公开(公告)号：US3718842A

公开(公告)日：1973-02-27

申请号：US3718842D

申请日：1972-04-21

Applicant: TEXAS INSTRUMENTS INC

Inventor： ABBOTT C ,  REILLY J

IPC: G02F1/13 ,  G04G17/04 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: G02F1/133308 ,  G02F1/13452 ,  G04G17/045 ,  H05K1/147 ,  H05K1/18 ,  H05K3/301 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10136 ,  H05K2201/10174 ,  H05K2201/10515 ,  H05K2201/10689

Abstract: A LIQUID CRYSTAL DISPLAY MOUNTING STRUCTURE WHEREIN THE ELECTRICAL CONTACTS ON THE BACK SIDE OF A LIQUID CRYSTAL DISPLAY PANEL ARE HELD IN PRESSURE CONTACT WITH A FLAT FLEXIBLE CABLE WHICH PROVIDES ELECTRICAL CONNECTION TO A MATRIX OF DIODES WITHIN A PAIR OF DIODE BOATS OR HOLDERS; INTERCONNECTIONS BETWEEN THE DIODES AND OTHER CIRCUITS ARE PREVIDED BY ETCHED CIRCUIT BOARDS.

公开(公告)号：US3198718A

公开(公告)日：1965-08-03

申请号：US10310461

申请日：1961-04-14

Applicant: LOCKHEED AIRCRAFT CORP

Inventor： QUINN ROSS A

IPC: H01C1/16 ,  H01C7/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01C7/00 ,  H01C1/16 ,  H05K1/167 ,  H05K1/182 ,  H05K3/4046 ,  H05K3/4076 ,  H05K2201/0317 ,  H05K2201/09981 ,  H05K2201/10174 ,  H05K2201/10651 ,  H05K2203/0315

公开(公告)号：US20240364291A1

公开(公告)日：2024-10-31

申请号：US18641783

申请日：2024-04-22

Applicant: TDK Corporation

Inventor： Toshiyuki ABE ,  Ichiro YAGINUMA ,  Kazutoshi TSUYUTANI ,  Takuya SHIMAMURA

IPC: H03H7/01 ,  H01R12/58 ,  H01R12/75 ,  H01R13/66 ,  H01R13/7197 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18

CPC classification number: H03H7/01 ,  H01R13/7197 ,  H05K1/117 ,  H05K1/165 ,  H05K1/185 ,  H01R12/58 ,  H01R12/75 ,  H01R13/6666 ,  H05K2201/09181 ,  H05K2201/10174 ,  H05K2201/10189

Abstract: Disclosed herein is a circuit board that includes: a plurality of insulating layers, a common mode filter and an electronic component embedded in the insulating layers, and first to fifth outer electrodes. The first coil pattern of the common mode filter is connected between the first and second outer electrodes. The second coil pattern of the common mode filter is connected between the third and fourth outer electrodes. The electronic component is connected between the first and second outer electrodes and the fifth outer electrode. The electronic component is arranged so as not to overlap the first coil pattern and the second coil pattern.

公开(公告)号：US12046941B2

公开(公告)日：2024-07-23

申请号：US18107821

申请日：2023-02-09

Applicant: JAPAN TOBACCO INC.

Inventor： Takeshi Akao

IPC: H02J7/00 ,  A24F40/40 ,  A24F40/50 ,  A24F40/51 ,  A24F40/53 ,  A24F40/60 ,  A24F40/90 ,  A24F40/95 ,  A61M15/00 ,  G05F3/18 ,  H01M10/42 ,  H01M10/48 ,  H02J7/04 ,  H05K1/14 ,  H05K1/18 ,  A24F40/30 ,  A61M15/06

CPC classification number: H02J7/0068 ,  A24F40/40 ,  A24F40/50 ,  A24F40/51 ,  A24F40/53 ,  A24F40/60 ,  A24F40/90 ,  A24F40/95 ,  A61M15/009 ,  G05F3/18 ,  H01M10/425 ,  H01M10/48 ,  H02J7/0042 ,  H02J7/0045 ,  H02J7/005 ,  H02J7/0063 ,  H02J7/007 ,  H02J7/007194 ,  H02J7/04 ,  H05K1/14 ,  H05K1/181 ,  A24F40/30 ,  A61M15/0003 ,  A61M15/06 ,  A61M2205/3653 ,  A61M2205/50 ,  A61M2205/8206 ,  A61M2205/8237 ,  A61M2205/8243 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10174

Abstract: A power supply unit includes: a power supply configured to discharge power to a load for generating an aerosol from an aerosol generation source; a charger configured to convert inputted power into charging power; a temperature measuring unit configured to measure a temperature of the power supply; and a charging controller configured to perform a first control for stopping the charger from supplying the charging power to the power supply and a second control for causing the charger to supply the charging power to the power supply, the charging controller setting a duty ratio to a value greater than 0 and smaller than 100 in a case where the temperature of the power supply is within a predetermined range, and the duty ratio being obtained by dividing a time during which the charging controller performs the first control by a unit time.

公开(公告)号：US20240170472A1

公开(公告)日：2024-05-23

申请号：US18551305

申请日：2022-03-17

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Akira HARAGUCHI

IPC: H01L25/18 ,  H05K1/18 ,  H05K7/20

CPC classification number: H01L25/18 ,  H05K1/18 ,  H05K7/20418 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272 ,  H05K2201/10522

Abstract: A first heat dissipation member is thermally connected to a first busbar. A second heat dissipation member is thermally connected to a second busbar. The first busbar and the second busbar respectively have a first facing part and a second facing part that face each other. The first facing part has a first surface on which a first electronic component is mounted and a second surface opposite to the first surface. The second facing part has a third surface that faces the second surface and a fourth surface that is positioned opposite to the third surface and on which a second electronic component is mounted. A circuit board has a wiring board that is positioned behind the first facing part and is positioned in front of the second facing part when the second facing part side is seen from the first facing part side.

公开(公告)号：US11776875B2

公开(公告)日：2023-10-03

申请号：US17166241

申请日：2021-02-03

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. ,  Toyota Jidosha Kabushiki Kaisha

Inventor： Feng Zhou ,  Shohei Nagai ,  Hiroshi Ukegawa

IPC: H01L23/427 ,  H05K1/02 ,  H01L25/07 ,  H01L25/00 ,  H05K3/00 ,  H05K1/18 ,  H05K7/20

CPC classification number: H01L23/427 ,  H01L25/072 ,  H01L25/50 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/0044 ,  H05K7/20936 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

公开(公告)号：US20230309233A1

公开(公告)日：2023-09-28

申请号：US17842709

申请日：2022-06-16

Applicant: Kioxia Corporation

Inventor： Satoru FUKUCHI

IPC: H05K1/18 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01L23/49827 ,  H01L25/16 ,  H01L25/162 ,  H01L23/49838 ,  H05K1/113 ,  H05K2201/10378 ,  H05K2201/10174 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/09518 ,  H05K2201/09481 ,  H05K2201/10734

Abstract: An electronic device according to an embodiment includes first and second substrates, first and second conductors, and an electronic component. The first substrate includes a first connector portion, first pad portions, and a first transmission line. The first pad portions include a second pad portion, the first transmission line coupling the second pad portion and the first connector portion. The second substrate includes third pad portions. The third pad portions include a fourth pad portion and a fifth pad portion. The first conductor is coupled to the fourth pad portion and to the second pad portion. The second conductor is coupled to the fifth pad portion. The first electronic component has one end coupled to the first conductor and other end coupled to the second conductor.

公开(公告)号：US11742255B2

公开(公告)日：2023-08-29

申请号：US17128748

申请日：2020-12-21

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/367 ,  H01L31/0203 ,  H01L31/024 ,  H01L23/051 ,  H01L23/043 ,  H01L31/0232 ,  H01L21/48 ,  H01L23/373 ,  H01S5/024 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64

CPC classification number: H01L23/3672 ,  H01L21/4803 ,  H01L21/4882 ,  H01L23/043 ,  H01L23/051 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/0203 ,  H01L31/02325 ,  H01S5/02469 ,  H01L31/024 ,  H01L31/02327 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

公开(公告)号：US11721608B2

公开(公告)日：2023-08-08

申请号：US17165253

申请日：2021-02-02

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Shailesh N. Joshi ,  Ercan Mehmet Dede

IPC: H01L23/427 ,  H05K1/18 ,  H01L23/46 ,  H01L23/36 ,  H01L23/367 ,  H01L23/473

CPC classification number: H01L23/427 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/46 ,  H01L23/473 ,  H05K1/183 ,  H05K2201/1056 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10515

Abstract: A power electronics assembly includes a vapor chamber and a heat-generating device. The vapor chamber includes a housing defining an evaporator side and a condenser side and a pedestal integrally formed with an extending from the evaporator side, the pedestal comprising a non-rectangular shape corresponding to a thermal management objective. The heat-generating device is coupled to the pedestal.

公开(公告)号：US11711896B2

公开(公告)日：2023-07-25

申请号：US17111486

申请日：2020-12-03

Applicant: InnoLux Corporation

Inventor： Chun-Hsien Lin

IPC: H01L33/24 ,  H05K3/30 ,  H05K1/18 ,  H01L25/075 ,  H01L33/00

CPC classification number: H05K3/303 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/24 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: An electronic device is provided, the electronic device includes a driving substrate, the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, a plurality of disc-shaped light-emitting units, at least one disc-shaped light-emitting unit is disposed in at least one circular groove, and the at least one disc-shaped light-emitting unit includes an alignment element positioned on a top surface of the at least one disc-shaped light-emitting unit, a diameter of the at least one disc-shaped light-emitting unit is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the at least one disc-shaped light-emitting unit and the at least one rectangular groove satisfy the condition of (R+r)/2>(w2+H2)1/2.