large soldering area. An electronic component having the mounting terminal is mounted on the circuit substrate. A mounting land is connected to the mounting terminal of the electronic component by soldering, and the mounting land has a protruding portion of an insulating material formed so as to protrude from an outer side of the mounting land toward an inner side of the mounting land, and the protruding portion does not divide the mounting land into a plurality of areas.

Abstract translation: 电路基板能够降低整个安装台面中的焊料的量不均匀的可能性，并且即使在安装端子具有大的焊接区域的情况下也减少形成焊料空隙。 具有安装端子的电子部件安装在电路基板上。 安装平台通过焊接连接到电子部件的安装端子，并且安装台面具有形成为从安装台面的外侧向安装台面的内侧突出的绝缘材料的突出部， 并且突出部分不将安装平台分成多个区域。

公开(公告)号：US09504152B2

公开(公告)日：2016-11-22

申请号：US14748970

申请日：2015-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hai Liu

IPC: H05K1/11 ,  H01L23/498 ,  H05K3/46 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15323 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/244 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A printed circuit board for a semiconductor package including a printed circuit board body, a plurality of ball lands on one surface of the printed circuit board body, a first plating layer on a portion of each of the ball lands, and a second plating layer on another portion of each of the ball lands may be provided. An upper surface of the first plating layer may be coplanar with an upper surface of the second plating layer.

Abstract translation: 一种用于半导体封装的印刷电路板，包括印刷电路板主体，印刷电路板主体的一个表面上的多个球形区域，每个球场的一部分上的第一镀层和第二镀层 可以设置每个球场的另一部分。 第一镀层的上表面可以与第二镀层的上表面共面。

公开(公告)号：US09485873B2

公开(公告)日：2016-11-01

申请号：US14210233

申请日：2014-03-13

Applicant: Lawrence Livermore National Security, LLC

Inventor： Kedar G. Shah ,  Satinderpall S. Pannu ,  Vanessa Tolosa ,  Angela C. Tooker ,  Heeral J. Sheth ,  Sarah H. Felix ,  Terri L. Delima

IPC: H05K3/40 ,  A61N1/05 ,  H05K3/00

CPC classification number: H05K1/11 ,  A61N1/05 ,  A61N1/0553 ,  H05K1/09 ,  H05K1/097 ,  H05K3/007 ,  H05K3/12 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/099 ,  Y10T29/49147

Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Abstract translation: 使用热压结合在微电子器件上提供较厚的电极。 薄膜导电层形成电导管，并且本体沉积在薄膜导电层上提供电极层。 绝缘聚合物层封装电薄膜导电层和电极层。 除去绝缘层中的一些以露出电极层。

公开(公告)号：US20160014892A1

公开(公告)日：2016-01-14

申请号：US14861272

申请日：2015-09-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sumiyo Nakamura ,  Takahiro Sumi ,  Takahiro Oka

IPC: H05K1/03 ,  H05K3/12 ,  H05K1/11 ,  H05K3/46 ,  C04B35/20 ,  H05K1/02

CPC classification number: H05K1/0306 ,  C04B35/195 ,  C04B35/20 ,  C04B35/62218 ,  C04B35/62625 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/80 ,  H01L21/4867 ,  H01L23/12 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/099 ,  H05K2201/09909 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract translation: 提供一种绝缘陶瓷膏，陶瓷电子元件，以及陶瓷电子元件的制造方法，能够防止窄间距端子电极之间的焊料短路，并抑制覆盖一部分端子电极的绝缘体的裂纹产生 点火步骤 陶瓷电子部件包括陶瓷多层基板，形成在陶瓷多层基板的表面上的端子电极和形成在陶瓷多层基板的表面上以覆盖一部分端子电极的绝缘陶瓷膜。 绝缘陶瓷膜的暴露表面部分（富含凝胶层的层）的热膨胀系数低于陶瓷多层基板的热膨胀系数。

公开(公告)号：US09210807B2

公开(公告)日：2015-12-08

申请号：US14084038

申请日：2013-11-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei Imafuji ,  Jun Yoshiike

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/11 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0373 ,  H05K2201/0769 ,  H05K2201/099 ,  H05K2201/2072 ,  H05K2203/0594 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer.

Abstract translation: 布线基板包括：具有第一表面的连接垫; 保护绝缘层，形成在连接焊盘的第一表面上并且在其中具有开口部分，其中连接焊盘的第一表面的一部分从开口部露出; 具有面向连接焊盘的第一表面的下表面的金属层和与下表面相对的上表面，并且形成在从开口部暴露的连接焊盘的第一表面上，金属层包括凸起部分， 从金属层的上表面在其周边部分向上延伸; 以及形成在金属层的上表面上的凸块电极。

公开(公告)号：US09173281B2

公开(公告)日：2015-10-27

申请号：US13944715

申请日：2013-07-17

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Hee Kim ,  Sang Don Jung ,  Nam Seob Baek ,  Gookhwa Kim

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/02 ,  H05K3/10 ,  H05K3/4007 ,  H05K2201/0257 ,  H05K2201/099

Abstract: Provide are an electrode sensor and a method of fabricating the same. the method may include providing a substrate with a first electrode, forming a resist layer on the substrate to cover the first electrode, patterning the resist layer to expose a portion of the first electrode, forming an insulating layer on the substrate, removing the insulating layer on the resist layer and the resist layer to form a well in the insulating layer, and forming a second electrode in the well to be electrically connected to the first electrode. According to the method, it is possible to prevent the first electrode from being damaged. In addition, the second electrode may be configured have an increased surface area, and thus, the electrode can have low impedance.

Abstract translation: 提供电极传感器及其制造方法。 该方法可以包括提供具有第一电极的衬底，在衬底上形成抗蚀剂层以覆盖第一电极，图案化抗蚀剂层以暴露第一电极的一部分，在衬底上形成绝缘层，去除绝缘层 在所述抗蚀剂层和所述抗蚀剂层上，在所述绝缘层中形成阱，以及在所述阱中形成电连接到所述第一电极的第二电极。 根据该方法，可以防止第一电极被损坏。 此外，第二电极可以被配置为具有增加的表面积，因此电极可以具有低阻抗。

公开(公告)号：US09137886B2

公开(公告)日：2015-09-15

申请号：US13739330

申请日：2013-01-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Uk Lee ,  Tae Seong Kim ,  Young Gon Kim ,  Seung Hyun Noh

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/34 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/02 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/00 ,  H05K3/0097 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3463 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/049 ,  H05K2203/1536 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a printed circuit board which includes: a solder pad on which a solder ball is mounted; an insulator formed on the solder pad; and a protrusion formed under the insulator to support the solder ball when mounting the solder ball and can stably mount the solder ball.

Abstract translation: 印刷电路板技术领域本发明涉及一种印刷电路板，其包括：焊接焊盘，焊锡球安装在该焊盘上; 形成在焊盘上的绝缘体; 以及形成在所述绝缘体下方的突起，以在安装所述焊球时支撑所述焊球，并且能够稳定地安装所述焊球。

公开(公告)号：US20150208503A1

公开(公告)日：2015-07-23

申请号：US14570290

申请日：2014-12-15

Applicant: FUJITSU LIMITED

Inventor： Shotaro Hamao ,  Yoshiaki Tamura ,  Toshiki KUROSAWA

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0391 ,  H05K2201/09381 ,  H05K2201/099 ,  Y02P70/611

Abstract: A printed wiring board having a land for surface-mounting of an electronic component, includes the land having a pair of land pieces arranged in an opposing manner, and each of the land pieces including a plurality of land portions having widths different from each other, and a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions.

Abstract translation: 具有用于表面安装电子部件的焊盘的印刷电路板包括具有相对布置的一对焊盘的焊盘，并且每个焊盘包括具有彼此不同的宽度的多个焊盘部分， 以及耦合部，其部分地耦合在一对相邻的所述陆部之​​间的边界部分。

公开(公告)号：US09084372B2

公开(公告)日：2015-07-14

申请号：US13749070

申请日：2013-01-24

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Shigetsugu Muramatsu ,  Hiroshi Shimizu ,  Yasuyoshi Horikawa

IPC: H05K7/00 ,  F21V7/00 ,  C25D5/02 ,  H05K7/20 ,  H05K3/46 ,  F21K99/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/34

CPC classification number: H05K7/2039 ,  F21K9/90 ,  F21V7/00 ,  H01L2224/16225 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/3452 ,  H05K3/46 ,  H05K2201/0191 ,  H05K2201/09409 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.

Abstract translation: 提供了布线基板。 布线基板包括：散热器; 散热器上的绝缘层; 绝缘层上的第一和第二布线图案以一定间隔彼此分离; 第一反射层，包括在绝缘层上的第一开口，以覆盖第一和第二布线图案，其中第一和第二布线图案的一部分从第一开口露出，并且其中第一和第二布线的部分 图案被定义为要安装发光元件的安装区域; 以及在绝缘层上的第二反射层，其中第二反射层介于第一和第二布线图案之间。 第二反射层的厚度小于第一反射层的厚度。

公开(公告)号：US20150195913A1

公开(公告)日：2015-07-09

申请号：US14321068

申请日：2014-07-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Gi CHO

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/144 ,  H05K3/28 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1327

Abstract: There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a substrate. The electronic component module according to an exemplary embodiment of the present disclosure includes a first substrate having one surface on which at least one electronic component is mounted; and a second substrate bonded to one surface of the first substrate and including at least one component accommodating part in which the at least one electronic component is accommodated, wherein the second substrate includes a core layer, and metal wiring layers formed on both surfaces of the core layer and having a plurality of electrode pads.

Abstract translation: 提供了一种能够通过将电子部件安装在基板的两个表面上而增加集成度的电子部件模块。 根据本公开的示例性实施例的电子部件模块包括具有一个表面的第一基板，至少一个电子元件安装在该表面上; 以及第二基板，其接合到所述第一基板的一个表面并且包括容纳所述至少一个电子部件的至少一个部件容纳部，其中所述第二基板包括芯层，以及形成在所述第二基板的两个表面上的金属布线层 并具有多个电极焊盘。